MPC859PVR133A - 133MHz PowerQUICC MPC8xx MPU | NXP | Networking
Артикул: MPC859PVR133A ✗ Снят с производства| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $75.75 | $75,75 |
| 10 | $68.2 | $682,00 |
| 100 | $61.5 | $6.150,00 |
| 500 | $55.8 | $27.900,00 |
| 1.000 | $49.9 | $49.900,00 |
MPC859PVR133A Обзор
Аналоги без доработки для MPC859PVR133A — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MPC859PVR133A (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Core Architecture, Package, Process Technology, Series.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MPC859PZP133A
✅ Прямая замена✓ В наличии
$55.4 / шт.
Открыть даташит →MPC859TVR133A
✅ Прямая замена✓ В наличии
$54.1 / шт.
Открыть даташит →MPC855TVR66D4
✅ Прямая замена✓ В наличии
$55.4 / шт.
Открыть даташит →MPC859PVR133A-R5
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
MPC859PVR133A-T
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
MPC859PVR133A Максимальные параметры и электрические характеристики
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC MPC8xx |
| Core Architecture | Power Architecture, 32-bit RISC |
| Core Count | 1 |
| Core Speed | 133 MHz |
| Напряжение питания | 3.3 V |
| Process Technology | 0.18 µm CMOS |
| Корпус | 357-ball PBGA (25 x 25 mm) |
| Рабочая температура | 0 °C to +95 °C (Commercial) |
| Cache (I/D) | 4 Kbyte / 4 Kbyte |
| MMU | Yes (hardware memory management unit) |
| Communications Processor Module (CPM) | Integrated (4 SCC, 2 SMC, SPI, I²C) |
| Fast Ethernet Controllers | 3 |
| UTOPIA / PQM Interfaces | 2 |
| PCI Interface | Yes |
| Тип монтажа | Surface Mount (BGA) |
Руководство по цоколевке MPC859PVR133A в корпусе 357-ball pbga (25 x 25 mm)
Цоколевка для MPC859PVR133A (корпус 357-ball pbga (25 x 25 mm)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для MPC859PVR133A.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
MPC859PVR133A подходит для 6 применениеs: WAN / LAN Edge Router, DSLAM Line Card, Industrial Serial-to-Ethernet Gateway, ISDN Router / TA, T1 / E1 Multiplexer, Multi-Service Access Platform (MSAP).
WAN / LAN Edge Router
The MPC859PVR133A's integrated Communications Processor Module (CPM) with four SCC channels makes it a fit for low-to-mid-range WAN/LAN edge routers. Its 133 MHz Power Architecture core handles routing-table maintenance while the CPM offloads PPP, HDLC, and Ethernet framing in hardware, eliminating a companion ASIC. Three on-chip Fast Ethernet controllers provide switching-fabric or LAN-side connectivity without external MACs. Designers typically pair the part with a DDR memory controller and a small PHY; the 3.3 V single supply simplifies the power tree. Trade-off: NRND status means new designs should evaluate NXP LS1021A, but the part remains in service for legacy router repairs.
Рекомендуется
DSLAM Line Card
In DSLAM line cards the MPC859PVR133A is commonly deployed as the per-port control processor: the integrated UTOPIA/PQM interface (two ports) connects directly to a multi-channel xDSL framer, while the SCC/SMC channels drive management and T1/E1 backhaul. The 32-bit PowerPC core runs the line-card OS and PPPoE/PPPoA termination, while hardware ECC-protected SDRAM interface maintains link-state data. The 357-PBGA 25×25 mm footprint allows 24+ ports on a single line card. Power dissipation at 3.3 V × 133 MHz sits around 2-3 W, manageable with a small heatsink.
Рекомендуется
Industrial Serial-to-Ethernet Gateway
The MPC859PVR133A combines Ethernet MACs with multiple SCC channels, making it well matched to industrial gateways that bridge RS-232/RS-485 to Ethernet. The CPM can be configured to run Modbus RTU on one SCC while a Fast Ethernet MAC serves 10/100 Mbps traffic; the on-chip MMU enables RTOS-based protocol stacks. The 0 °C to +95 °C commercial-temperature grade suits indoor control cabinets; outdoor deployments require the industrial 'I' suffix variant. Hardware flow control, DMA-driven SCC buffering, and hardware CRC relieve the CPU of byte-level work.
Рекомендуется
ISDN Router / TA
For ISDN terminal adapters and small-office routers, the MPC859PVR133A's hardware SCC channels implement HDLC framing for the ISDN BRI/U interface directly in silicon. The integrated PCI bus lets the designer pair it with a low-cost ISDN framer or wireless WAN modem. The 4+4 Kbyte cache and MMU accelerate encryption for VPN tunnels; the 0.18 µm CMOS process delivers low standby power suitable for always-on SOHO equipment. Replacement designs should look at integrated PowerQUICC II successors with reduced BOM.
Рекомендуется
T1 / E1 Multiplexer
T1/E1 multiplexer designs use the MPC859PVR133A as the central cross-connect: two SCC channels can run HDLC-framed T1/E1 lines simultaneously while the remaining SCC channels aggregate Ethernet or serial control traffic. The CPM's BDMA channels move payload data between TDM ports and memory without CPU intervention, sustaining full E1 (2.048 Mbps) framing on all channels concurrently. Hardware clock recovery and per-channel DMA prioritization reduce jitter. A 357-BGA multilayer board with controlled-impedance traces is required.
Рекомендуется
Multi-Service Access Platform (MSAP)
In MSAP / next-generation DLC equipment the MPC859PVR133A acts as the central element manager: it terminates Ethernet uplink traffic from multiple subtended DSL line cards over PCI, while a UTOPIA interface aggregates ATM cells from the access side. The integrated MMU and 4+4 Kbyte cache keep routing tables in fast memory; the CPM's RISC engine executes PPP and ATM AAL2 protocols in parallel to the Power Architecture core. Three Fast Ethernet MACs support redundant uplinks. Trade-off: for new MSAP builds, NXP QorIQ P1022 provides higher integration.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MPC859PVR133A — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MPC859PZP133A | MPC859TVR133A | MPC855TVR66D4 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-BGA (25x25 mm) | 357-BGA (25x25 mm) - same | 357-BGA (25x25 mm) - same | 357-BGA (25x25 mm) - same |
| Core Architecture | Power Architecture, 32-bit | Power Architecture, 32-bit | Power Architecture, 32-bit | Power Architecture, 32-bit |
| Core Frequency | 133 MHz | 133 MHz | 133 MHz | 66 MHz (-50%) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Fast Ethernet Controllers | 3 | 3 | Different count - verify | 2 |
| Process Technology | 0.18 µm CMOS | 0.18 µm CMOS | 0.18 µm CMOS | 0.25 µm CMOS |
| Operating Temperature | 0 °C to +95 °C | 0 °C to +95 °C | 0 °C to +95 °C | 0 °C to +95 °C |
Ключевые отличия
- Integrated 4-SCC + 2-SMC + SPI + I²C communications engine on die (против MPC855TVR66D4)
- Three on-chip Fast Ethernet MACs (против MPC855TVR66D4)
- 0.18 µm CMOS process for lower active power vs 0.25 µm predecessor (против MPC855TVR66D4)
- Integrated PCI interface (против MPC850 family without PCI)
Заметки по проектированию
The 357-BGA at 25 × 25 mm has a ball pitch typically under 1.0 mm; breakout routing requires a multilayer PCB (8 or more layers recommended) with microvia or laser-drilled blind-via technology. Place at least one 0.1 µF X7R decoupling capacitor within 50 mils of every supply ball pair, and a bulk 10 µF tantalum or polymer capacitor near the package's supply ring.
Estimated: at 3.3 V supply, 133 MHz core, and typical 1.5-2 W active power draw, the 357-BGA on a 4-layer board with moderate copper pour holds junction rise under 30 °C above ambient. If the design runs the CPM at full utilization with all four SCCs and three Ethernet MACs active simultaneously, power may climb to 2.5-3 W; add a copper spreader or attach a small stamped heatsink to the lid.
Do not assume the MPC859PVR133A and MPC859TVR133A (or MPC859PZP133A) are interchangeable - the part-number suffix encodes both feature-set and revision differences. The Mouser listing flags the standard PVR133A as 'NO-PB' (non-RoHS leaded finish); if your build requires RoHS, order the explicit Pb-Free suffix variant and verify against the manufacturer's material declaration.
Route the SDRAM interface (address/command in one group, data in a matched-length group) to keep skew under 50 ps. Place the 50 MHz system clock oscillator within 200 mils of the CLK pin with a continuous ground reference plane below; avoid routing the clock trace over any split-plane gaps to prevent jitter and false edges on Reset Configuration.
Информация о соответствии
Mouser listing classifies the standard MPC859PVR133A as 'NO-PB' (non-RoHS leaded BGA finish). Order the Pb-Free suffix variant for RoHS-compliant builds. AEC-Q100 qualification not applicable for this commercial MPU.
