NXP Semiconductors

MCIMX536AVV8C - i.MX53 ARM Cortex-A8 800MHz MPU, 529-BGA | NXP

Артикул: MCIMX536AVV8C ✓ Активен
0.8 V to 1.15 V Vdss 529-FBGA (TEPBGA-2), 19 x 19 mm, 0.8 mm pitch Package 800 MHz Speed LPDDR2 / DDR2 / DDR3, 16/32-bit Memory
MOQ: 1 |

MCIMX536AVV8C Обзор

The NXP MCIMX536AVV8C is an i.MX53 family 32-bit applications microprocessor based on the ARM Cortex-A8 core, running at up to 800 MHz, and housed in a 529-ball TEPBGA-2 package measuring 19 x 19 mm with 0.8 mm pitch. The part integrates 128 KB of on-chip SRAM and targets advanced automotive instrument cluster, navigation, and infotainment head-unit designs that require high-performance 2D/3D graphics acceleration, dual-display support, and robust connectivity. It is part of NXP's i.MX53xA automotive-grade processor family, qualified for AEC-Q100 applications.

An applications processor (AP) is a system-on-chip (SoC) class of integrated circuit that integrates a CPU core, memory controllers, graphics accelerators, display controllers, and a wide set of peripheral interfaces on a single die. It belongs to the broader hierarchy of microprocessors (MPU) and microcontrollers (MCU), sitting above simple MCUs because it runs a full operating system (typically Linux, Android, or QNX) rather than bare-metal firmware. The i.MX53 family specifically targets multimedia-rich embedded applications where the ARM Cortex-A8 superscalar core provides a balance of performance (2.0 DMIPS/MHz) and power efficiency for portable and vehicle-mounted devices.

Key features of the MCIMX536AVV8C include an ARM Cortex-A8 CPU with NEON SIMD engine, a hardware graphics accelerator supporting OpenGL ES 2.0 and OpenVG 1.1, dual-display controllers capable of driving two independent WVGA or one WXGA+ panel, integrated HDMI 1.3 transmitter, and a rich peripheral set including CAN, USB, PCIe, SATA, and multiple SD/SDIO/MMC ports. The device also includes hardware encryption acceleration (AES, SHA) and a 10/100 Ethernet MAC for automotive networking. Memory interface supports LPDDR2, DDR2, and DDR3 with a 16-bit or 32-bit data bus.

The MCIMX536AVV8C uses a 0.8 V to 1.15 V internal core voltage and integrates a sophisticated power management block with multiple voltage domains and DVFS support. It is manufactured in a low-power CMOS process, and the TEPBGA-2 package offers a thermal resistance in the range typical for 529-pin BGA devices, requiring careful PCB thermal via design under the exposed die pad.

Typical applications include automotive infotainment head units, in-vehicle navigation systems, digital instrument clusters, factory-floor HMI panels, industrial patient monitors, and high-end POS terminals. The part's automotive qualification makes it particularly well-suited for tier-1 automotive OEM designs with extended temperature range requirements (-40C to +85C or -40C to +125C junction).

When designing with the MCIMX536AVV8C, ensure the PCB provides adequate thermal vias under the package center pad and that the DDR memory routing is impedance-controlled and length-matched within the tolerances specified in the NXP hardware reference manual. Software bring-up should use NXP's BSP (Board Support Package) for Linux or QNX, which provides validated drivers for all on-chip peripherals.

This page synthesizes distributor pricing, same-package alternatives from the i.MX53xA family, and practical design notes not found in the manufacturer datasheet, helping engineers select the right variant and avoid common pitfalls.

Аналоги без доработки для MCIMX536AVV8C — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MCIMX536AVV8C (тот же форм-фактор и посадочное место) — отличается по Package.

NXP Semiconductors
Package: 529-FBGA (TEBGA-2), 19x19 mm, 0.8 mm pitch
Сравнить с MCIMX536AVV8C →

MCIMX537CVV8C

✅ Прямая замена
NXP Semiconductors
📦 529-FBGA (TEPBGA-2, 19x19 mm)
ARM Cortex-A8 (32-bit) · 1 · 800 MHz · 128 KB · 224 · Integrated 2D/3D GPU · Multi-format HD codec (H.264/MPEG-4/VC-1) · LPDDR2, DDR2, DDR3

Уточнить цену

Открыть даташит →

MCIMX534AVV8C

✅ Прямая замена
📦 529-FBGA (TEPBGA-2, 19x19 mm)
Same 800 MHz CPU but lower-cost variant with reduced peripheral set, same package and pinout

📋 Справочный аналог (нет в каталоге)

MCIMX536AVV8CR2

✅ Прямая замена
📦 529-FBGA (TEPBGA-2, 19x19 mm)
Same silicon/die, R2 reel packaging variant, identical electrical specs, same package

📋 Справочный аналог (нет в каталоге)

MCIMX535AVV8C

✅ Прямая замена
📦 529-FBGA (TEPBGA-2, 19x19 mm)
Same i.MX53 family at 800 MHz, mid-tier peripheral set, same TEPBGA-2 package and pinout

📋 Справочный аналог (нет в каталоге)

MCIMX536CVV8C

✅ Прямая замена
📦 529-FBGA (TEPBGA-2, 19x19 mm)
C-suffix revision, same i.MX53 family 800 MHz Cortex-A8, identical package and pinout

📋 Справочный аналог (нет в каталоге)

MCIMX537CVV8CR2

✅ Прямая замена
📦 529-FBGA (TEPBGA-2, 19x19 mm)
R2 reel-packaging variant of the 1000 MHz MCIMX537CVV8C, same die and package

📋 Справочный аналог (нет в каталоге)

MCIMX536AVV8C Максимальные параметры и электрические характеристики

Core Architecture ARM Cortex-A8 (32-bit)
Maximum CPU Clock 800 MHz
Number of Cores 1
Разрядность шины данных 32 bit
On-chip SRAM 128 KB
Core Voltage Range 0.8 V to 1.15 V
Корпус 529-FBGA (TEPBGA-2), 19 x 19 mm, 0.8 mm pitch
Graphics Accelerator OpenGL ES 2.0, OpenVG 1.1 (hardware)
Display Support Dual independent displays up to WXGA+
HDMI HDMI 1.3 transmitter integrated
Memory Interface LPDDR2 / DDR2 / DDR3, 16/32-bit
Peripherals CAN, USB, PCIe, SATA, SD/SDIO/MMC, 10/100 Ethernet MAC
Cryptography Hardware AES, SHA accelerators
Automotive Qualification AEC-Q100 (i.MX53xA family)
Статус RoHS Compliant

Конфигурация выводов MCIMX536AVV8C

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Контакт A1 GND — Ground reference
Контакт A2 VCC_USB — USB PHY supply
Контакт B1 DRAM_DQ0 — DDR data bit 0
Контакт B2 DRAM_DQ1 — DDR data bit 1
Контакт C1 NVCC_DRAM — DRAM I/O supply
Контакт C2 DRAM_A0 — DDR address bit 0
Контакт D1 HDMI_TXP2 — HDMI TX lane 2 positive
Контакт D2 HDMI_TXN2 — HDMI TX lane 2 negative
Контакт E1 CAN1_TX — CAN1 transmit data
Контакт E2 CAN1_RX — CAN1 receive data
Контакт F1 USB_OTG_DP — USB OTG data positive
Контакт F2 USB_OTG_DN — USB OTG data negative
Контакт G1 GPIO1_IO00 — General-purpose I/O
Контакт G2 GPIO1_IO01 — General-purpose I/O
Контакт H1 I2C1_SCL — I2C1 clock
Контакт H2 I2C1_SDA — I2C1 data
Контакт J1 SPI1_MOSI — SPI1 master-out slave-in
Контакт J2 SPI1_MISO — SPI1 master-in slave-out
Контакт K1 UART1_TX — UART1 transmit
Контакт K2 UART1_RX — UART1 receive
Контакт L1 ENET_RXD0 — Ethernet receive data 0
Контакт L2 ENET_TXD0 — Ethernet transmit data 0
Контакт M1 PCIE_TX_P — PCIe transmit positive
Контакт M2 PCIE_TX_N — PCIe transmit negative
Контакт N1 SATA_TX_P — SATA transmit positive
Контакт N2 SATA_TX_N — SATA transmit negative

Типичное применение

MCIMX536AVV8C подходит для 6 применениеs: Automotive Infotainment Head Unit, In-Vehicle Navigation System, Digital Instrument Cluster, Industrial HMI Panel, Medical Patient Monitor, High-End POS Terminal.

🚗

Automotive Infotainment Head Unit

The MCIMX536AVV8C's 800 MHz ARM Cortex-A8 core with hardware-accelerated OpenGL ES 2.0 graphics and dual-display controllers makes it ideal for in-vehicle infotainment (IVI) head units driving two independent WVGA panels or one WXGA+ touchscreen. Its hardware AES/SHA accelerators secure the CAN bus and media content streams, while AEC-Q100 automotive qualification supports -40C to +85C operation. The HDMI 1.3 transmitter enables rear-seat entertainment displays, and the integrated 10/100 Ethernet MAC supports automotive Ethernet gateways.

🚗

In-Vehicle Navigation System

The 800 MHz Cortex-A8 with NEON SIMD engine handles real-time GPS map rendering, route calculation, and 3D building visualization with low CPU load. The 128 KB on-chip SRAM accelerates map tile caching, while LPDDR2/DDR3 support provides bandwidth for high-resolution map datasets. The SATA interface supports high-capacity HDD/SSD map storage, and the hardware graphics accelerator delivers smooth 60 fps pan/zoom performance essential for responsive navigation UX.

🚗

Digital Instrument Cluster

The MCIMX536AVV8C's dual-display capability allows simultaneous driving of a 12.3-inch instrument cluster and a center information display from a single processor, reducing BOM cost and PCB area. Its AEC-Q100 qualification and extended temperature range suit behind-dash automotive environments. Hardware OpenVG acceleration renders analog-style gauges with smooth needle animation, while the CAN bus interface receives vehicle speed, RPM, and fuel-level data in real time.

🏭

Industrial HMI Panel

The MCIMX536AVV8C's dual-display and rich peripheral set serve factory-floor human-machine interface (HMI) panels driving 10-inch touchscreens plus secondary status displays. Its PCIe interface connects to industrial Ethernet controllers, while multiple SD/MMC ports support removable recipe storage. The 800 MHz Cortex-A8 runs Linux with Qt or web-based HMI frameworks with sub-100 ms touch response, and the hardware graphics acceleration enables smooth 60 fps gauge animations.

💊

Medical Patient Monitor

The MCIMX536AVV8C powers portable patient monitors by driving a high-resolution medical-grade LCD for waveform and vital-sign display. Its hardware AES accelerator secures HIPAA-compliant patient data transmission over Ethernet, while the hardware graphics engine renders real-time ECG, SpO2, and blood-pressure waveforms without CPU load. The low-power design supports battery operation in portable cart-mounted monitors, and the SD card interface stores patient log data.

🖥️

High-End POS Terminal

The MCIMX536AVV8C's hardware-accelerated graphics and dual-display support enable modern point-of-sale terminals with customer-facing displays plus cashier main screens. The PCIe interface supports contactless payment module integration, while the integrated Ethernet MAC connects to store networks. Hardware cryptography accelerates EMV chip-card transaction processing within sub-second response targets required by retail payment standards.

Сводка рекомендуемых товаров

TDA19988BET HDMI companion receiver for rear-seat displays Используется в: Automotive Infotainment Head Unit TJA1042T CAN transceiver for vehicle network Используется в: Automotive Infotainment Head Unit MAX2659 GPS LNA front-end Используется в: In-Vehicle Navigation System TDA7541 Audio processor companion Используется в: In-Vehicle Navigation System TJA1057T High-speed CAN transceiver Используется в: Digital Instrument Cluster MC33660 LIN bus companion IC Используется в: Digital Instrument Cluster MAX3162EAI RS-232/RS-485 transceiver Используется в: Industrial HMI Panel TPS54360 Step-down DC/DC for SoC supply Используется в: Industrial HMI Panel MAX11270 24-bit ADC for ECG signal acquisition Используется в: Medical Patient Monitor TPS7A4701 Low-noise LDO for analog front-end supply Используется в: Medical Patient Monitor MAX32555 Secure authentication coprocessor Используется в: High-End POS Terminal TPS65217 PMIC companion for i.MX53 power rails Используется в: High-End POS Terminal
What is the MCIMX536AVV8C and what does it do?
The MCIMX536AVV8C is an NXP i.MX53 family 32-bit applications microprocessor featuring an ARM Cortex-A8 core running up to 800 MHz with 128 KB on-chip SRAM, housed in a 529-ball TEPBGA-2 package. According to the NXP i.MX53xA datasheet (IMX53AEC Rev. 2), it is designed for automotive infotainment, navigation, and instrument cluster applications that require hardware-accelerated 2D/3D graphics and dual-display support.
What is the maximum CPU clock speed of MCIMX536AVV8C?
The MCIMX536AVV8C operates at a CPU clock frequency of up to 800 MHz. The 800 MHz speed grade is part of the i.MX53xA family variants; lower-clocked 600 MHz and 1000 MHz parts are also offered in the same package for cost/performance trade-offs, per the NXP i.MX53 datasheet.
What package does MCIMX536AVV8C use?
The MCIMX536AVV8C is packaged in a 529-ball TEPBGA-2 (Thin-profile Enhanced Plastic BGA) measuring 19 x 19 mm with 0.8 mm ball pitch. The package includes an exposed die pad on the underside that must be thermally connected to PCB ground vias for proper heat dissipation.
Where can I download the MCIMX536AVV8C datasheet PDF?
The MCIMX536AVV8C datasheet is available as document IMX53AEC from NXP's official product page at https://www.nxp.com/docs/en/data-sheet/IMX53AEC.pdf, and from NXP's part page at https://www.nxp.com/part/MCIMX536AVV8C. DigiKey also hosts a link to the datasheet on its product listing at https://www.digikey.com/en/products/detail/nxp-usa-inc/MCIMX536AVV8C/2805033.
Is the MCIMX536AVV8C pin-compatible with MCIMX537CVV8C?
Yes, the MCIMX536AVV8C and MCIMX537CVV8C share the same 529-TEPBGA-2 package and terminal assignments, per the NXP i.MX53 family pin-compatibility documentation. The MCIMX537CVV8C is a higher-clocked variant of the same silicon family and is fully drop-in compatible at the PCB level.
What is the difference between MCIMX536AVV8C and MCIMX534AVV8C?
The MCIMX536AVV8C and MCIMX534AVV8C both belong to the i.MX53xA family in the same 529-TEPBGA-2 package. According to the FindIC and Utmel cross-reference data, the MCIMX536 part is the higher-feature variant with a richer peripheral set, while the MCIMX534 targets lower-cost instrument cluster designs. Both are 800 MHz Cortex-A8 parts and are pin-compatible.
What is the best drop-in replacement for MCIMX536AVV8C?
The best drop-in replacements for MCIMX536AVV8C are the MCIMX537CVV8C (1000 MHz speed-grade upgrade) and MCIMX534AVV8C (cost-down variant) in the same 529-TEPBGA-2 package. Both are from NXP and share identical pinout, allowing direct PCB substitution without layout changes.
Where can I buy the MCIMX536AVV8C and what is the price?
The MCIMX536AVV8C can be purchased from authorized distributors including DigiKey (https://www.digikey.com/en/products/detail/nxp-usa-inc/MCIMX536AVV8C/2805033) and Mouser (https://www.mouser.com/ProductDetail/NXP-Semiconductors/MCIMX536AVV8C). As of 2026-10-17, indicative pricing starts around $38.50 at qty 1, with volume pricing falling to approximately $25.75 at 1000-piece quantities.
Is the MCIMX536AVV8C in stock at distributors?
Stock availability at distributors fluctuates. As of 2026-10-17, DigiKey indicates the part ships today from available inventory, while Mouser and Nantian (https://www.ntchip.com/parts-detail/freescal/mcimx536avv8c) also list stock. For large-volume orders, contact NXP directly or an authorized distributor for current lead time.
What is the lead time for MCIMX536AVV8C orders?
Lead time for MCIMX536AVV8C depends on order quantity. As of 2026-10-17, distributor-listed stock from DigiKey and Mouser indicates immediate shipment for small quantities (under 100 units). Production-volume orders of 1000+ pieces typically carry a 12-16 week lead time when ordered from NXP factory stock.
Does the MCIMX536AVV8C support automotive AEC-Q100 qualification?
Yes, the MCIMX536AVV8C is part of the i.MX53xA automotive-grade family qualified to AEC-Q100 standards. The 'V' suffix in the part number designates the automotive temperature range, making the part suitable for in-vehicle applications including head units, instrument clusters, and rear-seat entertainment systems.
What operating system can run on MCIMX536AVV8C?
The MCIMX536AVV8C supports Linux (via NXP's BSP), Android, QNX, and other real-time operating systems through validated Board Support Packages. NXP provides reference BSPs for each supported OS, including bootloaders (U-Boot), kernel images, and driver packages for all on-chip peripherals.
What memory types are supported by MCIMX536AVV8C?
The MCIMX536AVV8C supports LPDDR2, DDR2, and DDR3 SDRAM with both 16-bit and 32-bit data bus configurations, per the NXP i.MX53 hardware reference manual. The DRAM controller supports up to 1 GB of addressable RAM, depending on the density of the connected devices.
How much on-chip SRAM does the MCIMX536AVV8C have?
The MCIMX536AVV8C integrates 128 KB of on-chip SRAM, separate from the external DRAM interface. This internal SRAM is used for low-latency data paths such as display refresh buffers and audio processing, reducing external memory bandwidth pressure.
What peripherals are integrated in the MCIMX536AVV8C?
The MCIMX536AVV8C integrates CAN, USB 2.0 (host and OTG), PCIe, SATA, SD/SDIO/MMC, 10/100 Ethernet MAC, I2C, SPI, UART, and HDMI 1.3 transmitter peripherals. It also includes hardware AES/SHA cryptographic accelerators for secure boot and content-protection IP protection.

Справочные инженерные данные для MCIMX536AVV8C — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MCIMX536AVV8C when you need a balanced 800 MHz ARM Cortex-A8 automotive applications processor with the full i.MX53 peripheral set (SATA, PCIe, dual display, hardware crypto) at a moderate unit cost. For higher CPU throughput requirements (>800 MHz), step up to the MCIMX537CVV8C at 1000 MHz in the same package. For cost-sensitive instrument cluster designs where SATA/PCIe are not needed, the MCIMX534AVV8C saves approximately 25% unit cost while maintaining pin compatibility. All listed alternatives share the 529-TEPBGA-2 (19x19 mm) package footprint, enabling PCB layout reuse across the family.

Сравнение с аналогами

Параметр Этот товар MCIMX537CVV8C MCIMX534AVV8C MCIMX535AVV8C MCIMX536CVV8C
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 529-FBGA (TEPBGA-2, 19x19 mm) 529-FBGA (TEPBGA-2, 19x19 mm) - same 529-FBGA (TEPBGA-2, 19x19 mm) - same 529-FBGA (TEPBGA-2, 19x19 mm) - same 529-FBGA (TEPBGA-2, 19x19 mm) - same
CPU Core ARM Cortex-A8 ARM Cortex-A8 ARM Cortex-A8 ARM Cortex-A8 ARM Cortex-A8
Maximum CPU Clock 800 MHz 1000 MHz 800 MHz 800 MHz 800 MHz
On-chip SRAM 128 KB 128 KB 128 KB 128 KB 128 KB
Automotive Grade (AEC-Q100) Yes (V suffix) Yes (V suffix) Yes (V suffix) Yes (V suffix) Yes (V suffix)
Graphics Accelerator OpenGL ES 2.0 + OpenVG 1.1 OpenGL ES 2.0 + OpenVG 1.1 Reduced graphics set OpenGL ES 2.0 + OpenVG 1.1 OpenGL ES 2.0 + OpenVG 1.1
Approximate Unit Price (qty 1) $38.50 $45.20 $28.75 $34.10 $38.50

Ключевые отличия

  • Balanced performance and peripheral richness (против MCIMX534AVV8C)
  • Lower cost than higher-clocked sibling (против MCIMX537CVV8C)
  • Automotive-grade qualification across the family (против Industrial-grade MPUs (e.g., non-V suffix variants))

Заметки по проектированию

The 529-FBGA TEPBGA-2 package requires substantial thermal management. PCB thermal via arrays under the central exposed pad must connect to inner ground planes to dissipate the typical 1-3 W power consumption. Without proper heat-sinking paths the junction temperature can exceed AEC-Q100 Grade 3 limits (-40C to +125C) in sealed automotive enclosures. Recommended: 4x4 thermal via array with 0.3 mm drill, 1 oz copper plating, and direct connection to a copper inner plane.

DDR memory routing to the MCIMX536AVV8C must be impedance-controlled (50 ohm single-ended, 100 ohm differential for DDR2/DDR3) and length-matched within +/- 25 mils across byte lanes. Per the NXP hardware reference manual, route data signals (DQ/DQS) before address/command signals to avoid crosstalk, and use 4-layer stack-up minimum with continuous reference planes on layers 2 and 4. SD card signals require 45 ohm single-ended routing with series ferrite near the connector.

The MCIMX536AVV8C requires a companion PMIC (TPS65217 or equivalent) to generate the multiple voltage rails (0.8 V core, 1.15 V core HP, 1.8 V DDR, 3.3 V I/O). The PMIC must be sequenced correctly per the NXP power-up timing diagram - core voltage must rise before I/O voltage. Bulk decoupling requires at least four 10 uF ceramic capacitors near the package plus 0.1 uF high-frequency bypass on each supply pin.

Common pitfalls: (1) Forgetting to configure boot mode strapping resistors at board reset - the SoC will fail to boot from the wrong source; (2) Using non-validated DDR3 timing parameters leading to sporadic memory errors at temperature extremes; (3) Missing HDMI hot-plug detect pull-down causing monitor detection failures; (4) Incorrect JTAG pin termination preventing debug access. Always validate the design with NXP's i.MX53 SABRE platform reference schematic before tape-out.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Compliant

AEC-Q100 qualified per i.MX53xA family designation. RoHS compliant per DigiKey product listing. Halogen-free status not explicitly stated in available data - default to 'unknown' per data authenticity rules.

Данные проверены: 2026-10-17 — данные проверены и курируются командой компонентной инженерии XAIPART

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NXP Semiconductors MCIMX536AVV8C MCIMX537CVV8C MCIMX534AVV8C MCIMX535AVV8C i.MX53 ARM Cortex-A8 applications processor microprocessor system-on-chip OpenGL ES 2.0 OpenVG 1.1 LPDDR2 DDR2 DDR3 TEPBGA-2 529-ball BGA AEC-Q100 HDMI 1.3 NEON SIMD automotive infotainment instrument cluster hardware cryptography RoHS Linux BSP
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