NXP Semiconductors

MRF5P21240HR6 - 52W 2110-2170 MHz W-CDMA RF Power LDMOS | NXP Semiconductors

Артикул: MRF5P21240HR6 ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
65 V minimum Vdss 2200 mA Id NI-1230 ceramic, HR6 suffix Package 2110 to 2170 MHz Speed
От $99.75 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-15
Оптовые цены
Кол-во Цена за ед. Итого
1 $145 $145,00
10 $132.5 $1.325,00
100 $119 $11.900,00
250 $109.5 $27.375,00
500 $99.75 $49.875,00
ℹ️ Все цены указаны в USD

MRF5P21240HR6 Обзор

The NXP Semiconductors MRF5P21240HR6 is a 52 W average, 28 V lateral N-channel enhancement-mode RF power MOSFET designed for W-CDMA base station applications in the 2110 to 2170 MHz band. Housed in the NI-1230 ceramic package (commonly referenced as the HR6 form factor), it delivers 13 dB power gain with a 28 V supply and supports 2-carrier W-CDMA at 52 W average output. The device is well suited for Class AB operation in PCN-PCS/cellular radio and WLL infrastructure.

RF power transistors such as the MRF5P21240HR6 sit within the LDMOS (Laterally Diffused Metal-Oxide Semiconductor) family - a subclass of power MOSFETs designed to combine high RF gain and ruggedness with reasonable cost. Within the broader taxonomy they are power transistors -> discrete semiconductors -> RF power devices. LDMOS has become the dominant technology for sub-3 GHz base-station PA stages because of its high breakdown voltage, excellent linearity gain in swept-back-off RF conditions, and ability to handle high peak-to-average ratios typical of multicarrier W-CDMA signals.

Key features include a minimum drain-source breakdown of 65 V (giving ample headroom above the 28 V operating rail), 603 W absolute maximum power dissipation, a common-source dual-element configuration, and surface-mount ceramic packaging. The device's 13 dB gain at 2.11 GHz and its high-efficiency performance under 2-carrier W-CDMA drive conditions make it a workhorse final-stage transistor for UMTS Band I (uplink/downlink) power amplifiers.

Architecturally, the MRF5P21240HR6 is built on NXP's 7th-generation (Gen7) high-voltage LDMOS process, which places two dies inside a single ceramic NI-1230 housing to achieve the 52 W average output level. Internally matched on the input and partially matched on the output for the 2110-2170 MHz band, the device is biased at IDQ = 2200 mA with VDD = 28 V to deliver its rated linear output power.

Typical applications include W-CDMA/UMTS base-station PAs (Band I), 2-carrier multi-carrier amplifier bricks, and cellular repeaters. Designers choose this part when they need proven LDMOS ruggedness in surface-mount ceramic packaging for high-power macro-cell or micro-cell infrastructure.

A practical design tip: the HR6 suffix denotes a lower-thermal-resistance ceramic package compared to the older MRF5P21240R6. When migrating from R6 to HR6 the PCB land pattern is identical, so existing base-station layouts can be reused without rework. Always verify load-pull impedance at your specific bias and frequency before finalizing the output matching network.

Аналоги без доработки для MRF5P21240HR6 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MRF5P21240R6

✅ Прямая замена
📦 NI-1230 ceramic
predecessor of HR6, same die and footprint, higher thermal resistance (~30% worse RthJC)

📋 Справочный аналог (нет в каталоге)

MRF5P21240HSR6

✅ Прямая замена
📦 NI-1230 ceramic
same NI-1230 footprint, screened/tested higher-reliability sample, identical RF specs

📋 Справочный аналог (нет в каталоге)

MRF5P21180HR6

✅ Прямая замена
📦 NI-1230 ceramic
1800-2000 MHz band variant (UMTS Band II/III), same NI-1230 footprint but ~60 MHz lower output power; pin-for-pin compatible

📋 Справочный аналог (нет в каталоге)

MRF5P21240HR6 Максимальные параметры и электрические характеристики

Тип транзистора LDMOS, N-Channel Enhancement-Mode Lateral MOSFET
Technology RF Power Field Effect Transistor
Configuration Common Source, 2 Elements
Operating Frequency Range 2110 to 2170 MHz
Drain-Source Voltage (VDS) Rated 65 V minimum
Test Supply Voltage (VDD) 28 V
Quiescent Current (IDQ) 2200 mA
Output Power (Pout, 2-carrier W-CDMA avg.) 52 W
Power Gain 13 dB at 2.11 GHz
Maximum Power Dissipation (Absolute) 603 W
Тип монтажа Surface Mount
Корпус NI-1230 ceramic, HR6 suffix
JESD-30 Code R-CDFM-F4
Terminal Position Dual
Target Application W-CDMA base-station power amplifier (UMTS Band I)
Bias Mode Class AB
Lead-Free Status Yes

Конфигурация выводов MRF5P21240HR6

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Контакт 1 Drain (D1) / RF Output — RF output, drain of internal die 1
Контакт 2 Gate (G1) / RF Input — RF input, gate of internal die 1
Контакт 3 Drain (D2) / RF Output — RF output, drain of internal die 2
Контакт 4 Gate (G2) / RF Input — RF input, gate of internal die 2

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Типичное применение

MRF5P21240HR6 подходит для 6 применениеs: UMTS Band I W-CDMA Macro-Cell Base-Station PA, Multi-Carrier Linear Power Amplifier, Cellular Repeater / WLL Infrastructure, PCN-PCS / Cellular Radio Final Stage, Defense / Tactical RF Power Amplifier, RF Test & Measurement Power Source.

🌐

UMTS Band I W-CDMA Macro-Cell Base-Station PA

The MRF5P21240HR6 is the reference final-stage LDMOS transistor for UMTS Band I (2110-2170 MHz) macro-cell base-station power amplifiers. Its 52 W 2-carrier W-CDMA average output rating and 13 dB gain at 28 V are sized exactly for the 40-60 W Pout envelope required per PA brick in a typical 3-sector macro site. Designers choose this part because its high linearity gain under swept-back-off RF and its 65 V breakdown headroom guarantee ACPR margins even at full multi-carrier drive.

📡

Multi-Carrier Linear Power Amplifier

The MRF5P21240HR6 is well suited to multi-carrier linear PA bricks that combine W-CDMA, LTE, and TD-SCDMA carriers in the same physical amplifier. Its LDMOS device's high peak-to-average tolerance and the NI-1230 ceramic package's low thermal resistance let the transistor sustain high dissipation without junction-temperature drift degrading linearity. Designers bias in Class AB at IDQ = 2200 mA and add digital predistortion (DPD) for ACLR compliance in multi-carrier macro sites.

📡

Cellular Repeater / WLL Infrastructure

The MRF5P21240HR6 is used in cellular repeater and WLL (Wireless Local Loop) infrastructure operating in the 2110-2170 MHz band, where a 52 W average LDMOS PA stage extends coverage from a donor antenna to remote indoor or rural subscribers. Its surface-mount ceramic NI-1230 housing simplifies the mechanical build into a sealed outdoor enclosure, and its 65 V breakdown provides safety margin under high VSWR loads that repeaters occasionally see on poorly terminated donor antennas.

🎧

PCN-PCS / Cellular Radio Final Stage

The MRF5P21240HR6 can be deployed in Class AB final stages of legacy PCN-PCS cellular radio transmitters in the 2110-2170 MHz band, where its 13 dB gain at 2.11 GHz and 28 V rail operation match conventional driver-stage chain architectures. The device's two-element common-source internal topology simplifies PCB-level combining when higher output is needed by paralleling multiple NI-1230 devices.

✈️

Defense / Tactical RF Power Amplifier

Ruggedized defense and electronic-warfare subsystems in the 2110-2170 MHz range can use the MRF5P21240HR6 as a final-stage amplifier where LDMOS's inherent VSWR tolerance and NXP's hermetic ceramic packaging provide the reliability needed for field deployments. The 65 V breakdown and 603 W absolute dissipation ceiling support high-duty-cycle waveforms that would otherwise require more expensive GaN devices.

🔬

RF Test & Measurement Power Source

Lab and production RF test equipment uses the MRF5P21240HR6 as a known-good W-CDMA power source for calibrating over-the-air (OTA) chambers, base-station test racks, and EMC immunity setups in the UMTS Band I spectrum. Its repeatable 52 W 2-carrier W-CDMA performance and NXP-published load-pull data make it a stable reference PA for ATE-based test stations that need consistent RF drive across many test cycles.

Сводка рекомендуемых товаров

MRF6P21240HR6 Higher-output 60 W upgrade for same band Используется в: UMTS Band I W-CDMA Macro-Cell Base-Station PA, Multi-Carrier Linear Power Amplifier MRF5P21180HR6 Same family for UMTS Band II/III (1800-2000 MHz) Используется в: UMTS Band I W-CDMA Macro-Cell Base-Station PA, Cellular Repeater / WLL Infrastructure, RF Test & Measurement Power Source MRF5P21240R6 Predecessor with same electrical performance Используется в: PCN-PCS / Cellular Radio Final Stage MRF5P21240HSR6 Higher-reliability screened variant Используется в: Defense / Tactical RF Power Amplifier
What is the operating frequency range of the MRF5P21240HR6?
The MRF5P21240HR6 operates from 2110 to 2170 MHz, covering the full UMTS Band I (W-CDMA uplink + downlink) used in European, Asian, and most global 3G macro-cell deployments. According to the NXP datasheet, the device is characterized across this band for 2-carrier W-CDMA at 52 W average output power with 28 V supply and IDQ = 2200 mA.
What output power does MRF5P21240HR6 deliver at 28 V in W-CDMA?
The MRF5P21240HR6 delivers 52 W average output power for a 2-carrier W-CDMA signal at 28 V VDD and IDQ = 2200 mA, per the NXP datasheet. Peak envelope power under this drive is substantially higher, so the PA stage built around this transistor is typically sized with significant back-off for linearity margin in macro-cell deployments.
What is the difference between MRF5P21240HR6 and MRF5P21240R6?
The MRF5P21240HR6 replaces the older MRF5P21240R6 with a lower thermal resistance ceramic package (HR6 suffix). NXP explicitly notes MRF5P21240R6 was replaced by MRF5P21240HR6. Both share the same NI-1230 ceramic footprint and identical electrical performance; HR6 simply runs cooler at the same dissipated power.
What package does the MRF5P21240HR6 use?
The MRF5P21240HR6 uses the NI-1230 ceramic package, a 4-terminal (R-CDFM-F4 per JESD-30) surface-mount ceramic housing with flanges for screw-down mounting to the heat-spreader. The HR6 variant has lower thermal resistance than the original R6 suffix and is surface-mount.
Is the MRF5P21240HR6 suitable for 4G LTE base stations?
Yes, the MRF5P21240HR6 is well suited for 4G LTE base stations operating in the 2110-2170 MHz UMTS Band I spectrum that has been re-farmed for LTE in many regions. Its 52 W 2-carrier W-CDMA rating translates to roughly equivalent LTE power when the lower PAPR of LTE is accounted for, and its LDMOS ruggedness handles LTE's resource-block allocations cleanly when biased in Class AB.
Where can I buy MRF5P21240HR6 online and what does it cost?
The MRF5P21240HR6 is available from authorized NXP distributors including DigiKey and Mouser, both of which list the part on their websites. Pricing as of 2026-10-16 is approximately $145 at qty 1, dropping to around $99.75 at qty 500. Lead times are typically 8-12 weeks when ordered through authorized channels, and the part is generally a quote/on-request item at distributors.
What is the lead time for MRF5P21240HR6?
Lead time for the MRF5P21240HR6 from authorized NXP distributors as of 2026-10-16 is typically 8 to 12 weeks, since this is an RF power ceramic-packaged device rather than a high-volume plastic-part. Independent distributors sometimes hold limited stock; always verify lot date code and traceability when sourcing from non-authorized channels for production builds.
MRF5P21240HR6 vs MRF6P21240HR6 - which is better for higher output power?
For higher output power, the MRF6P21240HR6 (60 W average, same band) is the stronger choice. The MRF5P21240HR6 tops out at 52 W average; if you need additional linear headroom and can fit the larger thermal budget, stepping up to the MRF6P21240HR6 family is the standard upgrade path. Both share the NI-1230 ceramic package, simplifying PCB reuse.
What is the best drop-in replacement for MRF5P21240HR6?
The best drop-in replacement for the MRF5P21240HR6 is the earlier MRF5P21240R6 (same die, same package footprint, higher thermal resistance), which is now formally superseded by the HR6 variant per NXP's documentation. Within NXP's LDMOS portfolio there is no direct higher-output pin-compatible part in the same NI-1230 footprint; stepping up requires the MRF6P21240HR6 family.
When should I choose MRF5P21240HR6 over the older MRF5P21240R6?
Choose the MRF5P21240HR6 over the older MRF5P21240R6 whenever the design is new-build or undergoing thermal revision, since the HR6 suffix delivers measurably lower junction-to-case thermal resistance at the same electrical ratings. The MRF5P21240R6 is still useful for direct maintenance replacements on legacy boards, but for any thermal-stressed macro-cell design the HR6 is the better long-term choice.
Where can I download the MRF5P21240HR6 datasheet PDF?
The MRF5P21240HR6 datasheet PDF can be downloaded directly from NXP's official product documentation portal at the URL https://www.nxp.com/docs/en/data-sheet/MRF5P21240HR6.pdf. The same document is mirrored on Mouser and DigiKey product pages. The PDF contains the full DC/RF characterization curves, package outline drawings, application circuit schematic, and a 12-page datasheet body covering absolute maximums, thermal resistance, and 2-carrier W-CDMA test data.
What does the 'H' suffix in MRF5P21240HR6 mean?
The 'H' suffix in the MRF5P21240HR6 indicates a higher-performance (lower-thermal-resistance) variant of the ceramic package family, as NXP explicitly notes when describing MRF5P21240R6 being replaced by MRF5P21240HR6. Both suffixes share the same NI-1230 ceramic package outline and identical electrical die, so PCB layouts are reusable without modification.
Is MRF5P21240HR6 RoHS compliant?
The MRF5P21240HR6 is qualified by NXP as RoHS compliant for its ceramic-packaged LDMOS power transistor line, since the NI-1230 housing uses lead-free ceramic-to-metal brazing compatible with lead-free reflow and RoHS exemption rules for high-power RF devices. Lead-Free Status is documented as Yes by major distributors; verify the latest material declaration sheet for your specific date code before signing off on EU-style compliance.
What is the absolute maximum power dissipation of MRF5P21240HR6?
The MRF5P21240HR6 carries an absolute maximum power dissipation rating of 603 W, as listed by NXP and corroborated by distributors. This is the absolute ceiling under any bias condition - in normal 2-carrier W-CDMA operation at 52 W RF output the device dissipates far less, but the 603 W figure is what sets the heatsink thermal design budget.
How do I match the MRF5P21240HR6 output for a 2110-2170 MHz base-station PA?
Match the MRF5P21240HR6 output using the load-pull data in the NXP datasheet as a starting point, then fine-tune on your evaluation board. The device is partially output-matched inside the NI-1230 ceramic, so external matching typically consists of a short transmission-line network plus a bead or capacitor to bring the load impedance to the optimum efficiency line for 2-carrier W-CDMA at 2110-2170 MHz.

Справочные инженерные данные для MRF5P21240HR6 — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the MRF5P21240HR6 when you are designing a new 2110-2170 MHz UMTS Band I base-station PA stage and want a proven 52 W 2-carrier W-CDMA LDMOS workhorse in a cool-running ceramic package. Choose the older MRF5P21240R6 only for direct maintenance replacement on legacy boards where the footprint must remain identical and the higher thermal resistance is acceptable. Choose the MRF5P21240HSR6 only when your reliability program requires NXP's higher-level screening. Choose the MRF5P21180HR6 when your design targets UMTS Band II/III (1800-2000 MHz) instead - it shares the NI-1230 footprint but is optimized for the lower band. For higher output power in the same band, step up to the MRF6P21240HR6 family rather than paralleling MRF5P21240HR6 devices, because the MRF6 family is internally matched for the higher power level.

Сравнение с аналогами

Параметр Этот товар MRF5P21240R6 MRF5P21240HSR6 MRF5P21180HR6
Package NI-1230 ceramic (HR6) NI-1230 ceramic - same footprint, higher Rth NI-1230 ceramic - same footprint, screened NI-1230 ceramic - same footprint, lower band
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Operating Frequency 2110-2170 MHz 2110-2170 MHz 2110-2170 MHz 1800-2000 MHz
Drain-Source Voltage Rated 65 V 65 V 65 V 65 V
Test Supply Voltage 28 V 28 V 28 V 28 V
Maximum Power Dissipation 603 W 603 W 603 W 603 W
Thermal Resistance (RthJC) Lower (HR6 suffix) Higher (R6 suffix) Lower (HR6 package) Lower (HR6 package)

Ключевые отличия

  • Lower thermal resistance ceramic package vs predecessor (против MRF5P21240R6)
  • Dual-die common-source in single NI-1230 ceramic (против MRF5P21180HR6)
  • Gen7 NXP LDMOS process ruggedness (против MRF5P21240HSR6)

Заметки по проектированию

The NI-1230 ceramic package must be bolted to a copper or aluminum heat-spreader with the recommended torque (typically 1.0-1.2 N-m for the M2.5 mounting screws) to ensure the lowest possible junction-to-case thermal resistance. Estimated: at 52 W RF output and 28 V supply, the device dissipates roughly 30-40 W as DC heat; without proper mounting torque the junction temperature can rise 30-40 C above the heatsink, risking premature failure. Use thermal interface material rated for high-power RF ceramics.

The MRF5P21240HR6 is a ceramic-packaged surface-mount device, but its RF input/output leads must be soldered to a high-frequency PCB substrate (Rogers RO4350B or equivalent) with controlled-impedance 50 ohm traces matched to the device's internal partial matching. Keep gate and drain traces short and avoid 90-degree bends; use mitered 45-degree bends. Place the bias feed network (RF choke + bypass capacitors) close to the gate lead to prevent low-frequency oscillation.

Do not operate the MRF5P21240HR6 above the 65 V breakdown rating - even brief over-voltage transients from a poorly regulated 28 V supply can permanently damage the LDMOS die. Estimated: the absolute maximum VDS is 65 V per the datasheet header, but the operating ceiling is typically limited to 32 V. Always add over-voltage protection on the drain bias rail and verify the supply's inrush behavior at power-on before applying RF drive.

The internal common-source dual-die configuration means each drain lead and each gate lead must be treated as a separate RF port - use a balanced microstrip layout with identical-length gate traces and identical-length drain traces to each internal die, or the two halves will not combine in phase and output power drops by 3 dB or more. Symmetry of the input/output matching networks is more important than absolute trace length in this part.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Compliant

Lead-Free Status confirmed by distributors. Halogen-free status not explicitly stated in the verified data; flagged unknown. AEC-Q100 not applicable - this is a base-station RF power transistor, not an automotive-grade part.

Данные проверены: 2026-10-16 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors MRF5P21240HR6 MRF5P21240R6 MRF5P21240HSR6 MRF5P21180HR6 MRF6P21240HR6 LDMOS lateral MOSFET RF power transistor NI-1230 ceramic package W-CDMA UMTS Band I 2110-2170 MHz Class AB amplifier base-station PA discrete semiconductor power MOSFET JESD-30 R-CDFM-F4 common source RoHS lead-free power gain drain-source breakdown
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