MPC8313EZQAFFC - PowerPC e300c3 MPU, 333MHz, 516-TEPBGA | NXP
Артикул: MPC8313EZQAFFC ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $26.2 | $262,00 |
| 100 | $23.85 | $2.385,00 |
| 500 | $21.4 | $10.700,00 |
| 1.000 | $19.1 | $19.100,00 |
MPC8313EZQAFFC Обзор
What is a PowerQUICC MPU? A PowerQUICC (pronounced 'power-quick') microprocessor is a family of Power-Architecture system-on-chip (SoC) processors from Freescale/NXP that integrate a PowerPC CPU core with communications peripherals such as Ethernet MACs, PCI, USB, and security accelerators. Within that hierarchy, the MPC8313E belongs to the PowerQUICC II Pro sub-family, which adds DDR2 support and a Gigabit Ethernet interface, sitting between the simpler PowerQUICC I (MPC8xx) and the higher-end PowerQUICC III (MPC85xx). The 'E' suffix indicates hardware-enabled encryption (SEC 2.x), and 'Z' denotes the 516-TEPBGA package option.
Key features include a 333 MHz e300c3 core with 16 KB I-cache and 16 KB D-cache, dual DDR1/DDR2 memory controllers up to 333 MHz data rate, integrated Gigabit Ethernet MAC, two 10/100 Ethernet MACs, PCI 2.3 interface, USB 2.0 (Full/Low Speed) and a SEC 2.0 crypto accelerator. The 516-TEPBGA exposed-pad package provides the thermal headroom required for industrial 0 C to 105 C operation.
Typical applications include broadband gateways, xDSL Integrated Access Devices, wireless LAN access points, industrial control, and printing/imaging platforms where integrated comms peripherals and Power-Architecture software compatibility reduce BOM and design time. The on-chip SEC engine offloads IPsec and SSL crypto from the CPU.
When designing with this MPU, allocate sufficient PCB area for the 27x27 mm BGA and route DDR2 address/command signals with matched impedance and length matching per NXP's hardware design checklist; ensure the exposed pad has a contiguous ground plane for thermal dissipation.
Аналоги без доработки для MPC8313EZQAFFC — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MPC8313EZQAFFC (тот же форм-фактор и посадочное место) — отличается по Ethernet, Operating Temperature, Package, Security Engine, USB.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MPC8313EVRAFFC
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8313ECZQAFFC
✅ Прямая замена✓ В наличии
$21.3 / шт.
Открыть даташит →MPC8313ECVRAFFC
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8313EVRAGDA
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC8378VRALGA
✅ Прямая замена✓ В наличии
$23.5 / шт.
Открыть даташит →MPC8313EZQAFFC Максимальные параметры и электрические характеристики
| Series | MPC83xx (PowerQUICC II Pro) |
| Core Processor | PowerPC e300c3 |
| Number of Cores | 1 |
| Core Speed | 333 MHz |
| Разрядность шины данных | 32-bit |
| Корпус | 516-TEPBGA (27x27 mm) with exposed pad |
| Тип монтажа | Surface Mount (BGA) |
| Supply Voltage - Core | 1 V |
| Supply Voltage - I/O | 3.3 V |
| Рабочая температура | 0 C to +105 C |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| DDR Memory Controller | DDR1 / DDR2 up to 333 MHz data rate |
| Ethernet | 1x Gigabit + 2x 10/100 MACs |
| PCI | PCI 2.3 |
| USB | USB 2.0 Full/Low Speed |
| Security Engine | SEC 2.x (IPsec/SSL acceleration) |
| Статус RoHS | Compliant |
| Уровень MSL | 3 |
Руководство по цоколевке MPC8313EZQAFFC в корпусе 516-tepbga (27x27 mm) with exposed pad
Цоколевка для MPC8313EZQAFFC (корпус 516-tepbga (27x27 mm) with exposed pad). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для MPC8313EZQAFFC.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
MPC8313EZQAFFC подходит для 6 применениеs: xDSL Integrated Access Devices, Home Gateway and SMB Router, Industrial Control and Factory Gateways, Wireless LAN Access Point Controller, Printing and Imaging Platform Controller, Secure VPN Concentrator.
xDSL Integrated Access Devices
The MPC8313EZQAFFC suits xDSL Integrated Access Devices because it integrates a 333 MHz e300c3 core with on-chip Gigabit Ethernet, dual 10/100 MACs, PCI 2.3, USB 2.0, and the SEC 2.x crypto engine. In a typical IAD, the CPU handles PPPoE, NAT, firewall, and IPsec offload while the DDR2 controller feeds packet buffers at line rate. Compared with discrete MPU + PHY solutions, the integrated three-port Ethernet switch fabric cuts BOM and PCB area. Verified against the NXP MPC8313E reference design, the part delivers deterministic throughput for residential gateway workloads with industrial 0-105 C screening.
Рекомендуется
Home Gateway and SMB Router
For home gateways and small/medium-business routers, the MPC8313EZQAFFC's combination of e300c3 core, Gigabit Ethernet, and integrated SEC engine accelerates IPsec/SSL VPN termination without an external crypto ASIC. The DDR2 controller (up to 333 MHz data rate) provides bandwidth for QoS classification and NAT table lookups. Hardware NAT and checksum offload engines inside the QUICC Engine free the CPU for routing protocols such as OSPF and BGP. The 516-TEPBGA exposed-pad package supports fanless enclosures with adequate copper pour.
Рекомендуется
Industrial Control and Factory Gateways
Industrial control gateways benefit from the MPC8313EZQAFFC's 0-105 C temperature range, long-lifecycle NXP support, and deterministic PowerPC architecture. The on-chip PCI 2.3 bus connects to FPGA or ADC cards, while dual Ethernet MACs bridge Modbus/TCP, EtherNet/IP, and PROFINET segments. The SEC engine secures OPC-UA and MQTT-TLS traffic. DDR2 memory with ECC support (when paired with parity DIMMs) provides robust operation in electrically noisy factory environments; the 27x27 mm BGA allows compact DIN-rail enclosure designs.
Рекомендуется
Wireless LAN Access Point Controller
As a wireless LAN access point controller, the MPC8313EZQAFFC pairs its e300c3 core with an 802.11 MAC/PHY over PCI or USB, handling 802.1X EAP authentication, WPA2/AES encryption offload via the SEC engine, and CAPWAP data tunnels. The integrated Gigabit Ethernet MAC uplinks to PoE switches at line rate. Compared with ARM-based AP SoCs, the PowerPC architecture offers deterministic interrupt latency and proven long-term Linux BSP support. The exposed-pad BGA eases thermal management in ceiling-mounted AP enclosures.
Рекомендуется
Printing and Imaging Platform Controller
The MPC8313EZQAFFC serves as a controller for printing and imaging platforms, where its 333 MHz e300c3 core drives image processing pipelines while the DDR2 controller feeds high-resolution raster buffers. USB 2.0 and Gigabit Ethernet enable host connectivity, while PCI hosts image-acquisition ASICs. The SEC engine protects licensed print data and DRM payloads in transit. PowerPC binary compatibility with legacy PowerQUICC firmware reduces porting effort when upgrading from earlier MPC8xx designs.
Рекомендуется
Secure VPN Concentrator
For secure VPN concentrator appliances, the MPC8313EZQAFFC's SEC 2.x engine accelerates 3DES, AES, and SHA workloads, allowing line-rate IPsec at typical SMB WAN speeds without an external crypto card. The e300c3 core handles IKEv2 and routing, while dual DDR2 channels feed large flow tables. The integrated three-port Ethernet switch fabric provides DMZ/WAN/LAN segmentation in a single chip, and the 0-105 C temperature rating suits data-center-edge deployments. The 516-TEPBGA exposed pad requires careful PCB stack-up for thermal relief at full SEC load.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MPC8313EZQAFFC — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MPC8313EVRAFFC | MPC8313ECZQAFFC | MPC8313ECVRAFFC | MPC8313EVRAGDA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) |
| Core | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 |
| Core Speed | 333 MHz | 333 MHz | 333 MHz | 333 MHz | 333 MHz |
| DDR Controller | DDR1/DDR2 up to 333 MHz | DDR1/DDR2 up to 333 MHz | DDR1/DDR2 up to 333 MHz | DDR1/DDR2 up to 333 MHz | DDR1/DDR2 up to 333 MHz |
| Gigabit Ethernet | Yes (1x GbE + 2x 10/100) | Yes (1x GbE + 2x 10/100) | Yes (1x GbE + 2x 10/100) | Yes (1x GbE + 2x 10/100) | Yes (1x GbE + 2x 10/100) |
| Security Engine (SEC) | Yes (SEC 2.x) | Yes (SEC 2.x) | Yes (SEC 2.x) | Yes (SEC 2.x) | Yes (SEC 2.x) |
| Operating Temperature | 0 C to +105 C | 0 C to +105 C (verify per suffix) | 0 C to +105 C (verify per suffix) | 0 C to +105 C (verify per suffix) | 0 C to +105 C (verify per suffix) |
Ключевые отличия
- Integrated SEC 2.x crypto engine on-chip (против MPC8308CVMAGDA)
- 27x27 mm 516-TEPBGA with shared ball-map across MPC8313E family (против MPC8313ECZQAFFC)
- Triple Ethernet MAC fabric integrated (против MPC8313EVRAGDA)
Заметки по проектированию
The 516-TEPBGA exposed pad must be soldered to a continuous ground plane with thermal vias on the BGA land pattern to keep junction temperature within the 0-105 C range. Estimated: at full SEC load plus GbE traffic the die dissipates approximately 1.5-2.5 W; design 4-layer FR-4 with at least 1 oz copper on inner ground planes and a 6x6 via array under the pad. Without an adequate thermal path, the part may throttle or trigger internal thermal protection.
Route DDR2 address, command, and clock signals with matched impedance (50 ohm single-ended, 100 ohm differential for clocks) and length-matched within the tolerances specified in the NXP MPC8313E hardware design guide. Use fly-by topology for DDR2 instead of T-branch, and place VTT termination at the end of each address/command fly-by segment. Keep DDR2 signals away from USB and GbE differential pairs to avoid crosstalk.
The 1 V core rail must be sequenced before the 3.3 V I/O rail according to the NXP MPC8313E reference manual. Use a power supervisor or PMIC with adjustable sequencing rather than RC delay circuits. Place bulk tantalum or polymer capacitors near the BGA core balls with 0.1 uF and 0.01 uF ceramic decoupling in parallel; the e300c3 core draws high transient currents during cache fills.
The integrated Gigabit Ethernet MAC requires an external GbE PHY connected via RGMII or GMII. Series-terminate the RGMII transmit and receive clocks with 22-33 ohm resistors placed near the MPC8313EZQAFFC balls, not the PHY, to dampen reflections. For USB 2.0 Full/Low Speed, add 90-ohm common-mode chokes on D+/D- and keep the 90-ohm differential impedance strictly controlled.
Информация о соответствии
RoHS and REACH compliance per NXP product page; AEC-Q100 not applicable (industrial/commercial MPU, not automotive grade).
