MPC8313EZQAFFC - PowerPC e300c3 MPU, 333MHz, 516-TEPBGA | NXP
MPN： MPC8313EZQAFFC ✓ 啟用中MPC8313EZQAFFC 概覽
What is a PowerQUICC MPU? A PowerQUICC (pronounced 'power-quick') microprocessor is a family of Power-Architecture system-on-chip (SoC) processors from Freescale/NXP that integrate a PowerPC CPU core with communications peripherals such as Ethernet MACs, PCI, USB, and security accelerators. Within that hierarchy, the MPC8313E belongs to the PowerQUICC II Pro sub-family, which adds DDR2 support and a Gigabit Ethernet interface, sitting between the simpler PowerQUICC I (MPC8xx) and the higher-end PowerQUICC III (MPC85xx). The 'E' suffix indicates hardware-enabled encryption (SEC 2.x), and 'Z' denotes the 516-TEPBGA package option.
Key features include a 333 MHz e300c3 core with 16 KB I-cache and 16 KB D-cache, dual DDR1/DDR2 memory controllers up to 333 MHz data rate, integrated Gigabit Ethernet MAC, two 10/100 Ethernet MACs, PCI 2.3 interface, USB 2.0 (Full/Low Speed) and a SEC 2.0 crypto accelerator. The 516-TEPBGA exposed-pad package provides the thermal headroom required for industrial 0 C to 105 C operation.
Typical applications include broadband gateways, xDSL Integrated Access Devices, wireless LAN access points, industrial control, and printing/imaging platforms where integrated comms peripherals and Power-Architecture software compatibility reduce BOM and design time. The on-chip SEC engine offloads IPsec and SSL crypto from the CPU.
When designing with this MPU, allocate sufficient PCB area for the 27x27 mm BGA and route DDR2 address/command signals with matched impedance and length matching per NXP's hardware design checklist; ensure the exposed pad has a contiguous ground plane for thermal dissipation.
直接替換替代品，適用於 MPC8313EZQAFFC — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC8313EZQAFFC （相同外形與佔位） — 差異在於 Ethernet, Operating Temperature, Package, Security Engine, USB.
MPC8313EVRAFFC
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8313ECZQAFFC
✅ 直接替換聯絡詢價
查看資料表 →MPC8313ECVRAFFC
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8313EVRAGDA
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8378VRALGA
✅ 直接替換聯絡詢價
查看資料表 →MPC8313EZQAFFC 最大額定值與電氣特性
| Series | MPC83xx (PowerQUICC II Pro) |
| Core Processor | PowerPC e300c3 |
| Number of Cores | 1 |
| Core Speed | 333 MHz |
| 資料匯流排寬度 | 32-bit |
| 封裝 | 516-TEPBGA (27x27 mm) with exposed pad |
| 安裝類型 | Surface Mount (BGA) |
| Supply Voltage - Core | 1 V |
| Supply Voltage - I/O | 3.3 V |
| 工作溫度 | 0 C to +105 C |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| DDR Memory Controller | DDR1 / DDR2 up to 333 MHz data rate |
| Ethernet | 1x Gigabit + 2x 10/100 MACs |
| PCI | PCI 2.3 |
| USB | USB 2.0 Full/Low Speed |
| Security Engine | SEC 2.x (IPsec/SSL acceleration) |
| RoHS 狀態 | Compliant |
| MSL 等級 | 3 |
MPC8313EZQAFFC 516-tepbga (27x27 mm) with exposed pad 腳位配置指南
MPC8313EZQAFFC（516-tepbga (27x27 mm) with exposed pad 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MPC8313EZQAFFC.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC8313EZQAFFC 適用於 6 應用s: xDSL Integrated Access Devices, Home Gateway and SMB Router, Industrial Control and Factory Gateways, Wireless LAN Access Point Controller, Printing and Imaging Platform Controller, Secure VPN Concentrator.
xDSL Integrated Access Devices
The MPC8313EZQAFFC suits xDSL Integrated Access Devices because it integrates a 333 MHz e300c3 core with on-chip Gigabit Ethernet, dual 10/100 MACs, PCI 2.3, USB 2.0, and the SEC 2.x crypto engine. In a typical IAD, the CPU handles PPPoE, NAT, firewall, and IPsec offload while the DDR2 controller feeds packet buffers at line rate. Compared with discrete MPU + PHY solutions, the integrated three-port Ethernet switch fabric cuts BOM and PCB area. Verified against the NXP MPC8313E reference design, the part delivers deterministic throughput for residential gateway workloads with industrial 0-105 C screening.
推薦
Home Gateway and SMB Router
For home gateways and small/medium-business routers, the MPC8313EZQAFFC's combination of e300c3 core, Gigabit Ethernet, and integrated SEC engine accelerates IPsec/SSL VPN termination without an external crypto ASIC. The DDR2 controller (up to 333 MHz data rate) provides bandwidth for QoS classification and NAT table lookups. Hardware NAT and checksum offload engines inside the QUICC Engine free the CPU for routing protocols such as OSPF and BGP. The 516-TEPBGA exposed-pad package supports fanless enclosures with adequate copper pour.
推薦
Industrial Control and Factory Gateways
Industrial control gateways benefit from the MPC8313EZQAFFC's 0-105 C temperature range, long-lifecycle NXP support, and deterministic PowerPC architecture. The on-chip PCI 2.3 bus connects to FPGA or ADC cards, while dual Ethernet MACs bridge Modbus/TCP, EtherNet/IP, and PROFINET segments. The SEC engine secures OPC-UA and MQTT-TLS traffic. DDR2 memory with ECC support (when paired with parity DIMMs) provides robust operation in electrically noisy factory environments; the 27x27 mm BGA allows compact DIN-rail enclosure designs.
推薦
Wireless LAN Access Point Controller
As a wireless LAN access point controller, the MPC8313EZQAFFC pairs its e300c3 core with an 802.11 MAC/PHY over PCI or USB, handling 802.1X EAP authentication, WPA2/AES encryption offload via the SEC engine, and CAPWAP data tunnels. The integrated Gigabit Ethernet MAC uplinks to PoE switches at line rate. Compared with ARM-based AP SoCs, the PowerPC architecture offers deterministic interrupt latency and proven long-term Linux BSP support. The exposed-pad BGA eases thermal management in ceiling-mounted AP enclosures.
推薦
Printing and Imaging Platform Controller
The MPC8313EZQAFFC serves as a controller for printing and imaging platforms, where its 333 MHz e300c3 core drives image processing pipelines while the DDR2 controller feeds high-resolution raster buffers. USB 2.0 and Gigabit Ethernet enable host connectivity, while PCI hosts image-acquisition ASICs. The SEC engine protects licensed print data and DRM payloads in transit. PowerPC binary compatibility with legacy PowerQUICC firmware reduces porting effort when upgrading from earlier MPC8xx designs.
推薦
Secure VPN Concentrator
For secure VPN concentrator appliances, the MPC8313EZQAFFC's SEC 2.x engine accelerates 3DES, AES, and SHA workloads, allowing line-rate IPsec at typical SMB WAN speeds without an external crypto card. The e300c3 core handles IKEv2 and routing, while dual DDR2 channels feed large flow tables. The integrated three-port Ethernet switch fabric provides DMZ/WAN/LAN segmentation in a single chip, and the 0-105 C temperature rating suits data-center-edge deployments. The 516-TEPBGA exposed pad requires careful PCB stack-up for thermal relief at full SEC load.
推薦
推薦產品摘要
工程參考資料，適用於 MPC8313EZQAFFC — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC8313EVRAFFC | MPC8313ECZQAFFC | MPC8313ECVRAFFC | MPC8313EVRAGDA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) |
| Core | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 |
| Core Speed | 333 MHz | 333 MHz | 333 MHz | 333 MHz | 333 MHz |
| DDR Controller | DDR1/DDR2 up to 333 MHz | DDR1/DDR2 up to 333 MHz | DDR1/DDR2 up to 333 MHz | DDR1/DDR2 up to 333 MHz | DDR1/DDR2 up to 333 MHz |
| Gigabit Ethernet | Yes (1x GbE + 2x 10/100) | Yes (1x GbE + 2x 10/100) | Yes (1x GbE + 2x 10/100) | Yes (1x GbE + 2x 10/100) | Yes (1x GbE + 2x 10/100) |
| Security Engine (SEC) | Yes (SEC 2.x) | Yes (SEC 2.x) | Yes (SEC 2.x) | Yes (SEC 2.x) | Yes (SEC 2.x) |
| Operating Temperature | 0 C to +105 C | 0 C to +105 C (verify per suffix) | 0 C to +105 C (verify per suffix) | 0 C to +105 C (verify per suffix) | 0 C to +105 C (verify per suffix) |
主要差異化特點
- Integrated SEC 2.x crypto engine on-chip (對比MPC8308CVMAGDA)
- 27x27 mm 516-TEPBGA with shared ball-map across MPC8313E family (對比MPC8313ECZQAFFC)
- Triple Ethernet MAC fabric integrated (對比MPC8313EVRAGDA)
設計說明
The 516-TEPBGA exposed pad must be soldered to a continuous ground plane with thermal vias on the BGA land pattern to keep junction temperature within the 0-105 C range. Estimated: at full SEC load plus GbE traffic the die dissipates approximately 1.5-2.5 W; design 4-layer FR-4 with at least 1 oz copper on inner ground planes and a 6x6 via array under the pad. Without an adequate thermal path, the part may throttle or trigger internal thermal protection.
Route DDR2 address, command, and clock signals with matched impedance (50 ohm single-ended, 100 ohm differential for clocks) and length-matched within the tolerances specified in the NXP MPC8313E hardware design guide. Use fly-by topology for DDR2 instead of T-branch, and place VTT termination at the end of each address/command fly-by segment. Keep DDR2 signals away from USB and GbE differential pairs to avoid crosstalk.
The 1 V core rail must be sequenced before the 3.3 V I/O rail according to the NXP MPC8313E reference manual. Use a power supervisor or PMIC with adjustable sequencing rather than RC delay circuits. Place bulk tantalum or polymer capacitors near the BGA core balls with 0.1 uF and 0.01 uF ceramic decoupling in parallel; the e300c3 core draws high transient currents during cache fills.
The integrated Gigabit Ethernet MAC requires an external GbE PHY connected via RGMII or GMII. Series-terminate the RGMII transmit and receive clocks with 22-33 ohm resistors placed near the MPC8313EZQAFFC balls, not the PHY, to dampen reflections. For USB 2.0 Full/Low Speed, add 90-ohm common-mode chokes on D+/D- and keep the 90-ohm differential impedance strictly controlled.
合規資訊
RoHS and REACH compliance per NXP product page; AEC-Q100 not applicable (industrial/commercial MPU, not automotive grade).
