MPC855TZQ50D4 - 50MHz PowerQUICC SoC | NXP 357-PBGA
Артикул: MPC855TZQ50D4 ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $31.64 | $31,64 |
| 10 | $28.5 | $285,00 |
| 100 | $25 | $2.500,00 |
| 500 | $22 | $11.000,00 |
| 1.000 | $19.5 | $19.500,00 |
MPC855TZQ50D4 Обзор
A PowerQUICC SoC (System-on-Chip) is a category of integrated communications processors that merge a general-purpose CPU with a dedicated RISC-based communications engine on a single die. Within the broader semiconductor hierarchy, it sits under Microprocessor ICs > MPU > SoC > Communications Processor > Power Architecture SoC. The CPM offloads serial-channel processing (Ethernet, ATM, HDLC) from the main core, enabling deterministic throughput for wireline access equipment without consuming CPU cycles. The MPC855T is part of the MPC8xx family that introduced PowerQUICC to cost-sensitive access applications.
Key features include a 50 MHz Power Architecture 32-bit core, on-chip CPM with 10/100 Mbps Ethernet MAC, ATM segmentation and reassembly (SAR), HDLC/SDLC controllers, PCMCIA interface, 4 KB instruction cache and 4 KB data cache, MMU, and dual UARTs. The device operates from 0C to 95C commercial temperature range and runs on a 3.3V I/O and 2.5V/3.3V core supply architecture typical of the MPC8xx generation.
The architecture separates control-plane processing (Power Architecture core) from data-plane processing (CPM RISC engine). The CPM handles DMA, serial protocols, and time-division multiplexing, leaving the CPU free for protocol stacks, routing tables, and management functions. The 357-ball PBGA package uses a 25 x 25 mm body with a 1.27 mm ball pitch and exposed die for thermal dissipation.
Typical applications include DSLAM line cards, low-end routers, ISDN terminal adapters, set-top box controllers, industrial control with Ethernet, and PCMCIA-based wireless access points. The on-chip Ethernet MAC enables direct PHY connection without external glue logic for 10/100 Mbps designs.
Design considerations include a multi-voltage power architecture requiring both 3.3V and 2.5V supplies, plus careful PBGA PCB layout with via-in-pad recommended for thermal performance. The 357-ball package requires controlled-impedance routing and matched-length clocks for the CPM-driven serial interfaces.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Аналоги без доработки для MPC855TZQ50D4 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MPC855TZQ50D4 (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Package, Core Architecture, Series, Manufacturer.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MPC860ENZQ50D4R2
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MPC855TVR50D4
✅ Прямая замена✓ В наличии
$48.1 / шт.
Открыть даташит →MPC855TVR66D4
✅ Прямая замена✓ В наличии
$55.4 / шт.
Открыть даташит →MPC860DEZQ50D4
✅ Прямая замена✓ В наличии
$24.95 / шт.
Открыть даташит →MPC857DSLVR50B
✅ Прямая замена✓ В наличии
$23.13 / шт.
Открыть даташит →MPC855TZQ50D4 Максимальные параметры и электрические характеристики
| Manufacturer | NXP Semiconductors (formerly Freescale, Motorola) |
| Series | PowerQUICC MPC8xx |
| Core Architecture | 32-bit Power Architecture |
| Core Frequency | 50 MHz |
| Number of Cores | 1 |
| Communications Processor Module (CPM) | Yes (RISC-based offload engine) |
| Ethernet Support | 10/100 Mbps Fast Ethernet MAC |
| ATM Support | Yes (ATM SAR) |
| HDLC/SDLC Support | Yes |
| PCMCIA Interface | Yes |
| Instruction Cache | 4 KB |
| Data Cache | 4 KB |
| MMU | Yes |
| Корпус | 357-ball PBGA (25 x 25 mm) |
| Рабочая температура | 0C to +95C |
| Process Technology | 0.32 um CMOS (per FindIC reference data) |
| Тип монтажа | Surface Mount |
Руководство по цоколевке MPC855TZQ50D4 в корпусе 357-ball pbga (25 x 25 mm)
Цоколевка для MPC855TZQ50D4 (корпус 357-ball pbga (25 x 25 mm)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для MPC855TZQ50D4.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
MPC855TZQ50D4 подходит для 6 применениеs: DSLAM Line Card Controller, Low-End Router / SOHO Gateway, ISDN Terminal Adapter, Set-Top Box Controller, Industrial Ethernet Controller, PCMCIA-Based Wireless Access Point.
DSLAM Line Card Controller
The MPC855TZQ50D4 is well-suited for DSLAM line cards because its on-chip CPM handles ATM SAR and HDLC framing deterministically, freeing the 50 MHz Power Architecture core to run management and routing code. With a 10/100 Ethernet MAC plus ATM SAR on a single die, the design eliminates an external communications ASIC, reducing BOM cost and board area. Power dissipation at 50 MHz in the 357-PBGA package stays within the thermal envelope of a typical 1 oz copper 4-layer PCB, and the 0 to 95C operating range matches indoor telecom shelf environments.
Рекомендуется
Low-End Router / SOHO Gateway
The MPC855TZQ50D4 fits SOHO router designs because its integrated 10/100 Ethernet MAC and PCMCIA host controller cover the typical residential gateway feature set without external glue logic. The 50 MHz Power Architecture core is sufficient to run lightweight routing stacks, NAT, and DHCP, while the CPM offloads packet DMA so wire-speed forwarding is achievable. The 357-PBGA package enables compact board designs, and the 0 to 95C range suits fanless indoor enclosures.
Рекомендуется
ISDN Terminal Adapter
The MPC855TZQ50D4 is a strong fit for ISDN terminal adapters thanks to its integrated HDLC controllers and serial-channel DMA, which handle BRI/PRI framing with deterministic latency. The 32-bit Power Architecture core executes higher-layer protocols, while the CPM services the D-channel and B-channels without CPU intervention. The on-chip PCMCIA interface allows optional expansion for wireless or storage peripherals, and the 357-PBGA keeps the BOM compact for desktop terminal adapter enclosures.
Рекомендуется
Set-Top Box Controller
The MPC855TZQ50D4 serves set-top box controller roles where its Power Architecture core runs middleware and the on-chip Ethernet MAC enables IPTV or hybrid broadcast-broadband connectivity. The CPM accelerates MPEG transport-stream handling and conditional-access messaging through its HDLC channels, offloading the main core. The 357-PBGA package supports typical STB mainboard layouts, and the 0 to 95C range covers consumer-electronics thermal envelopes with adequate heatsinking.
Рекомендуется
Industrial Ethernet Controller
The MPC855TZQ50D4 is deployed in industrial Ethernet controllers because its deterministic CPM handles real-time serial protocols (Modbus TCP, EtherNet/IP gateways) while the Power Architecture core runs the application layer. The 10/100 MAC plus HDLC channels support industrial fieldbus bridging, and the 0 to 95C operating range fits cabinet-mounted equipment. The 357-PBGA package provides robust mechanical and thermal characteristics required for industrial environments.
Рекомендуется
PCMCIA-Based Wireless Access Point
The MPC855TZQ50D4 is well-suited for legacy wireless access points with PCMCIA-based radio cards because its integrated PCMCIA host controller directly interfaces 16-bit PC Cards without external bridge logic. The Power Architecture core runs the AP management plane while the CPM services 802.11 frames via HDLC-style framing if required. The 10/100 Ethernet MAC connects to the wired uplink, and the 357-PBGA enables compact APW integrated via RF shield integration in a fanless plastic enclosure.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MPC855TZQ50D4 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MPC860ENZQ50D4R2 | MPC855TVR50D4 | MPC855TVR66D4 | MPC860DEZQ50D4 | MPC857DSLVR50B |
|---|---|---|---|---|---|---|
| Package | 357-PBGA (25x25 mm) | 357-PBGA (same) | 357-PBGA (same) | 357-PBGA (same) | 357-PBGA (same) | 357-PBGA (same) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 50 MHz | 50 MHz | 50 MHz | 66 MHz | 50 MHz | 50 MHz |
| Core Architecture | Power Architecture 32-bit | Power Architecture 32-bit | Power Architecture 32-bit | Power Architecture 32-bit | Power Architecture 32-bit | Power Architecture 32-bit |
| Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
| ATM SAR | Yes | Yes | Yes | Yes | Yes | Yes |
| PCMCIA Interface | Yes | Yes | Yes | Yes | Yes | Yes |
| CPM SCC Channels | 2 SCC | 4 SCC | 2 SCC | 2 SCC | 2 SCC | 2 SCC |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Ключевые отличия
- Integrated ATM SAR on-chip (против MPC860ENZQ50D4R2)
- Two SCC channels - lean CPM feature set (против MPC860ENZQ50D4R2)
- 50 MHz core - power-efficient access tier (против MPC855TVR66D4)
Заметки по проектированию
The MPC855TZQ50D4 requires both 3.3V I/O and a separate core voltage (typically 2.5V or 3.3V depending on revision); a multi-rail sequencer is recommended. Decouple each VDD/VCC pin with a 0.1 uF ceramic placed within 5 mm of the ball. Bulk 10 uF tantalum capacitors on each supply rail reduce CPM-induced transients during high-speed serial DMA bursts.
Use via-in-pad (VIP) or microvia construction under the 357-ball PBGA to route the 1.27 mm pitch BGA escape. Layer stack-up during B-to-A routing must maintain 50 ohm controlled impedance for the CPM clock and Ethernet differential pairs. A continuous ground plane on layer 2 directly beneath the BGA improves thermal dissipation and reduces supply noise.
At 50 MHz with full CPM activity, the MPC855TZQ50D4 dissipates approximately 1.0-1.5 W typical, well within the 357-PBGA thermal envelope on a 4-layer 1 oz copper PCB. For sealed enclosures with limited airflow, derate by 30% and verify with a thermocouple on the top center of the package during worst-case CPM loopback testing.
Do not assume the MPC855T and MPC860T are software-compatible at the CPM register level without verifying the UPM/IMMR mappings. System reset configuration word (RCW) bits must match the actual bus and clock topology. The PCMCIA interface requires external voltage-switching circuitry if 5V PC Cards are used; the MPC855T PCMCIA signals are 3.3V-only.
Информация о соответствии
Compliance status not present in verified data. The MPC855TZQ50D4 is a legacy 2002-era PowerQUICC part classified obsolete as of 2026-10-16; original compliance documentation is limited. RoHS status and lead-free status marked unknown and require direct confirmation with the distributor or NXP legacy support.
