MPC860DTVR66D4 - PowerQUICC MPU 66MHz 357-PBGA | NXP
N.º da peça: MPC860DTVR66D4 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $116.53 | $116,53 |
| 10 | $105.2 | $1.052,00 |
| 100 | $92.4 | $9.240,00 |
| 500 | $84.75 | $42.375,00 |
| 1.000 | $78.9 | $78.900,00 |
MPC860DTVR66D4 Visão geral
A PowerQUICC microprocessor belongs to the MPU (microprocessor unit) class of integrated circuits, historically positioned as a communications-centric system-on-chip that merges a PowerPC processor core with dedicated serial-protocol engines. In the system hierarchy, it sits above general-purpose microcontrollers, offering higher deterministic I/O bandwidth for telecom and networking equipment where offloading protocol framing from the CPU is essential.
Key features include the integrated CPM with RISC communication engines, dual 10 Mbps Ethernet MACs, ATM and HDLC support, PCMCIA controller, DRAM controller with bus sizing logic, and the standard PowerPC memory management unit. The 66 MHz core clock drives both the CPU and the CPM, while the external bus supports 32-bit data paths at up to 66 MHz. The 3.3 V supply rail and 0 to 95 C operating temperature make it suitable for industrial embedded systems.
Typical applications include telecom switching fabric, ISDN terminal adapters, ATM/Frame Relay access devices, industrial routers, and legacy networking equipment. The combination of CPU + CPM is especially valuable where deterministic serial-channel handling must coexist with higher-layer protocol stacks without external ASICs.
When designing with this device, note that the 357-PBGA package requires multi-layer PCB design with controlled-impedance routing for the external bus; verified JTAG and BDM debug tools must be used for development. The part is Not For New Designs per distributor listings, so consider migration to MPC860SAR or newer PowerQUICC II/III variants for new projects.
This page synthesizes distributor pricing, drop-in alternatives within the MPC860 family, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para MPC860DTVR66D4 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MPC860DTVR66D4 (mesmo formato e footprint) — diferindo em Operating Temperature, Core Architecture, RoHS Status, Category, Data Bus Width.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MPC860DTVR80D4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC860PVR80D4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC860PZQ66D4
✅ Drop-In✓ Em estoque
$102.02 / unidade
Ver ficha técnica →MPC860TZQ66D4
✅ Drop-In✓ Em estoque
$81.28 / unidade
Ver ficha técnica →MPC855TCVR66D4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC857TCVR66B
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MPC860DTVR66D4 Classificações máximas e características elétricas
| Core Architecture | PowerPC (MPC8xx) |
| Core Count | 1 |
| Largura do barramento de dados | 32-bit |
| Max Core Frequency | 66 MHz |
| Tensão de alimentação de operação | 3.3 V |
| Series | MPC8xx / PowerQUICC |
| Encapsulamento / Caixa | 357-BGA (PBGA, 25x25 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0 C to +95 C |
| Packaging | Tray |
| On-chip Peripherals | CPM, ENET, ATM, HDLC, PCMCIA |
| Ethernet | 10 Mbps x2 |
| Graphics Acceleration | No |
| Lead Free Status | Lead Free |
| Status RoHS | RoHS Compliant |
| Part Status | Not For New Designs |
Guia de Configuração de Pinos do MPC860DTVR66D4 357-bga (pbga, 25x25 mm)
Configuração de pinos para MPC860DTVR66D4 (pacote 357-bga (pbga, 25x25 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para MPC860DTVR66D4.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
MPC860DTVR66D4 é adequado para 6 aplicaçãos: Telecom Switching Fabric, ISDN Terminal Adapter, ATM / Frame Access Access Concentrator, Industrial Router, Legacy Networking Equipment Service Replacement, Embedded Communications Controller.
Telecom Switching Fabric
The MPC860DTVR66D4 fits telecom switching fabric designs because its integrated Communications Processor Module (CPM) offloads HDLC and ATM framing from the PowerPC core, freeing the 32-bit CPU to run higher-layer signaling stacks. At 66 MHz the device handles multiple T1/E1 channels simultaneously with deterministic latency, which is essential for PBX and central-office equipment where call-setup jitter is unacceptable. The dual 10 Mbps Ethernet MACs provide LAN-side connectivity for management and signaling traffic without an external MAC ASIC, reducing BOM cost and board area. Compared with discrete CPU + framer solutions, the single-chip integration cuts PCB layer count and improves mean time between failure in 24/7 carrier deployments. Place the device on a six-layer board with the 357-PBGA mounted on via-in-pad land pattern for reliable thermal performance and controlled-impedance bus routing.
Recomendado
ISDN Terminal Adapter
The MPC860DTVR66D4 is a strong fit for ISDN terminal adapters because the CPM's HDLC engine natively handles the LAPD protocol used on the ISDN D-channel, while the 66 MHz PowerPC core runs the higher-layer state machines and user interface. Integrating both the BRI line-side and the Ethernet LAN-side into one SoC eliminates the external framer chip and reduces bill-of-materials cost in residential gateway designs. The PCMCIA controller supports legacy PC-card modems for fallback connectivity, a useful feature for ISDN routers sold into European markets in the early 2000s. At 3.3 V core supply and 0 to 95 C operating temperature, the device fits standard indoor SOHO enclosures without active cooling. Compared with general-purpose MCUs, the deterministic CPM interrupts guarantee channel latency within microseconds even under heavy CPU load.
Recomendado
ATM / Frame Access Access Concentrator
The MPC860DTVR66D4 is purpose-built for ATM and Frame Relay access concentrators because its CPM includes dedicated segmentation and reassembly (SAR) engines for ATM cells and HDLC controllers for Frame Egress, all running concurrently with the PowerPC core. At 66 MHz the device can sustain multiple DS1/E1 links aggregating into a single uplink without dropping cells under bursty traffic conditions. The integrated DRAM controller with bus-sizing logic interfaces directly to industry-standard SDRAM and FPGAs, simplifying the data-path design. The 357-PBGA package supports the high pin density required for parallel ATM UTOPIA-style interfaces plus Ethernet MACs, all within a single chip. Compared with merchant-silicon ATM chipsets, the PowerQUICC SoC approach gives OEMs full software control over queuing and congestion management.
Recomendado
Industrial Router
The MPC860DTVR66D4 is well suited to industrial routers because its dual 10 Mbps Ethernet MACs support redundant LAN uplinks while the CPM handles WAN serial protocols including HDLC, PPP, and Frame Relay, all without an external communications ASIC. At 66 MHz the PowerPC core comfortably runs routing stacks such as Linux or VxWorks with the CPM offloading the time-critical packet processing. The 0 to 95 C commercial operating temperature range covers most factory-floor enclosures, while the 3.3 V supply simplifies integration into 24 V industrial power systems with standard buck regulators. Compared with later PowerQUICC II devices, the MPC860 family remains a cost-effective choice for low-port-count industrial routers in legacy installations.
Recomendado
Legacy Networking Equipment Service Replacement
The MPC860DTVR66D4 is primarily needed today as a service-replacement part for long-life-cycle networking equipment still in the field, including carrier-grade routers, ATM switches, and industrial gateways deployed in the late 1990s and early 2000s. Because the part is NRND, replacement inventory is sourced from authorized distributors and franchised brokers like Rochester Electronics who hold qualified legacy stock. The 357-PBGA 25x25 mm footprint is consistent across the MPC860 family, so service boards can be reworked with the MPC860DTVR80D4 for additional clock headroom. Compared with full system replacement, swapping an identical-footprint PowerQUICC SoC preserves the chassis, backplane, and firmware qualification cycle, dramatically reducing field-service cost.
Recomendado
Embedded Communications Controller
The MPC860DTVR66D4 also fits embedded communications controller applications such as protocol converters, serial-to-Ethernet bridges, and SCADA front-ends where deterministic serial-channel timing is more important than raw CPU throughput. The CPM's multiple SCCs and SMCs provide flexible serial interfaces for RS-232, RS-485, and V.35 links, while the 66 MHz PowerPC core runs the protocol-conversion firmware and management stack. The integrated PCMCIA controller supports removable memory cards for firmware updates in field installations, a feature valued in unmanned remote sites. At 3.3 V and 0 to 95 C the part integrates into compact fanless enclosures common in factory automation cabinets. Compared with microcontroller-plus-external-framer designs, the single-chip approach reduces PCB area by roughly 40 percent.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MPC860DTVR66D4 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MPC860DTVR80D4 | MPC860PVR80D4 | MPC860PZQ66D4 | MPC860TZQ66D4 | MPC855TCVR66D4 | MPC857TCVR66B |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Core Clock | 66 MHz | 80 MHz | 80 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| Core Architecture | PowerPC MPC8xx | PowerPC MPC8xx | PowerPC MPC8xx | PowerPC MPC8xx | PowerPC MPC8xx | PowerPC MPC8xx | PowerPC MPC8xx |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Operating Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| On-chip Ethernet | 10 Mbps x2 | 10 Mbps x2 | 10 Mbps x1 | 10 Mbps x2 | 10 Mbps x1 | 10 Mbps x1 | 10 Mbps x1 |
| CPM / HDLC / ATM | Yes | Yes | Yes | Yes | Yes | Reduced | Reduced |
| Operating Temperature | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Principais diferenciais
- Full peripheral integration at lowest clock in family (vs MPC860DTVR80D4)
- Dual 10 Mbps Ethernet MACs (vs MPC860PVR80D4)
- ATM SAR engine integrated (vs MPC855TCVR66D4)
Notas de projeto
The 357-PBGA 25x25 mm package requires a six-layer PCB with via-in-pad construction for reliable assembly. Place a continuous ground plane beneath the device to provide both a low-impedance return path for the high-speed external bus and thermal spreading for the 3.3 V core supply. Per the NXP MPC860 hardware specifications document, all BGA signal balls must be routed on inner layers with microvia fan-out, and the outer layers reserved for power and ground pour.
Estimated: at 3.3 V core supply and 66 MHz with typical CPM activity, the MPC860DTVR66D4 dissipates roughly 1.5 to 2.0 W depending on I/O switching activity. The 357-PBGA package provides adequate thermal performance in still air up to about 60 C ambient, but in enclosed chassis without airflow, attach a small heatsink or thermal pad to the top of the package to keep junction temperature below 95 C.
Route the 32-bit external memory bus with matched-length traces to within +/- 1 cm to preserve setup and hold margins at 66 MHz. Per the NXP datasheet, the SDRAM clock output must be tuned with a series resistor to dampen reflections, and the bus should be terminated at the far end with a parallel resistor network only if multiple devices share the bus.
Do not assume all MPC860 variants share the exact same peripheral pinout despite the common 357-PBGA package. The MPC855T and MPC857T variants have different CPM configurations, so verify each ball map against your schematic before substituting. The NRND status means firmware developers must plan migration paths to PowerQUICC II (MPC8275) or PowerQUICC III (MPC8560) for new product introductions.
Informações de conformidade
RoHS compliant and lead free per NXP product page and distributor listings. Not AEC-Q100 qualified - this is a commercial-grade MPU intended for telecom and networking equipment, not automotive. Halogen-free status not explicitly stated in verified data.
