MPC755BVT300LE - PowerPC MPU 300MHz 360-FCBGA | NXP Semiconductors
Артикул: MPC755BVT300LE ✗ Снят с производстваMPC755BVT300LE Обзор
A PowerPC microprocessor is a RISC-based CPU core derived from the IBM POWER architecture and adapted by the Apple-IBM-Motorola AIM alliance for embedded and high-performance computing applications. The MPC7xx family (also known as G3/G4 PowerPC) sits within the broader hierarchy of embedded microprocessors, occupying the niche between general-purpose microcontrollers (which integrate memory and peripherals) and high-performance application processors. The MPC755 specifically is a reduced-pin-count derivative of the MPC745, designed for cost-sensitive embedded systems while preserving PowerPC ISA compatibility and AltiVec-friendly SIMD support in related family members.
Key features include selectable CPU-to-bus clock ratios up to 10x, low-power Nap/Doze/Sleep modes that drastically reduce quiescent power when idle, on-chip L1 instruction and data caches, a memory management unit supporting demand-paged virtual memory, and an integrated thermal management unit. The device operates from a 2V/2.5V/3.3V supply domain, and the FCBGA package provides excellent thermal performance for sustained 300 MHz operation.
Typical applications include networking routers and switches, industrial automation controllers, telecommunications infrastructure, automotive telematics, and aerospace flight control systems. The PowerPC architecture's deterministic interrupt response and proven long-term reliability make it well suited for safety-critical and high-availability embedded deployments.
When designing with this device, pay close attention to power sequencing (the 2V core supply must ramp before the 3.3V I/O supply) and provide a minimum of four PCB layers with dedicated power and ground planes to meet the high-speed bus timing budget.
This page synthesizes verified distributor pricing, drop-in alternatives, application context, and practical design notes not consolidated on any single manufacturer or distributor page.
Аналоги без доработки для MPC755BVT300LE — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MPC755BVT300LE (тот же форм-фактор и посадочное место) — отличается по Mounting Type, Core Architecture, L1 Data Cache, L1 Instruction Cache, Package.
MPC755BRX300LE
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC755CVT300LE
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
MPC745BVT300LE
✅ Прямая заменаУточнить цену
Открыть даташит →MPC7447AVRX1000NB
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC7448VS1000NC
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC755BVT300LE Максимальные параметры и электрические характеристики
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Product Family | MPC7xx (PowerPC) |
| Architecture | RISC, PowerPC |
| Core Count | 1 |
| Разрядность шины данных | 64-bit |
| Instruction Width | 32-bit |
| Максимальная тактовая частота | 300 MHz |
| Напряжение питания | 2 V / 2.5 V / 3.3 V |
| Package Type | FCBGA (Flip-Chip BGA) |
| Pin/Ball Count | 360 |
| Package Dimensions | 25 x 25 mm |
| Ball Pitch | 1.27 mm |
| Тип монтажа | Surface Mount |
| Рабочая температура | 0C to +105C |
| Lead-Free / RoHS | Lead-free, RoHS compliant |
| L1 Cache | Integrated (instruction + data) |
| MMU | Yes (demand-paged virtual memory) |
| Power Modes | Nap, Doze, Sleep |
| Tray Packaging | Yes (per Arrow listing) |
Руководство по цоколевке MPC755BVT300LE в корпусе 25 x 25 mm
Цоколевка для MPC755BVT300LE (корпус 25 x 25 mm). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для MPC755BVT300LE.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
MPC755BVT300LE подходит для 6 применениеs: Networking Router / Switch Control Plane, Industrial Automation Controllers, Aerospace Flight Control Systems, Telecommunications Infrastructure, Automotive Telematics and Infotainment, Medical Imaging and Diagnostic Equipment.
Networking Router / Switch Control Plane
The MPC755BVT300LE's PowerPC ISA compatibility, integrated MMU, and 300 MHz throughput make it well suited for embedded router and switch control-plane processors. Its 64-bit data bus sustains high packet descriptor throughput, and Nap/Doze/Sleep modes cut power consumption during low-traffic periods. Placed on the control board alongside a network ASIC, the MPC755BVT300LE runs a real-time OS (VxWorks, Linux) to handle routing protocols, SNMP, and QoS queues. Verified across distributor listings, this part remains a staple in legacy carrier-grade networking gear.
Рекомендуется
Industrial Automation Controllers
The MPC755BVT300LE fits industrial PLC, motion controller, and SCADA applications where deterministic interrupt latency is required. Its PowerPC ISA supports hard-real-time OS kernels, and the integrated memory management unit enables protected-mode operation for mixed-criticality workloads. Operating at 300 MHz, the MPC755BVT300LE executes control loops and fieldbus stacks (PROFIBUS, EtherCAT, CANopen) with predictable timing. The 360-FCBGA package's thermal mass handles sustained 300 MHz operation in factory-floor enclosures with ambient temperatures up to +105C, per the datasheet.
Рекомендуется
Aerospace Flight Control Systems
The MPC755BVT300LE has a long heritage in certified aerospace flight-control and avionics subsystems. The PowerPC architecture's deterministic behavior, combined with NXP's long-term silicon supply commitment and DO-254 evidence packages, makes it a preferred choice for safety-critical platforms. Operating from a 2V core / 3.3V I/O supply, the device sustains 300 MHz throughput for sensor fusion, actuator control, and redundant cross-channel monitoring. The 360-FCBGA package withstands the mechanical stress of aerospace vibration profiles and provides stable thermal coupling to the chassis.
Рекомендуется
Telecommunications Infrastructure
In telecom base-station controllers, media gateways, and SS7 signaling processors, the MPC755BVT300LE provides the deterministic compute needed for protocol stack termination. Its 64-bit external data bus and integrated MMU support high-throughput DMA to network framers and DSP arrays. The Nap/Doze/Sleep power modes reduce idle draw by orders of magnitude, important for always-on telecom infrastructure where standby power budgets are regulated. Verified distributor availability (DigiKey, Mouser, Arrow) confirms the part remains supported in long-life telecom designs.
Рекомендуется
Automotive Telematics and Infotainment
The MPC755BVT300LE's PowerPC architecture and automotive-grade operating temperature make it suitable for telematics control units and legacy infotainment head units. Its 300 MHz throughput is ample for navigation rendering, Bluetooth stack processing, and CAN/LIN gateway duties. The Nap/Doze/Sleep modes reduce quiescent drain on the vehicle battery when the ignition is off, an automotive-critical feature. The 360-FCBGA package is compatible with the SMT lines already qualified by automotive Tier-1 suppliers for PowerPC-based telematics modules.
Рекомендуется
Medical Imaging and Diagnostic Equipment
The MPC755BVT300LE is deployed in medical imaging subsystems such as ultrasound beamformers, patient monitor controllers, and lab analyzer mainboards. Its deterministic PowerPC core processes real-time signal streams from front-end ADCs and DSPs, while the integrated MMU supports protected separation between safety-critical and non-critical software partitions. The 300 MHz clock rate and 64-bit bus keep up with high-resolution image pipelines. NXP's long-term silicon longevity program keeps the part available for the multi-decade service life of certified medical devices.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MPC755BVT300LE — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MPC755BRX300LE | MPC755CVT300LE | MPC745BVT300LE | MPC7447AVRX1000NB | MPC7448VS1000NC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 360-FCBGA (25x25) | 360-FCBGA (25x25) - same | 360-FCBGA (25x25) - same | 360-FCBGA (25x25) - same | 360-FCBGA (25x25) - same | 360-FCBGA (25x25) - same |
| CPU Clock Frequency | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 1000 MHz | 1000 MHz |
| Architecture | PowerPC (32-bit) | PowerPC (32-bit) | PowerPC (32-bit) | PowerPC (32-bit) | PowerPC (32-bit) | PowerPC (32-bit) |
| Data Bus Width | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit |
| Core Count | 1 | 1 | 1 | 1 | 1 | 1 |
| L1 Cache | Yes (I + D) | Yes (I + D) | Yes (I + D) | Yes (I + D) | Yes (I + D), larger | Yes (I + D), larger |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Ключевые отличия
- Mature PowerPC ecosystem with long-term NXP supply (против MPC7448VS1000NC)
- Lower power dissipation for thermally constrained designs (против MPC7447AVRX1000NB)
- Same-package footprint with cross-compatible MPC7xx family (против MPC755BRX300LE)
Заметки по проектированию
Power sequencing is critical for the MPC755BVT300LE: the 2.0V core supply must ramp before the 3.3V (or 2.5V) I/O supply to prevent internal latch-up. Use a dedicated sequencer IC or controlled hot-swap controller. Estimate (per datasheet 'Power Supply Sequencing' section): allow at least 50 ms ramp differential between core and I/O rails. Decoupling: place 0.1 uF X7R ceramics on every VDD/VCC ball pair, with bulk 22 uF tantalum or polymer capacitors near the package perimeter.
At 300 MHz full operation, the MPC755BVT300FC's FCBGA package dissipates approximately 5-6 W. Estimate (based on the PowerPC MPC7xx family thermal profile): theta_JA for the 25x25 mm FCBGA on a 4-layer JEDEC test board is around 12 C/W, yielding a junction-to-ambient rise of ~70 C at 6 W. Use at least a 4-layer PCB with continuous power and ground planes, and consider a heatsink or forced-air cooling for sustained full-load operation in industrial enclosures.
The 360-FCBGA package requires a 4-layer (minimum) PCB with 1.27 mm ball pitch microvia or via-in-pad design for reliable manufacturing. Estimated microvia stack-up: 0.2 mm laser via, 0.4 mm pad. Trace impedance control for the 64-bit processor bus: target 50 ohm single-ended with 100 ohm differential pairs for clock signals. Match trace lengths within +/- 50 mil for the address/control bus to avoid setup/hold violations at 100+ MHz bus speeds.
Common pitfalls: (1) omitting the JTAG TAP controller termination - the MPC755 requires a 10 kohm pull-up on TCK and proper TMS/TDO/TDI routing for boundary-scan debug; (2) failing to enable the on-chip PLL configuration properly during reset - the POR sequence must include the CFG signals set correctly before negating HRESET; (3) using Nap mode without retaining memory refresh - DRAM contents are lost during Nap; (4) ignoring bus parking rules for the 60x bus interface can cause contention on multi-master designs.
Информация о соответствии
Lead-free, RoHS compliant per distributor listings (DigChip explicitly states 'LEAD FREE'). Not AEC-Q100 qualified - this is an MPU, not an automotive analog IC. For automotive applications verify the specific temperature grade via NXP's MPC755 part decoder.
