NXP Semiconductors

MRF6S21190HR3 - 2110-2170MHz, 54W RF Power MOSFET | NXP Semiconductors

Артикул: MRF6S21190HR3 ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
28 V Vdss 1600 mA Id NI-880H-2L (NI-880 with 2 internal leads) Package 2110 MHz to 2170 MHz Speed
От $69 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-15
Оптовые цены
Кол-во Цена за ед. Итого
1 $95 $95,00
10 $88.4 $884,00
100 $81.5 $8.150,00
500 $75.2 $37.600,00
1.000 $69 $69.000,00
ℹ️ Все цены указаны в USD

MRF6S21190HR3 Обзор

The NXP Semiconductors MRF6S21190HR3 (formerly Freescale) is a 54 W average-output, 28 V lateral N-channel RF power MOSFET designed specifically for W-CDMA base-station final-stage PAs operating across the 2110-2170 MHz band. The device delivers 16 dB gain at Pout = 54 W Avg. under VDD = 28 V, IDQ = 1600 mA, full-band, 3GPP Test Model 1 with 64 DPCH and 50% clipping, channel bandwidth = 3.84 MHz, and a 7.5 dB PAR @ 0.01% probability on CCDF. The part is housed in the NI-880 ceramic air-cavity package with two internal leads and flanges, configured for bolt-down mounting with the matching NI-880 fixture.

A base-station RF power transistor is a specialized MOSFET built for high-frequency, high-power linear amplification. Unlike a logic-level digital MOSFET, an RF power MOSFET like the MRF6S21190HR3 is over-moded to deliver high gain, low feedback capacitance, and excellent thermal conductivity. The device sits at the final stage of a multi-carrier W-CDMA PA, converting DC bias energy into RF energy at the band of interest (2110-2170 MHz, which is the downlink UMTS Band I).

Key features include a single N-channel lateral geometry optimized for high breakdown, an internal input matching network that flattens gain across the 60 MHz band, integrated ESD protection on the gate, and stable thermal performance with a hardened ceramic package. The 2.11-2.17 GHz band is targeted, the drain bias is 28 V, the quiescent current is 1600 mA, the small-signal gain (Gps) is 16 dB, and the rated continuous CW handling matches the 54 W Avg. W-CDMA reference point with significant CW headroom margin.

The lateral N-channel process uses field-plate and source-connected shield techniques to push the breakdown above 65 V while keeping Cds low enough to maintain efficiency at 2.1 GHz. The on-die match focuses on input impedance so that designers can place the part directly on a PCB microstrip launcher without external matching on the gate side.

Typical applications include 2110-2170 MHz UMTS Band I base-station final PAs, multi-carrier W-CDMA amplifiers, WLL/MMDS mid-power links, and other high-linearity PAs in the 2 GHz region. The lateral architecture and high gain make it a strong final-stage choice where ACPR at 54 W Avg. is the headline figure of merit.

When designing, ensure bolt-down torque and thermal interface materials are within the NI-880 footprint datasheet limits and that a harmonic load-pull is performed at Pout = 54 W. Be aware that gain and ACPR are temperature-sensitive and that substrate selection materially influences second-stage harmonic balance.

This page integrates distributor inventory, drop-in alternative cross-references, and field design notes that go beyond the manufacturer datasheet by ranking options on ACPR-friendly pa load-pull margin.

Аналоги без доработки для MRF6S21190HR3 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

MRF6S21190HSR3

✅ Прямая замена
📦 NI-880 (ceramic cavity)
Same die and band (2110-2170 MHz), different pre-matched leadframe geometry (SR3 vs HR3), 16 dB gain, 54 W Avg. Pout (-0% identical); bias Pout identical

📋 Справочный аналог (нет в каталоге)

MRF6S21050N

✅ Прямая замена ⚠️ Характеристики не проверены
📦 NI-780 ceramic cavity
Lower Pout (10 W vs 54 W, -81%), same N-channel RF MOSFET family and same VDD=28 V bias, gain 16 dB same; package family NI-780/NI-880 footprint-compatible at PCB flange level

📋 Справочный аналог (нет в каталоге)

MRF6S21100N

✅ Прямая замена ⚠️ Характеристики не проверены
📦 NI-780 ceramic cavity
Similar 2110-2170 MHz band Pout (100 W vs 54 W, +85%), same VDD=28 V, same lateral N-channel silicon technology; NI-780/NI-880 flange-footprint compatible at PCB level

📋 Справочный аналог (нет в каталоге)

MRF6S21190HR3 Максимальные параметры и электрические характеристики

Тип транзистора Lateral N-Channel RF Power MOSFET
Frequency Range 2110 MHz to 2170 MHz
Drain-Source Voltage (VDSS) 28 V
Test Bias Voltage (VDD) 28 V
Quiescent Current (IDQ) 1600 mA
Output Power (Avg. W-CDMA) 54 W
Power Gain (Gps) 16 dB
Configuration Single, Class AB
Drain Current 1.6 A (IDQ)
Test Signal 3GPP Test Model 1, 64 DPCH, 50% clipping, 3.84 MHz BW, 7.5 dB PAR @ 0.01% CCDF
Тип монтажа Surface Mount with bolt-down flange (NI-880 ceramic cavity)
Корпус NI-880H-2L (NI-880 with 2 internal leads)
Primary Application W-CDMA base station final-stage power amplifier
Channel Material Silicon, lateral N-channel enhancement mode
Operating Mode Enhancement Mode
Статус RoHS Compliant

Руководство по цоколевке MRF6S21190HR3 в корпусе ni-880h-2l (ni-880 with 2 internal leads)

Цоколевка для MRF6S21190HR3 (корпус ni-880h-2l (ni-880 with 2 internal leads)). Этот силовой прибор имеет выводы затвора, стока и истока. Для неполяризованных корпусов обратитесь к техническому описанию производителя для точной ориентации вывода 1 и деталей посадочного места. Типичные применения включают проектирование источников питания, управление двигателями и коммутацию нагрузки.

Схема цоколевки корпуса ni-880h-2l (ni-880 with 2 internal leads) для MRF6S21190HR3

Нет подробных данных о распиновке для MRF6S21190HR3.

Обратитесь к даташиту для полной конфигурации выводов.

MRF6S21190HR3 DC SOA (Estimated from datasheet maximums)

Непрерывная работа на постоянном токе

Типичное применение

MRF6S21190HR3 подходит для 6 применениеs: W-CDMA Base Station Final-Stage PA, Multi-Carrier W-CDMA Power Amplifier, UMTS Band I Repeater / Booster, WLL / Fixed Wireless 2 GHz Link, Public-Safety 2 GHz Band Linear PA, Scientific / Industrial 2.1 GHz Heating Head.

🌐

W-CDMA Base Station Final-Stage PA

The MRF6S21190HR3 is the reference-design final-stage transistor for W-CDMA base-station PAs covering 2110-2170 MHz (UMTS Band I downlink). With Pout = 54 W Avg. at 16 dB Gps under 3GPP Test Model 1 (64 DPCH, 50% clipping), and VDD = 28 V / IDQ = 1600 mA bias, it meets the headline figure of merit for that band. Placed between the interstage driver and the isolator/circulator, it dominates the system's ACPR budget; designers should use the NXP load-pull data and tune the harmonic terminations to keep ACLR within spec.

🗼

Multi-Carrier W-CDMA Power Amplifier

The MRF6S21190HR3 supports multi-carrier W-CDMA operation thanks to its high linearity and stable gain under backoff. At 54 W Avg. with 16 dB Gps and 1.6 A IDQ, the part can host two adjacent 5 MHz carriers while staying within the 3GPP spectrum-emission mask. Designers should revisit bias optimization and add output attenuation for the multi-carrier case; the gain stays at 16 dB but the composite ACPR budget tightens and thermal rollback becomes the dominant derating factor.

📡

UMTS Band I Repeater / Booster

Repeater applications reuse the same W-CDMA Band I downlink 2110-2170 MHz band, so the MRF6S21190HR3 is a direct fit. Operated at lower Pout (typically 10-20 W Avg.) for line-driver duty, the gain stays 16 dB and the headroom above 54 W Pout ratings becomes thermal/linearity insurance. The ceramic NI-880 package and bolt-down mechanical interface are easier to integrate in a sealed outdoor repeater than smaller SMD packages.

🌐

WLL / Fixed Wireless 2 GHz Link

The MRF6S21190HR3 covers the 2 GHz WLL/MMDS region and the 2.11-2.17 GHz UMTS Band I spectrum, making it a useful PA in fixed-wireless customer-premises equipment where 50 W average power is required. Bias at 28 V with 1.6 A IDQ, drive it directly from a low-power modulator and add an isolator before the antenna. Gain of 16 dB is sufficient to close the link without an additional driver stage, reducing BOM count.

🚓

Public-Safety 2 GHz Band Linear PA

Public-safety radios operating in 2 GHz adjacent bands need a linear PA with high ACPR headroom - the MRF6S21190HR3's 16 dB Gps and W-CDMA-class linearity make it a strong candidate. Operate at 25-40 W CW backoff to stay within the safety-mask, drive from a low-power modulator, and use the bolt-down NI-880 with a thermal pad for fanless chassis thermal management. Headroom above 54 W is available as a safety margin for thermal stress.

🏭

Scientific / Industrial 2.1 GHz Heating Head

Industrial RF heating heads operate at 2.1-2.17 GHz and need stable 30-50 W CW power; the MRF6S21190HR3 supports this duty cycle when over-spec'd to keep junction temperature within the datasheet ceiling. With VDD = 28 V and IDQ = 1600 mA, the part delivers >54 W Pout with 16 dB gain under CW drive, giving designers margin for process variation. The ceramic NI-880 package with bolt-down flange is well suited to long-duty-cycle industrial heating service.

Сводка рекомендуемых товаров

MRF6S21190HSR3 Pre-matched variant for reference design Используется в: W-CDMA Base Station Final-Stage PA, Multi-Carrier W-CDMA Power Amplifier, UMTS Band I Repeater / Booster, Public-Safety 2 GHz Band Linear PA, Scientific / Industrial 2.1 GHz Heating Head MRF6S21050N 10 W adjacent-band interstage driver Используется в: W-CDMA Base Station Final-Stage PA, UMTS Band I Repeater / Booster, WLL / Fixed Wireless 2 GHz Link, Public-Safety 2 GHz Band Linear PA MRF6S21100N 100 W same-band higher-Pout alternative Используется в: W-CDMA Base Station Final-Stage PA, WLL / Fixed Wireless 2 GHz Link, Scientific / Industrial 2.1 GHz Heating Head MRF7S21170HR3 Higher-band higher-Pout alternative Используется в: Multi-Carrier W-CDMA Power Amplifier
What is the operating frequency range of MRF6S21190HR3?
The MRF6S21190HR3 is optimized for 2110 MHz to 2170 MHz, which is the UMTS/WCDMA downlink Band I. According to the NXP datasheet, the RF power testing is performed across the full 60 MHz band at VDD = 28 V, IDQ = 1600 mA, Pout = 54 W Avg. with 3GPP Test Model 1 (64 DPCH, 50% clipping). This makes it a direct final-stage candidate for UMTS base-station power amplifiers in that band.
What output power and gain can the MRF6S21190HR3 deliver?
The MRF6S21190HR3 delivers 54 W average W-CDMA output at 16 dB power gain (Gps) under the reference bias of VDD = 28 V and IDQ = 1600 mA. The same NXP datasheet confirms full-band operation across 2110-2170 MHz with 3GPP Test Model 1, 64 DPCH at 50% clipping, and 7.5 dB PAR @ 0.01% probability on CCDF. Engineers targeting higher CW headroom should derate the average power appropriately.
Where can I download the MRF6S21190HR3 datasheet PDF?
The official NXP datasheet is hosted at https://www.nxp.com/docs/en/data-sheet/MRF6S21190H.pdf. The document covers the H variant covering MRF6S21190HR3 and MRF6S21190HSR3 together. The alldatasheet.com mirror also reproduces the same content. Always reference the NXP-hosted PDF for the latest revision and complete ACPR/load-pull curves.
Where to buy MRF6S21190HR3 online and what is the current price?
The MRF6S21190HR3 is available in stock from DigiKey (NXP USA Inc. and Rochester Electronics LLC listings), Mouser (NXP Semiconductors), and via Octopart-aggregated distributors. As of 2026-10-16, the indicative unit pricing breaks at 1/10/100/500/1000 pieces scale downward from roughly $95 to $69 per piece depending on quantity. Lead time varies with distributor stock and reel packaging, so check the live distributor page for current availability.
Is the MRF6S21190HR3 in stock right now?
DigiKey's MRF6S21190HR3 product page lists the part under NXP USA Inc. and Rochester Electronics with distributor-confirmed stock, and Mouser also advertises inventory for the NXP part. As of 2026-10-16 the part is generally available through authorized distributors; backorders are rare but lead time can extend when a base-station OEM issues a large PO. Treat distributor inventory as dynamic and confirm at order entry.
What is the lead time for MRF6S21190HR3?
Lead time for the MRF6S21190HR3 is typically same-day to 8 weeks depending on distributor stock depth at the moment of order. NXP/Freescale manufactures this part in the NI-880 ceramic cavity package, which has a longer fabrication cycle than plastic-packaged SMD MOSFETs. When DigiKey or Mouser show live stock the lead time collapses to 24-48 hours; quote-based PO typically falls in the 4-8 week window.
What are the key specifications of MRF6S21190HR3 that engineers should know?
The MRF6S21190HR3 key specs are: 2110-2170 MHz band, 28 V VDS, 28 V VDD test bias, IDQ 1600 mA, 54 W Avg. W-CDMA Pout, 16 dB power gain, lateral N-channel enhancement mode, NI-880H-2L ceramic air-cavity package. The NXP datasheet anchors the headline figure of merit at 54 W Avg. with 16 dB gain under 3GPP Test Model 1 conditions. Designers should consult the ACPR load-pull section and the thermal model before committing to the part.
MRF6S21190HR3 vs MRF6S21190HSR3 - what is the difference?
MRF6S21190HR3 is the Ni-pad ceramic NI-880H-2L flange-mount variant, while MRF6S21190HSR3 is the pre-matched source-tune variant with different lead geometry suited to a specific board layout. Both share the same silicon die, 28 V VDS, 2110-2170 MHz frequency band, and 54 W Avg. W-CDMA Pout, but they are NOT pin-compatible drop-in replacements because the leadframe differs. Use HR3 for a customer fixture layout and HSR3 for the pre-tuned reference design.
What is the best drop-in replacement for MRF6S21190HR3?
There is no exact drop-in replacement for MRF6S21190HR3 with same-die / same-package / same-pin geometry from another manufacturer in the cross-reference data we retrieved as of 2026-10-16. The closest alternative remains NXP's own MRF6S21190HSR3 (pre-tuned variant), which is same-brand and same-package but with a different leadframe, so it is pin-compatible only at the DC/bias level, not at the RF lead level. Designers needing a true drop-in second source should consult NXP's Cross Reference tool directly.
Can a different NXP RF MOSFET replace MRF6S21190HR3?
Yes for same-band high-power W-CDMA, but not as a footprint-for-footprint drop-in. NXP's HV6 family offers adjacent-band coverage - check the MRF6S21050N family for adjacent-band coverage and the MRF7S21170HR3 for higher-band same-Pout use cases. All variants differ in package pin/lead geometry and require PCB respin for true drop-in. Cross-band, same-package alternatives require load-pull revalidation.
What is the equivalent Infineon or STMicroelectronics RF MOSFET for MRF6S21190HR3?
As of 2026-10-16 our cross-reference search did not return a same-package drop-in part from Infineon or STMicroelectronics with public confirmed datasheet equivalence. Closest cross-brand W-CDMA Band I candidates typically live in Broadcom/AVAGO (now Broadcom) and Sumitomo lineages, but they do not share the NI-880 ceramic cavity and require fixture redesign. Use NXP's cross-reference portal for the latest validated second-source list.
How does the MRF6S21190HR3 perform as a Class AB final-stage device?
The MRF6S21190HR3 is specified for Class AB operation at IDQ = 1600 mA with VDD = 28 V, which places it in the linear region needed for W-CDMA's 3GPP Test Model 1 ACLR. At Pout = 54 W Avg. with 16 dB gain and 7.5 dB PAR, designers should bias the part within 5-10% of the recommended IDQ and add output harmonic load-pull to keep ACPR within spec. Thermal rollback at high Pdiss is also a key linear-performance factor.
What package does the MRF6S21190HR3 use?
The MRF6S21190HR3 uses the NI-880 ceramic air-cavity package (two internal leads, full flange for bolt-down mounting), commonly designated NI-880H-2L. The flange grounds the source and provides a thermal path to the heatsink via a thermal interface material. The datasheet's mechanical outline is the authoritative reference for footprint dimensions, bolt torque, and the matched-test fixture.
What thermal management is required for MRF6S21190HR3 at 54 W?
At 54 W Avg. W-CDMA with 28 V VDD, the dissipation depends on efficiency. Estimated at 30% efficiency, Pdiss is approximately 130 W - the NI-880 ceramic cavity must be bolted to a heatsink with thermal grease or a thermal pad, and the junction temperature must stay below the datasheet maximum (typically 200C, designer to limit). Designers should use the NXP datasheet thermal model to compute Psi_JT and Psi_JB for the actual board layout.
Is MRF6S21190HR3 RoHS compliant?
Per the NXP product information the MRF6S21190HR3 is sold as RoHS compliant. However, ceramic-cavity RF MOSFETs historically used Pb-bearing solders for the die attach; designers verifying Pb-free or RoHS exemption status should confirm with the latest NXP material declaration. The H suffix is the lead-free packaging variant - request the NXP MDDS for full material disclosure before committing to Pb-free end products.

Справочные инженерные данные для MRF6S21190HR3 — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose MRF6S21190HR3 when designing a final-stage W-CDMA UMTS Band I base-station PA at 54 W Avg. Pout with the flexibility of a custom fixture layout. The HR3 variant uses the standard leadframe, while the HSR3 variant has a pre-matched leadframe optimized for NXP's reference design - use HR3 when you must customize PCB dimensions. Choose MRF6S21100N when >54 W Pout is required (>70 W) for high-power macro-cell sites, accepting the NI-780 package and matching fixture redesign. Choose MRF6S21050N for interstage driver or lower-power repeater stages at the same band and bias. All NXP variants share lateral N-channel enhancement technology with 16 dB Gps and 28 V VDD.

Сравнение с аналогами

Параметр Этот товар MRF6S21190HSR3 MRF6S21050N MRF6S21100N
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package NI-880H-2L (ceramic cavity, bolt-down) NI-880 (ceramic cavity, pre-matched leadframe) NI-780 (ceramic cavity, bolt-down) NI-780 (ceramic cavity, bolt-down)
Frequency Range 2110-2170 MHz 2110-2170 MHz 2110-2170 MHz 2110-2170 MHz
Output Power (Avg. W-CDMA) 54 W 54 W 10 W 100 W
Drain Bias (VDD) 28 V 28 V 28 V 28 V
Channel Type Lateral N-Channel enhancement Lateral N-Channel enhancement Lateral N-Channel enhancement Lateral N-Channel enhancement
Mounting Bolt-down flange (2 internal leads) Bolt-down flange (pre-matched leads) Bolt-down flange (2 leads) Bolt-down flange (2 leads)
RoHS Compliant Compliant Compliant Compliant

Ключевые отличия

  • Reference-design W-CDMA Band I final-stage with documented 3GPP TM1 ACPR (против MRF6S21190HSR3)
  • Higher Pout in same 2110-2170 MHz band when more headroom is needed (против MRF6S21100N)
  • Lower Pout in same band for interstage or driver duty (против MRF6S21050N)

Заметки по проектированию

At VDD=28 V and 54 W Avg. W-CDMA Pout, estimated at 30% efficiency the MRF6S21190HR3 dissipates about 126 W. The NI-880 ceramic cavity must be bolted to a heatsink with thermal interface material at the manufacturer's recommended torque, and the junction temperature should stay below 175 C (target <150 C) for MTBF margin. Designers should compute Psi_JT from the NXP thermal model and validate with a thermocouple on the flange near the die cavity.

Place the MRF6S21190HR3 with its RF leads directly onto the PCB microstrip launcher to avoid added parasitic inductance; the source-tie (flange) should be grounded with multiple vias stitching the top ground to the second ground layer. Keep the bias feed network isolated from the RF path with quarter-wave stubs at the fundamental and second harmonic. The matched fixture from the datasheet is the recommended starting layout for evaluation.

Do not exceed VDS(max) of 65 V or the VGS(max) rating; design transient suppression on the drain line to protect against load VSWR spikes. Avoid operating below IDQ = 1500 mA because Class AB gain drops fast and ACPR degrades; bias at 1600 mA per the datasheet reference. Do not bypass the harmonic load-pull tuning step - production ACPR is set by these terminations and cannot be recovered with output filtering alone.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Без свинца
Yes
Без галогенов
Unknown
Конфликтные минералы
Compliant

RoHS compliant per NXP product information. The H suffix indicates lead-free packaging. Request NXP MDDS for full material disclosure including Pb-free die attach verification.

Данные проверены: 2026-10-16 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors Freescale Semiconductor MRF6S21190HR3 MRF6S21190HSR3 MRF6S21050N MRF6S21100N RF power MOSFET Lateral N-channel W-CDMA UMTS Band I 3GPP Test Model 1 NI-880 ceramic cavity RoHS ACPR Base station PA Multi-carrier amplifier Linearity Power added efficiency
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