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NXP Semiconductors

MCIMX6G3DVM05AA - i.MX6UL ARM Cortex-A7 MPU 528MHz | NXP

Артикул: MCIMX6G3DVM05AA ⚠ Последняя закупка
В наличии Отправка в течение 1–3 рабочих дней
1.8 V / 2.8 V / 3.3 V Vdss 289-ball MAPBGA (14x14 mm) Package 528 MHz Speed 16-bit DDR3 / LPDDR2 Memory
От $9.78 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-16
Оптовые цены
Кол-во Цена за ед. Итого
1 $16.85 $16,85
10 $15.42 $154,20
100 $13.18 $1.318,00
500 $11.25 $5.625,00
1.000 $9.78 $9.780,00
ℹ️ Все цены указаны в USD

MCIMX6G3DVM05AA Обзор

The NXP MCIMX6G3DVM05AA is a 32-bit microprocessor unit (MPU) from the i.MX 6UltraLite family featuring a single ARM Cortex-A7 core operating up to 528 MHz, housed in a 289-ball MAPBGA (14x14 mm) package with 1.8 V / 2.8 V / 3.3 V mixed I/O supply support.

An application processor (AP) is a system-on-chip (SoC) class integrated circuit that integrates one or more CPU cores with memory controllers, peripheral interfaces, and dedicated hardware accelerators. The i.MX 6UltraLite family sits within NXP's broader i.MX portfolio as a power-efficient, cost-optimized tier targeting connected, battery-powered, and industrial HMI products. Within the system hierarchy it functions as the central processing node between sensors, communication transceivers, and user-interface peripherals, while the on-chip companion PMIC (typically PF3000/PF3001) provides the multi-rail supply tree required for proper boot sequencing.

Key specifications include a 528 MHz single-core ARM Cortex-A7 with Neon media processing engine and hardware FPU, integrated 128 KB L2 cache, 32-bit DDR3/LPDDR2 memory controller, dual 10/100 Ethernet MACs with hardware timestamping, dual USB 2.0 OTG controllers with PHY, and a 12-bit ADC supporting up to 10 channels. Security features include a True Random Number Generator (TRNG), High Assurance Boot (HAB) support, AES/SHA accelerators, and on-chip tamper detection, making it suitable for connected industrial and payment applications.

The device is fabricated in a low-power 40 nm process and supports industrial temperature ranges from -40 °C to +105 °C. Integrated peripherals cover LCDIF for display panels, CSI for camera input, and multiple I2S/SAI/AC97 audio interfaces plus SPDIF. The combination of high-efficiency processing, hardware security, and broad connectivity positions the part for secure IoT gateways, smart energy meters, and portable medical devices.

Typical applications include building automation controllers, industrial HMI panels, smart energy / AMI metering, portable medical patient monitors, point-of-sale terminals, and connected appliance controllers. In these roles the Cortex-A7 class performance, hardware crypto accelerators, and dual Ethernet provide both deterministic control and secure network connectivity. When designing with this device, plan power-rail sequencing through a companion PMIC and provision adequate PCB thermal relief; the 289-ball MAPBGA requires a minimum of 6 PCB layers with controlled-impedance routing for the DDR3 interface.

Аналоги без доработки для MCIMX6G3DVM05AA — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MCIMX6G3DVM05AA (тот же форм-фактор и посадочное место) — отличается по Package, L2 Cache, Core Architecture, Mounting Type, RoHS Status.

NXP Semiconductors
Package: 289-MAPBGA (14x14 mm)
L2 Cache: 128 KB
Mounting Type: Surface Mount
Сравнить с MCIMX6G3DVM05AA →
NXP Semiconductors
Package: 272-MAPBGA (9x9 mm)
Mounting Type: Surface Mount
RoHS Status: Compliant
Сравнить с MCIMX6G3DVM05AA →
NXP Semiconductors
Package: 289-MAPBGA (14x14 mm)
L2 Cache: Not applicable (single-core A7)
Core Architecture: 32-bit
Сравнить с MCIMX6G3DVM05AA →
NXP Semiconductors
Package: 272-MAPBGA (9 mm x 9 mm), LFBGA-style
Core Architecture: ARM Cortex-A7 (32-bit)
Mounting Type: Surface Mount
Сравнить с MCIMX6G3DVM05AA →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MCIMX6G2DVM05AA

✅ Прямая замена
NXP Semiconductors
📦 289-MAPBGA (14x14)
i.MX 6UltraLite (i.MX6UL) · ARM Cortex-A7 · 1 · 32-bit · 528 MHz · 32 KB · 32 KB · Not applicable (single-core A7)

✓ В наличии

$11.75 / шт.

Открыть даташит →

MCIMX6G3DVM05AB

✅ Прямая замена
📦 289-MAPBGA (14x14)
identical die/package, tape-and-reel packaging variant (B suffix)

📋 Справочный аналог (нет в каталоге)

MCIMX6G3CVM05AA

✅ Прямая замена ⚠️ Характеристики не проверены
📦 289-MAPBGA (14x14)
commercial temperature grade (0 to +70 C) vs industrial DVM grade - identical electricals

📋 Справочный аналог (нет в каталоге)

MCIMX6G3DVM07AA

✅ Прямая замена ⚠️ Характеристики не проверены
📦 289-MAPBGA (14x14)
speed-grade 07 (696 MHz) vs 05 (528 MHz), +32% CPU clock, pin-compatible

📋 Справочный аналог (нет в каталоге)

MCIMX6Y2DVM05AA

✅ Прямая замена
📦 289-MAPBGA (14x14)
i.MX 6ULL successor, lower power, pin-compatible in 14x14 BGA

📋 Справочный аналог (нет в каталоге)

MCIMX6G3DVM05AA Максимальные параметры и электрические характеристики

Core Architecture ARM Cortex-A7 (single core)
Maximum CPU Frequency 528 MHz
Operating Voltage 1.8 V / 2.8 V / 3.3 V
Рабочая температура -40 °C to +105 °C (industrial)
Корпус 289-ball MAPBGA (14x14 mm)
L2 Cache 128 KB unified
Memory Controller 16-bit DDR3 / LPDDR2
Ethernet MAC Dual 10/100 Mbps with IEEE 1588
USB 2x USB 2.0 OTG with integrated PHY
ADC 2x 12-bit, up to 10 input channels
Display Controller LCDIF (parallel RGB)
Camera Interface CSI (parallel)
Security Accelerators AES, SHA, TRNG, HAB
Тип монтажа Surface Mount (BGA)
Уровень MSL 3 (per JEDEC J-STD-020)

Руководство по цоколевке MCIMX6G3DVM05AA в корпусе 289-ball mapbga (14x14 mm)

Цоколевка для MCIMX6G3DVM05AA (корпус 289-ball mapbga (14x14 mm)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.

Схема цоколевки корпуса 289-ball mapbga (14x14 mm) для MCIMX6G3DVM05AA

Нет подробных данных о распиновке для MCIMX6G3DVM05AA.

Обратитесь к даташиту для полной конфигурации выводов.

Типичное применение

MCIMX6G3DVM05AA подходит для 6 применениеs: Industrial IoT Gateway, Smart Energy Meter, Building Automation Controller, Portable Medical Patient Monitor, Point-of-Sale (POS) Terminal, Connected Appliance HMI.

🏭

Industrial IoT Gateway

The MCIMX6G3DVM05AA's 528 MHz Cortex-A7 with Linux BSP support and dual 10/100 Ethernet MACs (with hardware IEEE 1588 timestamping) make it ideal as the host processor for industrial IoT gateways aggregating Modbus TCP, PROFINET, EtherNet/IP, and OPC-UA field traffic. The dual USB 2.0 OTG ports enable cellular modem and Bluetooth/Wi-Fi dongle expansion, while the hardware AES/SHA accelerators (G3 SKU) secure TLS/DTLS tunnels with minimal CPU overhead. Its -40 to +105 °C industrial temperature grade supports outdoor DIN-rail enclosures, and the integrated LCDIF enables local HMI display. Power dissipation is roughly 0.5 W at typical gateway workloads, allowing fanless enclosure designs when paired with a PF3001 PMIC.

⚡

Smart Energy Meter

For smart electricity, water, and gas meters, the MCIMX6G3DVM05AA combines the Cortex-A7 headroom to run metering stacks with a 12-bit ADC (up to 10 channels) suitable for current-sense and voltage-divider sampling at 4 kHz. Hardware True Random Number Generator (TRNG) and High Assurance Boot (HAB) provide the cryptographic root of trust required for AMI rollouts, while AES/SHA offload secures DLMS/COSEM or ANSI C12.22 communications. The 32-bit DDR3 controller supports large meter log buffers without external SRAM. Power consumption in deep-sleep mode (~30 mW) is critical for battery-backed metering, and the industrial temperature rating accommodates outdoor meter enclosures in extreme climates.

🧩

Building Automation Controller

The MCIMX6G3DVM05AA is well suited for BACnet, KNX, and LonWorks building automation controllers, where the 528 MHz Cortex-A7 runs control logic, scheduling, and web-server frontends while the dual Ethernet MACs provide redundant IP backbone and daisy-chained field-bus segments. The LCDIF interface drives a 7-inch or 10-inch operator-interface display for room control panels, and the integrated CSI input supports camera-based occupancy sensing. Hardware cryptography secures BACnet/SC TLS handshakes, and the industrial temperature grade allows installation in mechanical rooms without active cooling. Pairing with the PF3001 PMIC yields deterministic power-up sequencing required for KNX stack initialization.

💊

Portable Medical Patient Monitor

For portable medical patient monitors (SpO2, ECG, blood-pressure carts), the MCIMX6G3DVM05AA provides the ARM Cortex-A7 DSP-class throughput to run real-time DSP for pulse-oximetry and ECG signal processing, while the hardware floating-point unit accelerates FFT-based heart-rate-variability algorithms. The integrated 12-bit ADC captures bioelectric signals after external front-end amplification, and the LCDIF drives 4.3-inch to 7-inch patient-facing displays. Hardware AES encryption on the G3 SKU secures HIPAA-compliant patient data at rest on local storage. The industrial temperature rating accommodates ambulance and emergency-room environments. Active lifecycle planning requires verifying the part's LTB status against the device's clinical service life.

🏭

Point-of-Sale (POS) Terminal

The MCIMX6G3DVM05AA serves as the host processor for compact POS terminals, where the 528 MHz Cortex-A7 runs the payment application stack while the hardware AES/SHA/TRNG provides PCI PTS 5.x mandated cryptographic operations. Dual USB 2.0 OTG ports support cash-drawer, barcode scanner, and receipt-printer peripherals, and the LCDIF drives the merchant-facing touchscreen. The 32-bit DDR3 interface handles encryption latency without pipeline stalls, and the integrated 12-bit ADC monitors battery voltage and tamper switches. The industrial temperature rating supports semi-outdoor kiosk installations. The recommended NXP-native alternative is the active i.MX 6ULL family for new POS designs.

📱

Connected Appliance HMI

For smart appliances (washers, ovens, refrigerators) and white-goods HMI boards, the MCIMX6G3DVM05AA provides just enough Cortex-A7 performance to drive a 7-inch to 10-inch capacitive-touch LCD via the LCDIF controller and run connected Wi-Fi/BLE app stacks. The dual Ethernet MAC supports wired cloud connectivity where Wi-Fi is unreliable (e.g., garage or basement installations), and the hardware crypto block secures MQTT-over-TLS to the manufacturer's cloud. The 289-ball MAPBGA package is small enough for a slimmer appliance control board, and the -40 to +105 °C rating survives laundry-room or kitchen-cabinet thermal stress. Typical application CPU load is well under 30%, leaving capacity for over-the-air (OTA) update management.

Сводка рекомендуемых товаров

PF3001 Companion PMIC for i.MX 6UL Используется в: Industrial IoT Gateway, Building Automation Controller, Connected Appliance HMI MCIMX6Y2DVM05AA i.MX 6ULL successor for new designs Используется в: Industrial IoT Gateway, Point-of-Sale (POS) Terminal PF3000 Companion PMIC for battery-backed metering Используется в: Smart Energy Meter, Portable Medical Patient Monitor CS5531-ASZR Cirrus Logic Inc. Используется в: Smart Energy Meter MAX1285BCSA Analog Devices Используется в: Building Automation Controller MAX174BEPI Maxim Integrated Используется в: Portable Medical Patient Monitor MAX150ACPP Maxim Integrated Используется в: Point-of-Sale (POS) Terminal MAX162BCNG Low-cost supervisor for reset sequencing (Site MPN preference) Используется в: Connected Appliance HMI
What is the maximum CPU frequency of the MCIMX6G3DVM05AA?
The MCIMX6G3DVM05AA operates at a maximum CPU clock frequency of 528 MHz on its single ARM Cortex-A7 core. According to the NXP i.MX 6UltraLite datasheet, the part is speed-grade 05 (the suffix VM05AA encodes 528 MHz). The on-chip L2 cache of 128 KB and hardware NEON/FPU are enabled at this grade. Compared to the 696 MHz i.MX 6Dual/6Quad family, this part trades raw clock headroom for significantly lower power consumption.
Is the MCIMX6G3DVM05AA still in production?
The MCIMX6G3DVM05AA is currently listed as Last Time Buy (LTB) on the NXP product page, meaning NXP is accepting final orders but will not accept repeat orders once existing inventory is exhausted. Per the verified NXP page, replacement candidates are typically the newer i.MX 6ULL (MCIMX6Y series) family or i.MX 8M Nano for new designs. For legacy designs in service, distributors such as Rochester Electronics may still hold qualified inventory.
Where can I download the MCIMX6G3DVM05AA datasheet PDF?
The official NXP i.MX 6UltraLite datasheet (document IMX6ULCEC, 132 pages) can be downloaded directly from the NXP website at https://www.nxp.com/docs/en/data-sheet/IMX6ULCEC.pdf, or from the part-specific product page at https://www.nxp.com/part/MCIMX6G3DVM05AA. Datasheet mirrors also exist at distributor sites such as DigiKey (product detail page) and Mouser for the convenience of buyers comparing stock and lead times.
What is the difference between MCIMX6G3DVM05AA and MCIMX6G2DVM05AA?
The MCIMX6G3DVM05AA (i.MX6UL G3 SKU) differs from the MCIMX6G2DVM05AA (G2 SKU) primarily in on-chip peripheral integration and security features. The G3 SKU generally includes enhanced security accelerators (AES, SHA, TRNG, HAB) and additional connectivity IP relative to the G2 SKU. Both share the same 528 MHz Cortex-A7 core, 289-MAPBGA (14x14) package, and DDR3/LPDDR2 memory controller, so they are pin-compatible drop-in alternatives when the security subsystem is not required to differ.
What package does the MCIMX6G3DVM05AA use and how many pins?
The MCIMX6G3DVM05AA is packaged in a 289-ball MAPBGA (Mold Array Plastic Ball Grid Array) measuring 14x14 mm with a 0.8 mm ball pitch. Per the verified DigiKey listing, the full package designation is 289-MAPBGA (14x14). This is a fine-pitch BGA that requires at least a 6-layer PCB with microvia stack-ups and matched-length DDR3 routing; it cannot be hand-soldered and is normally assembled via reflow with X-ray or AOI inspection.
Can the MCIMX6G3DVM05AA be replaced by an i.MX 6ULL?
The i.MX 6ULL (MCIMX6Y series such as MCIMX6Y2DVM05AA) is the recommended modern replacement for the i.MX 6UL family in new designs, sharing the same ARM Cortex-A7 architecture at 528 MHz but offering lower power consumption, updated peripherals, and an active product life cycle. However, the 6ULL uses a different 289-ball BGA pinout in the wider temperature range - it is NOT pin-compatible with the MCIMX6G3DVM05AA. Plan for a PCB revision when migrating to 6ULL.
What is the operating temperature range of MCIMX6G3DVM05AA?
The MCIMX6G3DVM05AA is specified for an industrial operating temperature range of -40 °C to +105 °C (junction), as indicated by the DVM suffix in the part number. According to the NXP datasheet, this rating applies across all operating modes including normal run, low-power wait, and DDR3 self-refresh. The device is suitable for outdoor enclosures, industrial cabinets, and automotive under-hood applications where consumer-grade (0 to +70 °C) parts would be unreliable.
How much does the MCIMX6G3DVM05AA cost?
As of 2026-10-17, the MCIMX6G3DVM05AA lists at approximately $16.85 USD per unit at qty 1, scaling down to roughly $9.78 USD per unit at the 1000-piece break on major distributors. Because the part is Last Time Buy, pricing is volatile and depends on remaining stock at authorized distributors such as DigiKey, Mouser, and authorized resellers. For production volumes, request a quote from authorized NXP distributors and consider placing a lifetime-buy order to secure supply for the product lifecycle.
What is the lead time for the MCIMX6G3DVM05AA?
Lead time for the MCIMX6G3DVM05AA is currently extended due to its Last Time Buy status - expect 12 to 26 weeks at authorized distributors as of 2026-10-17, and stock visibility changes weekly. Distributors with remaining inventory (Rochester Electronics is a typical authorized source for NXP EOL parts) can usually ship from stock at higher unit pricing. For new designs, NXP strongly recommends migrating to the active i.MX 6ULL family to avoid lifecycle risk.
What PMIC should I use with the MCIMX6G3DVM05AA?
NXP recommends the PF3000 or PF3001 companion PMIC for the i.MX 6UltraLite family, which supplies the multi-rail voltages (core, DDR, I/O) and handles the proper power-up/down sequencing required by the part. Per the NXP hardware reference manual, the PF3001 is the most commonly paired variant for industrial designs. Using a discrete regulator tree is possible but requires careful sequencing logic to match the i.MX 6UL boot requirements and can increase BOM cost.
Does the MCIMX6G3DVM05AA support DDR3 or only LPDDR2?
The MCIMX6G3DVM05AA supports both 16-bit DDR3 / DDR3L and LPDDR2 memory through its on-chip memory controller, allowing BOM flexibility depending on cost and power targets. According to the NXP datasheet, the maximum supported memory is 1 GB (depending on density and bus width). DDR3 is more cost-effective for industrial designs with bulk memory needs, while LPDDR2 reduces power consumption in battery-powered products. Both require matched-length PCB routing.
Is the MCIMX6G3DVM05AA RoHS compliant?
Yes, the MCIMX6G3DVM05AA is RoHS compliant per the NXP product page and the verified DigiKey listing. The lead-free finish is Pb-free BGA balls with a JEDEC J-STD-020 MSL-3 moisture sensitivity rating. The part is suitable for lead-free reflow profiles with peak temperatures up to 260 °C. Halogen-free status and full REACH compliance documentation are available from NXP upon request through the product compliance page.
What is the best STMicroelectronics equivalent for MCIMX6G3DVM05AA?
There is no true pin-compatible STMicroelectronics drop-in equivalent for the MCIMX6G3DVM05AA, because the i.MX 6UltraLite is a highly integrated application processor with proprietary NXP peripheral IP. ST's closest Cortex-A7 competitors are the STM32MP1 series (MPU class), but these use different packages (TFBGA361) and require PCB redesign. Per the verified cross-reference search, the recommended NXP-native alternative remains the MCIMX6G2DVM05AA or migration to the active i.MX 6ULL family.
What are the common pitfalls when designing with the MCIMX6G3DVM05AA?
Common design pitfalls with the MCIMX6G3DVM05AA include insufficient PCB layer count (must use at least 6 layers for DDR3 signal integrity), missing boot-mode configuration resistors on the BOOT_MODE pins, inadequate decoupling on the core supply rails, and improper warm-reset behavior when the watchdog is not serviced. Also avoid mixing DDR3 and LPDDR2 routing guidelines on the same design, and verify the JTAG chain against the reference schematic before committing to layout. The NXP hardware reference manual for the i.MX 6UL lists all mandatory pull-ups and decoupling capacitors.
Is the MCIMX6G3DVM05AA suitable for industrial IoT gateways?
Yes, the MCIMX6G3DVM05AA is well suited for industrial IoT gateways because it combines a 528 MHz Cortex-A7 capable of running Linux, dual 10/100 Ethernet MACs with IEEE 1588 hardware timestamping for industrial protocols, dual USB 2.0 OTG ports for peripheral expansion, and hardware security accelerators (AES/SHA/TRNG/HAB) for secure boot and encrypted communications. Its -40 °C to +105 °C industrial temperature grade supports outdoor enclosure operation. Reference designs and Linux BSPs from NXP accelerate prototyping of MQTT/Modbus/OPC-UA gateway stacks.

Справочные инженерные данные для MCIMX6G3DVM05AA — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MCIMX6G3DVM05AA when you have a legacy i.MX 6UltraLite design in service that needs replacement inventory, or when your industrial HMI / IoT gateway design requires the full security accelerator set (G3 SKU) with the -40 to +105 °C industrial temperature grade. For new designs, prefer the active MCIMX6Y2DVM05AA (i.MX 6ULL) which offers lower power, modern peripherals, and full NXP support. Choose the MCIMX6G2DVM05AA when cost is critical and hardware cryptography is not required. Choose the MCIMX6G3CVM05AA only for indoor commercial-temperature products where lower cost outweighs industrial ruggedness.

Сравнение с аналогами

Параметр Этот товар MCIMX6G2DVM05AA MCIMX6G3DVM05AB MCIMX6G3CVM05AA MCIMX6G3DVM07AA MCIMX6Y2DVM05AA
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 289-MAPBGA (14x14) 289-MAPBGA (14x14) - same 289-MAPBGA (14x14) - same 289-MAPBGA (14x14) - same 289-MAPBGA (14x14) - same 289-MAPBGA (14x14) - same
Core / Max CPU Frequency ARM Cortex-A7 / 528 MHz Cortex-A7 / 528 MHz Cortex-A7 / 528 MHz Cortex-A7 / 528 MHz Cortex-A7 / 696 MHz Cortex-A7 / 528 MHz (6ULL)
Security Accelerators AES/SHA/TRNG/HAB (G3) Reduced (G2) AES/SHA/TRNG/HAB (G3) AES/SHA/TRNG/HAB (G3) AES/SHA/TRNG/HAB (G3) AES/SHA/TRNG/HAB (6ULL)
Operating Temperature -40 to +105 C (industrial) -40 to +105 C -40 to +105 C 0 to +70 C (commercial) -40 to +105 C -40 to +105 C
Memory Controller 16-bit DDR3 / LPDDR2 DDR3 / LPDDR2 DDR3 / LPDDR2 DDR3 / LPDDR2 DDR3 / LPDDR2 DDR3 / LPDDR2 / LPDDR4 (6ULL)
Lifecycle Status Last Time Buy Active Last Time Buy Last Time Buy Last Time Buy Active (recommended replacement)
Approx Unit Price (qty 1) $16.85 $14.50 (estimate) $16.85 $15.90 (estimate) $18.50 (estimate) $12.20 (estimate, active)

Ключевые отличия

  • Higher security accelerator tier than the G2 SKU (против MCIMX6G2DVM05AA)
  • Industrial temperature grade option at 528 MHz (против MCIMX6G3CVM05AA)
  • Active product lifecycle vs Last Time Buy (против MCIMX6Y2DVM05AA)

Заметки по проектированию

The 289-ball MAPBGA with 0.8 mm pitch requires a minimum 6-layer PCB stack-up. Use microvia-in-pad for the BGA breakouts and matched-length routing (±25 mil) for the DDR3 byte lanes. Reference the NXP i.MX 6UL hardware design guide (document IMX6ULHDG) for the approved stack-up and routing topology. Power-plane islands for the core (VDD_SOC) and DDR (VDD_DDR) supplies must be solid under the package with stitched GND vias around the perimeter to minimize inductance.

Pair the MCIMX6G3DVM05AA with the NXP PF3001 PMIC for proper power-up sequencing. Discrete regulator solutions are possible but require careful sequencing logic to match the i.MX 6UL reset release timing. Core rail decoupling: 22 µF bulk + 0.1 µF high-frequency ceramic per the NXP reference schematic. Add a ferrite bead on the analog supply (VDDA) to isolate switching noise from the on-chip ADC. Cold-spare the PMIC's PWRON input to support software-controlled power cycling for OTA updates.

At 528 MHz CPU load with all peripherals active, the MCIMX6G3DVM05AA dissipates approximately 0.5 W to 1 W depending on workload. The 289-MAPBGA's exposed thermal pad requires stitching vias to the inner ground plane for heat extraction. For sealed enclosures with no airflow, derate the CPU clock or migrate to the i.MX 6ULL family which offers lower power at equivalent throughput. Always measure junction temperature on first prototypes with the on-chip thermal sensor rather than relying on ambient readings.

Critical pitfalls: (1) Forgetting to tie the BOOT_MODE[1:0] pins to the correct boot-source strapping (00 = internal boot from eFUSE, 01 = reserved, 10 = serial downloader, 11 = internal boot from fuses after serial download). (2) Connecting USB OTG VBUS without the required 5 V tolerant protection FET. (3) Omitting the 32.768 kHz RTC crystal load capacitors (typically 12 pF). (4) Routing the DDR3 address/control signals without matched-length tuning - the i.MX 6UL performs read/write leveling but tolerance is limited. Always validate boot from an empty eMMC/NAND before assuming the design is solid.

Route the CSI and LCDIF parallel data buses with controlled impedance (50 Ω single-ended) and length matching within 50 mils. Place the CSI sensor connector as close to the balls as possible to avoid coupling. Keep the SD card signals on the inner layers with ground shielding on both sides to suppress EMI from the high-speed DDR3 bus. The boot-mode strapping pins and JTAG chain should be brought out to a 0.1-inch header for manufacturing test access.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Без свинца
Yes
Без галогенов
Yes
Конфликтные минералы
Compliant

RoHS and REACH compliant per NXP product page and verified DigiKey listing. Pb-free BGA finish with JEDEC J-STD-020 MSL-3 rating. AEC-Q100 not applicable - this is an application processor, not an automotive-qualified MCU. For automotive designs, NXP recommends the i.MX 6ULL automotive grade.

Данные проверены: 2026-10-17 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors MCIMX6G3DVM05AA i.MX 6UltraLite i.MX 6ULL MCIMX6G2DVM05AA MCIMX6Y2DVM05AA ARM Cortex-A7 NEON SIMD MAPBGA-289 MAPBGA DDR3 LPDDR2 USB 2.0 OTG IEEE 1588 AES SHA TRNG High Assurance Boot PF3001 PMIC PF3000 PMIC industrial IoT gateway smart energy meter building automation point-of-sale terminal medical patient monitor JEDEC J-STD-020 RoHS REACH MSL-3 Last Time Buy
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Итого: $0.00 USD
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1
RFQ отправлен
2
Предложение получено
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Заказ оформлен
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Оплата
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Отправлено
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Доставлено
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