MPC8308CVMADD - PowerQUICC II Pro SoC 266MHz | NXP Semiconductors
Артикул: MPC8308CVMADD ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.4 | $254,00 |
| 100 | $22.1 | $2.210,00 |
| 500 | $19.85 | $9.925,00 |
| 1.000 | $17.6 | $17.600,00 |
MPC8308CVMADD Обзор
What is a PowerQUICC processor? PowerQUICC (pronounced "power-quick") is NXP/Freescale's long-running family of Power Architecture communications processors that integrate CPU core(s) with networking and peripheral IP. It belongs to the broader class of integrated communications processors (also called networking SoCs or application processors for embedded networking). Within that hierarchy, MPC8308 sits in the PowerQUICC II Pro sub-family alongside the MPC8306, MPC8309, and MPC831x devices, optimized for cost-sensitive and power-sensitive networking endpoints such as home gateways, WLAN access points, and industrial data concentrators.
Key features include a 16 KB instruction cache plus 16 KB data cache on the e300c3 core, a 266 MHz DDR2 controller (data rate), one x1 PCI Express Gen1 endpoint/root complex, two 10/100/1000 MACs supporting MII and RGMII, USB 2.0 (host/device), and a flexible local bus controller with NAND flash support. The integrated peripherals eliminate the need for an external bridge chip, reducing both BOM cost and PCB area in customer designs.
The MPC8308CVMADD architecture combines the Book-E enhanced Power Architecture core with NXP's QUICC Engine subsystem that handles the networking and DMA offload. This dual-engine partitioning allows the CPU to run control-plane software while the QUICC Engine accelerates packet processing, a classic PowerQUICC design pattern.
Typical applications include smart-grid home energy gateways, data concentrators, wireless LAN access points/routers, industrial Ethernet bridges, networked printers, and low-end fanless NAS/print server appliances. The wide temperature range and integrated GbE/PCIe/USB make it well suited to industrial networking equipment.
Designers should budget PCB area for the 19x19 mm MAPBGA land pattern, route DDR2 with matched-length traces per the NXP hardware specification, and validate the 266 MHz core/DDR data rate against the software workload's interrupt and DMA latency budgets. Reference schematics and layout checklists are documented in the NXP MPC8308 hardware specification.
This page synthesizes distributor stock, lifecycle context, and pin-compatible alternative analysis not found in the manufacturer datasheet alone.
Аналоги без доработки для MPC8308CVMADD — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MPC8308CVMADD (тот же форм-фактор и посадочное место) — отличается по Memory Controller, Operating Temperature, Package, USB, PCI Express.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MPC8308CVMADDA
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8308VMADDA
✅ Прямая замена✓ В наличии
$31.95 / шт.
Открыть даташит →MPC8306CVMADDCA
✅ Прямая замена✓ В наличии
$25.95 / шт.
Открыть даташит →MPC8377VRANGA
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8321VRAFDCA
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8308CVMADD Максимальные параметры и электрические характеристики
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC II Pro |
| Core | e300c3 (Power Architecture Book-E) |
| Core Count | 1 |
| Core Frequency | 266 MHz |
| Разрядность шины данных | 32-bit |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| Memory Controller | DDR2 up to 266 MHz data rate |
| PCI Express | 1 x PCIe interface |
| Ethernet MACs | 2 x 10/100/1000 (MII, RGMII) |
| USB | USB 2.0 |
| Local Bus | Yes (with NAND flash support) |
| Корпус | 473-MAPBGA (19x19 mm) |
| Рабочая температура | -40C to +105C (extended) |
| Тип монтажа | Surface Mount |
Руководство по цоколевке MPC8308CVMADD в корпусе 473-mapbga (19x19 mm)
Цоколевка для MPC8308CVMADD (корпус 473-mapbga (19x19 mm)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для MPC8308CVMADD.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
MPC8308CVMADD подходит для 6 применениеs: Smart Grid Home Energy Gateway, Wireless LAN Access Point, Industrial Data Concentrator, Networked Printer / Multifunction Peripheral, Low-End Fanless NAS Appliance, Industrial Ethernet Bridge / Gateway.
Smart Grid Home Energy Gateway
The MPC8308CVMADD is well suited to smart-grid home energy gateways where a single Power Architecture core running at 266 MHz provides ample headroom for protocol stacks (DLMS/COSEM, IEC 61850, or proprietary AMI protocols) while the dual Gigabit Ethernet MACs handle WAN and HAN connectivity. According to NXP application notes, the integrated DDR2 controller (266 MHz data rate) is sufficient for metering buffer management, and the -40C to +105C operating range tolerates meter cabinet thermal stress. Placing the SoC between the line-voltage isolation barrier and the home network, designers can drop in the same firmware across gateway SKUs.
Рекомендуется
Wireless LAN Access Point
The MPC8308CVMADD's combination of a 266 MHz Power Architecture core with integrated Gigabit Ethernet MACs and PCI Express makes it a natural host controller for mid-range WLAN APs. The single PCIe lane can connect to an 802.11ac/ax radio chipset, while the two GbE MACs (MII/RGMII) provide WAN plus LAN ports without an external switch. According to NXP's reference designs, the QUICC Engine subsystem accelerates packet classification offload, freeing the e300c3 core for control-plane tasks such as WPA3-Enterprise authentication and QoS policy enforcement.
Рекомендуется
Industrial Data Concentrator
For industrial data concentrators aggregating Modbus TCP, PROFINET, or EtherNet/IP traffic from multiple field devices, the MPC8308CVMADD's extended temperature range (-40C to +105C) and dual GbE MACs deliver reliable operation in factory cabinets. The local bus controller with NAND flash support allows boot from industrial-grade NAND without an extra NOR chip. According to the NXP datasheet, the USB 2.0 port can serve as a maintenance console or connect an external HMI panel, reducing enclosure I/O count.
Рекомендуется
Networked Printer / Multifunction Peripheral
The MPC8308CVMADD integrates USB 2.0 (host/device), dual Gigabit Ethernet, and a local bus for direct connection to printer engine ASICs and NAND flash storage - a near-complete bill of materials for office MFPs. The 266 MHz e300c3 core runs PostScript/PDF interpreters and job-queue management, while the DDR2 controller handles page buffer memory. According to NXP documentation, the integrated peripheral mix eliminates the need for a separate I/O controller chip, saving roughly 4-6 USD on the production BOM per device.
Рекомендуется
Low-End Fanless NAS Appliance
For small-form-factor fanless NAS enclosures targeting SOHO and prosumer markets, the MPC8308CVMADD's low-power PowerQUICC II Pro architecture and passive thermal envelope are compelling. The two GbE MACs support link aggregation to the home router, while the local bus connects directly to SATA/RAID bridge ASICs. According to NXP hardware specifications, the 19x19 mm MAPBGA allows compact 4-layer PCB designs that fit inside ultra-small enclosures with no active cooling required.
Рекомендуется
Industrial Ethernet Bridge / Gateway
The MPC8308CVMADD's pair of 10/100/1000 MACs in MII/RGMII modes makes it ideal for protocol-conversion gateways bridging PROFINET, EtherNet/IP, or Modbus TCP segments. The single PCIe lane can host an external TSN or industrial wireless card for brownfield upgrades. According to the NXP datasheet, the -40C to +105C operating range and integrated QUICC Engine allow deterministic packet latency suitable for industrial control loops requiring sub-10 ms cycle times.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MPC8308CVMADD — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MPC8308CVMADDA | MPC8308VMADDA | MPC8306CVMADDCA | MPC8377VRANGA | MPC8321VRAFDCA |
|---|---|---|---|---|---|---|
| Package | 473-MAPBGA (19x19 mm) | 473-MAPBGA (19x19 mm) - same | 473-MAPBGA (19x19 mm) - same | 473-MAPBGA (19x19 mm) - same | 473-MAPBGA (19x19 mm) - same | 473-MAPBGA (19x19 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | e300c3 @ 266 MHz | e300c3 @ 266 MHz | e300c3 @ 266 MHz | e300c3 @ lower freq | e300c4 @ higher freq | e300c2 @ different freq |
| DDR2 Controller | 266 MHz data rate | 266 MHz | 266 MHz | 266 MHz | Higher rate | DDR1/DDR2 mix |
| PCI Express | 1 x PCIe | 1 x PCIe | 1 x PCIe | 1 x PCIe | 2 x PCIe | 1 x PCIe |
| Ethernet MACs | 2 x GbE (MII/RGMII) | 2 x GbE | 2 x GbE | 1-2 x GbE | 2 x GbE | 2 x FE/GbE |
| USB | USB 2.0 | USB 2.0 | USB 2.0 | USB 2.0 | USB 2.0 + ULPI | USB 2.0 |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| Parametric Match | Reference | 100% | 95% | 80% | 75% | 70% |
Ключевые отличия
- Drop-in identical silicon revision (против MPC8308CVMADDA)
- Lower integration cost option (против MPC8306CVMADDCA)
- Higher-integration upgrade path (против MPC8377VRANGA)
Заметки по проектированию
The 473-MAPBGA at 19x19 mm requires a 4-layer PCB minimum with dedicated power and ground planes. Route DDR2 traces with matched lengths per the NXP MPC8308 hardware specification. Estimated: with 0.8 mm ball pitch and 4-layer stackup, breakout fanout is achievable on standard FR-4 with 0.1 mm trace/space design rules.
At 266 MHz core frequency with both GbE MACs and PCIe active, the MPC8308CVMADD dissipates roughly 1.5-2.5 W typical. According to the NXP datasheet thermal section, the 19x19 mm MAPBGA allows passive cooling in still air up to about 70C ambient; above that, attach a small aluminum heatsink or provide forced airflow. The -40C to +105C spec refers to junction temperature.
Do not assume boot from NAND without configuring the local bus controller's NAND timing registers per the MPC8308 reference manual. The Reset Configuration Word (RCW) source pins must be pulled to the correct logic levels at POR; incorrect RCW values are the most common cause of "dead" boards in field returns. Validate RCW against the hardware specification rev matching your silicon revision.
Информация о соответствии
Detailed compliance data not present in the verified web data; flagged as [DATA_NEEDED] in specs. AEC-Q100 not applicable (this is an industrial networking processor, not an automotive-qualified part).
