NXP Semiconductors

MPC860DTVR66D4 - PowerQUICC MPU 66MHz 357-PBGA | NXP

Артикул: MPC860DTVR66D4 ✗ Снят с производства
В наличии Отправка в течение 1–3 рабочих дней
3.3 V Vdss 357-BGA (PBGA, 25x25 mm) Package 66 MHz Speed
От $78.9 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-16
Оптовые цены
Кол-во Цена за ед. Итого
1 $116.53 $116,53
10 $105.2 $1.052,00
100 $92.4 $9.240,00
500 $84.75 $42.375,00
1.000 $78.9 $78.900,00
ℹ️ Все цены указаны в USD

MPC860DTVR66D4 Обзор

The NXP MPC860DTVR66D4 is a PowerQUICC 32-bit Power Architecture microprocessor running at 66 MHz, integrating a PowerPC core with the Communications Processor Module (CPM) and a 357-pin Plastic BGA (PBGA) 25x25 mm package. The device combines a 32-bit RISC CPU core, the CPM for HDLC/ATM/10 Mbps Ethernet, PCMCIA interface logic, DRAM controller, and on-chip peripherals in a single system-on-chip.

A PowerQUICC microprocessor belongs to the MPU (microprocessor unit) class of integrated circuits, historically positioned as a communications-centric system-on-chip that merges a PowerPC processor core with dedicated serial-protocol engines. In the system hierarchy, it sits above general-purpose microcontrollers, offering higher deterministic I/O bandwidth for telecom and networking equipment where offloading protocol framing from the CPU is essential.

Key features include the integrated CPM with RISC communication engines, dual 10 Mbps Ethernet MACs, ATM and HDLC support, PCMCIA controller, DRAM controller with bus sizing logic, and the standard PowerPC memory management unit. The 66 MHz core clock drives both the CPU and the CPM, while the external bus supports 32-bit data paths at up to 66 MHz. The 3.3 V supply rail and 0 to 95 C operating temperature make it suitable for industrial embedded systems.

Typical applications include telecom switching fabric, ISDN terminal adapters, ATM/Frame Relay access devices, industrial routers, and legacy networking equipment. The combination of CPU + CPM is especially valuable where deterministic serial-channel handling must coexist with higher-layer protocol stacks without external ASICs.

When designing with this device, note that the 357-PBGA package requires multi-layer PCB design with controlled-impedance routing for the external bus; verified JTAG and BDM debug tools must be used for development. The part is Not For New Designs per distributor listings, so consider migration to MPC860SAR or newer PowerQUICC II/III variants for new projects.

This page synthesizes distributor pricing, drop-in alternatives within the MPC860 family, and practical design notes not found in the manufacturer datasheet alone.

Аналоги без доработки для MPC860DTVR66D4 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с MPC860DTVR66D4 (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Core Architecture, RoHS Status, Category, Data Bus Width.

NXP Semiconductors
Operating Temperature: 0 °C to +95 °C
Category: Microprocessors (MPU)
Data Bus Width: 32 bit
Сравнить с MPC860DTVR66D4 →
NXP Semiconductors
Operating Temperature: -40C to +95C (industrial, per D4 revision)
Core Architecture: 32-bit PowerPC
RoHS Status: Non-Compliant (Contains Lead)
Сравнить с MPC860DTVR66D4 →
NXP Semiconductors
Operating Temperature: 0 °C to +70 °C
Core Architecture: PowerPC, 32-bit
RoHS Status: RoHS non-compliant (Contains Lead)
Сравнить с MPC860DTVR66D4 →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MPC860DTVR80D4

✅ Прямая замена
📦 357-PBGA (25x25 mm)
Same 357-PBGA footprint, 80 MHz vs 66 MHz core clock (+21% clock speed), identical peripheral set

📋 Справочный аналог (нет в каталоге)

MPC860PVR80D4

✅ Прямая замена
📦 357-PBGA (25x25 mm)
Same 357-PBGA 25x25 footprint, 80 MHz vs 66 MHz, slightly different peripheral mix but pin-compatible

📋 Справочный аналог (нет в каталоге)

MPC860PZQ66D4

✅ Прямая замена
NXP Semiconductors
📦 357-PBGA (25x25 mm)
PowerQUICC MPC8xx · 32-bit PowerPC · 1 · 66 MHz · 3.3 V · 357-PBGA (25x25 mm) · Surface Mount · Contains Lead (non-RoHS)

✓ В наличии

$102.02 / шт.

Открыть даташит →

MPC860TZQ66D4

✅ Прямая замена
NXP Semiconductors
📦 357-PBGA (25x25 mm)
NXP Semiconductors · MPC8xx PowerQUICC · PowerPC, 32-bit · 1 · 66 MHz · 3.3 V · 357-PBGA (25x25 mm) · Tray

✓ В наличии

$81.28 / шт.

Открыть даташит →

MPC855TCVR66D4

✅ Прямая замена
📦 357-PBGA (25x25 mm)
Same 357-PBGA footprint, 66 MHz, MPC855 family with reduced peripheral set vs MPC860

📋 Справочный аналог (нет в каталоге)

MPC857TCVR66B

✅ Прямая замена
📦 357-PBGA (25x25 mm)
Same 357-PBGA footprint, 66 MHz, MPC857 variant with different peripheral mix per Utmel comparison

📋 Справочный аналог (нет в каталоге)

MPC860DTVR66D4 Максимальные параметры и электрические характеристики

Core Architecture PowerPC (MPC8xx)
Core Count 1
Разрядность шины данных 32-bit
Max Core Frequency 66 MHz
Рабочее напряжение питания 3.3 V
Series MPC8xx / PowerQUICC
Корпус / Типоразмер 357-BGA (PBGA, 25x25 mm)
Тип монтажа Surface Mount
Рабочая температура 0 C to +95 C
Packaging Tray
On-chip Peripherals CPM, ENET, ATM, HDLC, PCMCIA
Ethernet 10 Mbps x2
Graphics Acceleration No
Lead Free Status Lead Free
Статус RoHS RoHS Compliant
Part Status Not For New Designs

Руководство по цоколевке MPC860DTVR66D4 в корпусе 357-bga (pbga, 25x25 mm)

Цоколевка для MPC860DTVR66D4 (корпус 357-bga (pbga, 25x25 mm)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.

Схема цоколевки корпуса 357-bga (pbga, 25x25 mm) для MPC860DTVR66D4

Нет подробных данных о распиновке для MPC860DTVR66D4.

Обратитесь к даташиту для полной конфигурации выводов.

Типичное применение

MPC860DTVR66D4 подходит для 6 применениеs: Telecom Switching Fabric, ISDN Terminal Adapter, ATM / Frame Access Access Concentrator, Industrial Router, Legacy Networking Equipment Service Replacement, Embedded Communications Controller.

🌐

Telecom Switching Fabric

The MPC860DTVR66D4 fits telecom switching fabric designs because its integrated Communications Processor Module (CPM) offloads HDLC and ATM framing from the PowerPC core, freeing the 32-bit CPU to run higher-layer signaling stacks. At 66 MHz the device handles multiple T1/E1 channels simultaneously with deterministic latency, which is essential for PBX and central-office equipment where call-setup jitter is unacceptable. The dual 10 Mbps Ethernet MACs provide LAN-side connectivity for management and signaling traffic without an external MAC ASIC, reducing BOM cost and board area. Compared with discrete CPU + framer solutions, the single-chip integration cuts PCB layer count and improves mean time between failure in 24/7 carrier deployments. Place the device on a six-layer board with the 357-PBGA mounted on via-in-pad land pattern for reliable thermal performance and controlled-impedance bus routing.

📱

ISDN Terminal Adapter

The MPC860DTVR66D4 is a strong fit for ISDN terminal adapters because the CPM's HDLC engine natively handles the LAPD protocol used on the ISDN D-channel, while the 66 MHz PowerPC core runs the higher-layer state machines and user interface. Integrating both the BRI line-side and the Ethernet LAN-side into one SoC eliminates the external framer chip and reduces bill-of-materials cost in residential gateway designs. The PCMCIA controller supports legacy PC-card modems for fallback connectivity, a useful feature for ISDN routers sold into European markets in the early 2000s. At 3.3 V core supply and 0 to 95 C operating temperature, the device fits standard indoor SOHO enclosures without active cooling. Compared with general-purpose MCUs, the deterministic CPM interrupts guarantee channel latency within microseconds even under heavy CPU load.

🖥️

ATM / Frame Access Access Concentrator

The MPC860DTVR66D4 is purpose-built for ATM and Frame Relay access concentrators because its CPM includes dedicated segmentation and reassembly (SAR) engines for ATM cells and HDLC controllers for Frame Egress, all running concurrently with the PowerPC core. At 66 MHz the device can sustain multiple DS1/E1 links aggregating into a single uplink without dropping cells under bursty traffic conditions. The integrated DRAM controller with bus-sizing logic interfaces directly to industry-standard SDRAM and FPGAs, simplifying the data-path design. The 357-PBGA package supports the high pin density required for parallel ATM UTOPIA-style interfaces plus Ethernet MACs, all within a single chip. Compared with merchant-silicon ATM chipsets, the PowerQUICC SoC approach gives OEMs full software control over queuing and congestion management.

🏭

Industrial Router

The MPC860DTVR66D4 is well suited to industrial routers because its dual 10 Mbps Ethernet MACs support redundant LAN uplinks while the CPM handles WAN serial protocols including HDLC, PPP, and Frame Relay, all without an external communications ASIC. At 66 MHz the PowerPC core comfortably runs routing stacks such as Linux or VxWorks with the CPM offloading the time-critical packet processing. The 0 to 95 C commercial operating temperature range covers most factory-floor enclosures, while the 3.3 V supply simplifies integration into 24 V industrial power systems with standard buck regulators. Compared with later PowerQUICC II devices, the MPC860 family remains a cost-effective choice for low-port-count industrial routers in legacy installations.

🔧

Legacy Networking Equipment Service Replacement

The MPC860DTVR66D4 is primarily needed today as a service-replacement part for long-life-cycle networking equipment still in the field, including carrier-grade routers, ATM switches, and industrial gateways deployed in the late 1990s and early 2000s. Because the part is NRND, replacement inventory is sourced from authorized distributors and franchised brokers like Rochester Electronics who hold qualified legacy stock. The 357-PBGA 25x25 mm footprint is consistent across the MPC860 family, so service boards can be reworked with the MPC860DTVR80D4 for additional clock headroom. Compared with full system replacement, swapping an identical-footprint PowerQUICC SoC preserves the chassis, backplane, and firmware qualification cycle, dramatically reducing field-service cost.

🧩

Embedded Communications Controller

The MPC860DTVR66D4 also fits embedded communications controller applications such as protocol converters, serial-to-Ethernet bridges, and SCADA front-ends where deterministic serial-channel timing is more important than raw CPU throughput. The CPM's multiple SCCs and SMCs provide flexible serial interfaces for RS-232, RS-485, and V.35 links, while the 66 MHz PowerPC core runs the protocol-conversion firmware and management stack. The integrated PCMCIA controller supports removable memory cards for firmware updates in field installations, a feature valued in unmanned remote sites. At 3.3 V and 0 to 95 C the part integrates into compact fanless enclosures common in factory automation cabinets. Compared with microcontroller-plus-external-framer designs, the single-chip approach reduces PCB area by roughly 40 percent.

Сводка рекомендуемых товаров

MPC860DTVR80D4 Higher-clock drop-in upgrade Используется в: Telecom Switching Fabric, ISDN Terminal Adapter, ATM / Frame Access Access Concentrator, Legacy Networking Equipment Service Replacement, Embedded Communications Controller MPC860PVR80D4 Alternative peripheral mix at 80 MHz Используется в: Telecom Switching Fabric, Industrial Router MPC855TCVR66D4 Lower-cost MPC855 variant for less-demanding ports Используется в: ATM / Frame Access Access Concentrator, Embedded Communications Controller MPC860PZQ66D4 NXP Semiconductors Используется в: Legacy Networking Equipment Service Replacement
What is the operating frequency of MPC860DTVR66D4?
The MPC860DTVR66D4 operates at a maximum core frequency of 66 MHz. According to the NXP MPC860 datasheet, the device drives both the PowerPC core and the Communications Processor Module (CPM) from the same 66 MHz clock, with the external memory bus capable of running at the same frequency. The "66" suffix in the part number explicitly denotes this 66 MHz speed grade within the MPC860 family.
What package does the MPC860DTVR66D4 use?
The MPC860DTVR66D4 ships in a 357-ball Plastic BGA (PBGA) measuring 25 x 25 mm. According to the NXP datasheet, this is the standard high-density package for the PowerQUICC MPC860 family, supporting the full 32-bit external bus plus integrated peripherals. The BGA footprint requires multi-layer PCB design with via-in-pad capability for reliable assembly and controlled-impedance routing for high-speed signals.
Is the MPC860DTVR66D4 still in production?
No, the MPC860DTVR66D4 is classified as Not For New Designs (NRND) by NXP and its authorized distributors. Per NXP's product page and ABC Semiconductor listings, new product introductions using this exact part should plan for migration to later PowerQUICC II or PowerQUICC III devices. Existing designs can continue to source stock through authorized distributors and brokers like Rochester Electronics who hold legacy inventory.
What is the operating temperature range of MPC860DTVR66D4?
The MPC860DTVR66D4 operates from 0 C to +95 C junction temperature. According to the NXP product page, this commercial-grade temperature range makes the device suitable for controlled-environment telecom equipment, indoor networking hardware, and industrial embedded systems with adequate chassis airflow. For extended-temperature outdoor deployments, designers should evaluate the MPC860T variants which offer different temperature grades.
Where can I buy MPC860DTVR66D4 online?
The MPC860DTVR66D4 can be ordered through authorized distributors including DigiKey (PN 955018), Mouser, Newark/Element14 (PN 85AK9106), and Heisener. Distributor inventory as of 2026-10-17 shows approximately 5,472 pieces in stock via Heisener, with lead times confirmed at order placement. Independent distributors and brokers such as Rochester Electronics also carry verified stock for legacy NXP parts.
What is the price of MPC860DTVR66D4?
The MPC860DTVR66D4 unit price is approximately $116.53 for single-piece orders as of 2026-10-17, per Heisener distributor listings. Volume pricing drops to roughly $92.40 at 100 pieces and $78.90 at 1000 pieces. Pricing reflects the part's NRND status and legacy positioning; lead times may extend beyond standard catalog parts due to limited remaining inventory.
What is the lead time for MPC860DTVR66D4?
Lead time for the MPC860DTVR66D4 is confirmed at order placement, with estimated delivery between July 1 and July 6 per Heisener's 2026-10-17 inventory snapshot. Because the part is NRND, lead times fluctuate based on remaining distributor stock rather than scheduled factory production runs. Engineers should confirm availability early in the design cycle and consider placing safety stock orders for production builds.
Is MPC860DTVR66D4 in stock at distributors?
Yes, the MPC860DTVR66D4 is currently in stock at Heisener with approximately 5,472 pieces available as of 2026-10-17, and listed as orderable at DigiKey, Mouser, and Newark/Element14. Per NXP's NRND classification, future replenishment is not guaranteed, so designers should secure sufficient inventory for the product lifecycle or plan migration paths to active PowerQUICC variants.
What is the difference between MPC860DTVR66D4 and MPC860TVR66D4?
The MPC860DTVR66D4 and MPC860TVR66D4 differ primarily in peripheral integration and temperature grade. Per NXP product pages, the MPC860DTVR66D4 is the full-featured PowerQUICC SoC with CPM, dual Ethernet, ATM, HDLC, and PCMCIA, while the MPC860TVR66D4 is a stripped-down communications processor variant. Both share the 357-PBGA package and 66 MHz core, making them functionally close but not pin-to-pin equivalents.
MPC860DTVR66D4 vs MPC860TZQ66D4 - which should I choose?
The MPC860DTVR66D4 and MPC860TZQ66D4 are both 66 MHz MPC8xx devices in the 357-PBGA 25x25 mm package, but the TZQ variant typically denotes a different feature subset and packaging code. Per JAK Electronics comparison data, both parts share the core architecture and pinout, but verify peripheral and temperature differences against your firmware before substituting. For new designs the DTVR remains the standard PowerQUICC reference.
What is the best drop-in replacement for MPC860DTVR66D4?
The best drop-in replacement for the MPC860DTVR66D4 within the same 357-PBGA 25x25 mm footprint is the MPC860DTVR80D4, which raises the core clock from 66 MHz to 80 MHz while preserving the pinout. Per NXP family documentation, all MPC860DT variants share the same ball map, so firmware developers can swap without PCB changes. For modern designs, consider migration to the PowerQUICC II MPC8275 family with software-compatible peripherals.
When should I choose MPC860DTVR66D4 over MPC860PVR80D4?
Choose the MPC860DTVR66D4 when your firmware requires the full dual-Ethernet + ATM + HDLC + PCMCIA peripheral set at a 66 MHz clock, particularly for legacy telecom designs. Choose the MPC860PVR80D4 when you need higher throughput (80 MHz core) and a different peripheral configuration in the same 357-PBGA footprint. Per ETEI comparison data, both parts share package dimensions but differ in peripheral integration and clock speed.
Can MPC860DTVR66D4 be used in industrial control applications?
Yes, the MPC860DTVR66D4 is suitable for industrial control applications requiring deterministic serial-channel handling alongside a 32-bit processor core. Per the NXP datasheet, the integrated CPM offloads HDLC, ATM, and Ethernet framing, freeing the core for control-loop and HMI code. The 0 to 95 C operating range covers most indoor industrial enclosures, though harsh-environment deployments should evaluate the wider-temperature MPC860T variants.
Where to download MPC860DTVR66D4 datasheet PDF?
The MPC860DTVR66D4 datasheet PDF can be downloaded from the NXP product page at https://www.nxp.com/part/MPC860DTVR66D4 or directly from NXP's documentation portal as MPC860EC.pdf. The datasheet contains DC/AC electrical characteristics, AC timing specifications, CPM register descriptions, and the full 357-PBGA pinout. Third-party sites such as chipdig.com and FindIC also mirror the PDF for engineering convenience.
What are the key specifications of MPC860DTVR66D4 that engineers should know?
Engineers evaluating the MPC860DTVR66D4 should focus on these core specifications: 66 MHz PowerPC core, 32-bit data bus, 3.3 V supply, 357-PBGA 25x25 mm package, 0 to 95 C operating range, integrated dual 10 Mbps Ethernet, CPM with HDLC and ATM support, PCMCIA controller, and DRAM controller with bus sizing. The device is NRND, so plan migration paths for new product introductions per the NXP product page.

Справочные инженерные данные для MPC860DTVR66D4 — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MPC860DTVR66D4 when you need the full PowerQUICC peripheral set (dual Ethernet, ATM, HDLC, PCMCIA) at 66 MHz in a single 357-PBGA package, particularly for legacy telecom or industrial router designs. Choose the MPC860DTVR80D4 if you need ~21% more throughput and can accept higher power dissipation within the same footprint. Choose the MPC860PVR80D4 when a single Ethernet MAC is sufficient and you prefer the 80 MHz clock for faster routing-stack execution. Choose the MPC855TCVR66D4 only for cost-sensitive designs where ATM and HDLC offload are not required. All six alternatives share the same 357-PBGA footprint, so PCB layout is reusable across the family for service and migration scenarios.

Сравнение с аналогами

Параметр Этот товар MPC860DTVR80D4 MPC860PVR80D4 MPC860PZQ66D4 MPC860TZQ66D4 MPC855TCVR66D4 MPC857TCVR66B
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 357-PBGA (25x25 mm) 357-PBGA (25x25 mm) - same 357-PBGA (25x25 mm) - same 357-PBGA (25x25 mm) - same 357-PBGA (25x25 mm) - same 357-PBGA (25x25 mm) - same 357-PBGA (25x25 mm) - same
Core Clock 66 MHz 80 MHz 80 MHz 66 MHz 66 MHz 66 MHz 66 MHz
Core Architecture PowerPC MPC8xx PowerPC MPC8xx PowerPC MPC8xx PowerPC MPC8xx PowerPC MPC8xx PowerPC MPC8xx PowerPC MPC8xx
Data Bus Width 32-bit 32-bit 32-bit 32-bit 32-bit 32-bit 32-bit
Operating Voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
On-chip Ethernet 10 Mbps x2 10 Mbps x2 10 Mbps x1 10 Mbps x2 10 Mbps x1 10 Mbps x1 10 Mbps x1
CPM / HDLC / ATM Yes Yes Yes Yes Yes Reduced Reduced
Operating Temperature 0 C to +95 C 0 C to +95 C 0 C to +95 C 0 C to +95 C 0 C to +95 C 0 C to +95 C 0 C to +95 C
Lifecycle Status NRND NRND NRND NRND NRND NRND NRND

Ключевые отличия

  • Full peripheral integration at lowest clock in family (против MPC860DTVR80D4)
  • Dual 10 Mbps Ethernet MACs (против MPC860PVR80D4)
  • ATM SAR engine integrated (против MPC855TCVR66D4)

Заметки по проектированию

The 357-PBGA 25x25 mm package requires a six-layer PCB with via-in-pad construction for reliable assembly. Place a continuous ground plane beneath the device to provide both a low-impedance return path for the high-speed external bus and thermal spreading for the 3.3 V core supply. Per the NXP MPC860 hardware specifications document, all BGA signal balls must be routed on inner layers with microvia fan-out, and the outer layers reserved for power and ground pour.

Estimated: at 3.3 V core supply and 66 MHz with typical CPM activity, the MPC860DTVR66D4 dissipates roughly 1.5 to 2.0 W depending on I/O switching activity. The 357-PBGA package provides adequate thermal performance in still air up to about 60 C ambient, but in enclosed chassis without airflow, attach a small heatsink or thermal pad to the top of the package to keep junction temperature below 95 C.

Route the 32-bit external memory bus with matched-length traces to within +/- 1 cm to preserve setup and hold margins at 66 MHz. Per the NXP datasheet, the SDRAM clock output must be tuned with a series resistor to dampen reflections, and the bus should be terminated at the far end with a parallel resistor network only if multiple devices share the bus.

Do not assume all MPC860 variants share the exact same peripheral pinout despite the common 357-PBGA package. The MPC855T and MPC857T variants have different CPM configurations, so verify each ball map against your schematic before substituting. The NRND status means firmware developers must plan migration paths to PowerQUICC II (MPC8275) or PowerQUICC III (MPC8560) for new product introductions.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Compliant

RoHS compliant and lead free per NXP product page and distributor listings. Not AEC-Q100 qualified - this is a commercial-grade MPU intended for telecom and networking equipment, not automotive. Halogen-free status not explicitly stated in verified data.

Данные проверены: 2026-10-17 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors MPC860DTVR66D4 MPC860DTVR80D4 MPC860PVR80D4 MPC860PZQ66D4 MPC860TZQ66D4 MPC855TCVR66D4 MPC857TCVR66B PowerQUICC MPC8xx PowerPC MPU microprocessor unit CPM Communications Processor Module HDLC ATM Ethernet MAC PCMCIA DRAM controller 357-PBGA BGA surface mount RoHS AEC-Q100 industrial router telecom switching ISDN terminal adapter NRND Not For New Designs
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