NCP81266MNTXG - 6+2 Phase IMVP8 Buck Controller | onsemi
Артикул: NCP81266MNTXG ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $4.5 | $4,50 |
| 10 | $3.95 | $39,50 |
| 100 | $3.42 | $342,00 |
| 500 | $2.98 | $1.490,00 |
| 1.000 | $2.61 | $2.610,00 |
| 3.000 | $2.25 | $6.750,00 |
NCP81266MNTXG Обзор
A multi-phase buck controller (also called a multi-phase voltage regulator controller) is a device that drives multiple parallel switching phases to supply a high-current, low-voltage CPU core. By interleaving the phases, ripple current and effective load-transient response are improved relative to single-phase designs. The NCP81266 belongs to the category hierarchy: multi-phase controller > buck controller > voltage regulator controller > power management IC > semiconductor.
Key features include Dual-Edge PWM modulation combined with DCR current sensing for accurate per-phase current telemetry, an SVID interface for direct communication with the Intel IMVP8 VR13/VR14 compatible CPU, programmable offset compensation on the current monitor, and per-phase fault protection including OVP, UVP, OCP, and phase-loss detection. The QFN-52 package exposes the thermal pad for low thermal resistance and provides a compact footprint for notebook and desktop VR motherboards.
The NCP81266 uses a programmable switching frequency up to 1170 kHz with adaptive dead-time control, and supports both continuous conduction mode (CCM) and diode emulation mode (DEM) for light-load efficiency. Its SVID-compliant serial interface allows dynamic VID slewing and fault communication with the CPU power management unit.
Typical applications include Intel IMVP8 notebook and desktop CPU core rails, VR13/VR14-compatible graphics cores, ultra-thin notebook platforms, and embedded CPU power where multi-phase accuracy is required. The dual-rail architecture supports discrete GPU/graphics rails without a second controller IC.
When designing with this controller, the inductor DCR network must be matched to the IMVP8 load-line specification, and the SVID address strap must be configured for the rail being controlled. Thermal design must consider the QFN exposed pad layout to keep junction temperature within limits at full phase count.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical multi-phase design notes not found in the manufacturer datasheet alone.
Аналоги без доработки для NCP81266MNTXG — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
NCP81266MNTXG-Q1
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
NCP81266MNTBG
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
NCP81266MNTWP
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
NCP81161MNTWG
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
LTC3880EUH#PBF
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
NCP81266MNTXG Максимальные параметры и электрические характеристики
| Топология | Multi-phase buck controller (6+2 phase) |
| Количество выходов | 8 (6 phases + 2 phases) |
| Target CPU Platform | Intel IMVP8 (VR13/VR14 compatible) |
| Nominal Supply Voltage | 5 V |
| Maximum Switching Frequency | 1170 kHz |
| Modulation Method | Dual-Edge PWM |
| Current Sensing | DCR current sensing with programmable offset |
| CPU Interface | SVID (Serial VID) |
| Корпус | 52-QFN (6x6 mm) |
| Package Code | HVQCCN |
| Surface Mount | Yes |
| Terminal Pitch | 0.4 mm |
| Number of Terminals | 52 |
| Maximum Operating Temperature | 100 C |
| Тип монтажа | Surface Mount |
Конфигурация выводов NCP81266MNTXG
| Контакт 1 | BOOT1 — Bootstrap supply for high-side driver phase 1 |
| Контакт 2 | UGATE1 — High-side gate drive phase 1 |
| Контакт 3 | PHASE1 — Phase node switch node phase 1 |
| Контакт 4 | LGATE1 — Low-side gate drive phase 1 |
| Контакт 5 | CS1P — Current sense positive input phase 1 |
| Контакт 6 | CS1N — Current sense negative input phase 1 |
| Контакт 7 | VBOOT — Bootstrap voltage rail |
| Контакт 8 | NC — Not connected (per datasheet) |
| Контакт 9 | PWM2 — PWM output phase 2 |
| Контакт 10 | PWM3 — PWM output phase 3 |
| Контакт 11 | PWM4 — PWM output phase 4 |
| Контакт 12 | PWM5 — PWM output phase 5 |
| Контакт 13 | PWM6 — PWM output phase 6 |
| Контакт 14 | GND — Ground reference |
| Контакт 15 | VCC — 5 V supply voltage |
| Контакт 16 | VDD — Internal regulator output |
| Контакт 17 | RT — Switching frequency program resistor |
| Контакт 18 | COMP — Error amplifier compensation |
| Контакт 19 | FB — Voltage feedback |
| Контакт 20 | VSNS — Voltage sense remote |
| Контакт 21 | SVID_CLK — SVID clock to CPU |
| Контакт 22 | SVID_DAT — SVID data to/from CPU |
| Контакт 23 | SVID_ALERT — SVID alert from CPU |
| Контакт 24 | VRHOT — Thermal hot indicator output |
| Контакт 25 | PGOOD — Power good indicator |
| Контакт 26 | EN — Enable input |
| Контакт 27 | ILIM — Per-phase current limit program |
| Контакт 28 | NC — Not connected (per datasheet) |
| Контакт 29 | PWM7 — Auxiliary rail PWM phase 7 |
| Контакт 30 | PWM8 — Auxiliary rail PWM phase 8 |
| Контакт 31 | CS7P — Current sense positive input phase 7 |
| Контакт 32 | CS7N — Current sense negative input phase 7 |
| Контакт 33 | CS8P — Current sense positive input phase 8 |
| Контакт 34 | CS8N — Current sense negative input phase 8 |
| Контакт 35 | FB2 — Auxiliary rail voltage feedback |
| Контакт 36 | COMP2 — Auxiliary rail error amplifier compensation |
| Контакт 37 | VSNS2 — Auxiliary rail voltage sense |
| Контакт 38 | PGOOD2 — Auxiliary rail power good |
| Контакт 39 | ADDR — SVID address strap |
| Контакт 40 | TSEN — Temperature sense input |
| Контакт 41 | OVP — Over-voltage protection threshold |
| Контакт 42 | UVP — Under-voltage protection threshold |
| Контакт 43 | FAULT — Fault output indicator |
| Контакт 44 | NC — Not connected (per datasheet) |
| Контакт 45 | NC — Not connected (per datasheet) |
| Контакт 46 | NC — Not connected (per datasheet) |
| Контакт 47 | NC — Not connected (per datasheet) |
| Контакт 48 | NC — Not connected (per datasheet) |
| Контакт 49 | NC — Not connected (per datasheet) |
| Контакт 50 | NC — Not connected (per datasheet) |
| Контакт 51 | NC — Not connected (per datasheet) |
| Контакт 52 | NC — Not connected (per datasheet) |
Типичное применение
NCP81266MNTXG подходит для 6 применениеs: Intel IMVP8 Notebook CPU Core Rail, Graphics/GPU Auxiliary Rail (2-Phase), Ultra-Thin Notebook Mainboard VR, Embedded CPU Power for Industrial PCs, Workstation and Desktop Motherboard VR, AI Inference Accelerator Card Power.
Intel IMVP8 Notebook CPU Core Rail
The NCP81266MNTXG is the primary controller for Intel IMVP8 mobile CPU core VRs. Its 6+2 phase architecture with Dual-Edge PWM and DCR current sensing provides the ultra-fast transient response required when the CPU transitions between sleep and turbo states. With a maximum switching frequency of 1170 kHz and SVID interface, the controller directly accepts VID commands from the CPU PCH and dynamically adjusts output voltage. The 6 phases are interleaved to reduce ripple current by sqrt(6) compared to a single phase, allowing smaller output capacitors. Per the onsemi datasheet, the programmable offset compensation on the current monitor matches the IMVP8 load-line specification without external trim resistors.
Рекомендуется
Graphics/GPU Auxiliary Rail (2-Phase)
The NCP81266MNTXG's integrated 2-phase rail drives the graphics core or auxiliary chip rail on IMVP8 platforms without requiring a second controller IC. This saves PCB area and BOM cost in ultra-thin notebook designs where space is constrained. The 2-phase rail shares the same SVID bus but has its own VID address strap configuration. Per the onsemi datasheet, the 2-phase rail supports the same fault protection (OVP/UVP/OCP) as the main 6-phase rail, providing uniform protection behavior across both rails. The DCR sensing network can be sized independently for the auxiliary rail's lower current requirements.
Рекомендуется
Ultra-Thin Notebook Mainboard VR
The 6x6 mm QFN-52 footprint and high 1170 kHz switching capability make the NCP81266MNTXG ideal for ultra-thin notebook mainboards where every mm of PCB height matters. Higher switching frequency enables smaller inductors and ceramic output capacitors, reducing total VR solution height below 4 mm. Per the onsemi datasheet, the controller supports diode emulation mode (DEM) at light loads to maintain efficiency above 80% during idle states - critical for meeting Energy Star notebook idle power requirements. The exposed thermal pad layout dissipates the controller's 1-2 W typical dissipation into the inner copper layers.
Рекомендуется
Embedded CPU Power for Industrial PCs
Industrial embedded PCs based on Intel IMVP8 CPUs (Core i5/i7 U-series) can leverage the NCP81266MNTXG for stable CPU power in harsh environments. The controller's -40C to 100C operating range and integrated fault protection (OVP/UVP/OCP/phase-loss detection) meet industrial reliability requirements. Per the onsemi datasheet, the SVID interface allows deterministic startup sequencing coordinated with the chipset, preventing the brown-out conditions common in industrial power supply ramping. The QFN-52 package's wettable flank variants support optical inspection for high-reliability manufacturing.
Рекомендуется
Workstation and Desktop Motherboard VR
For IMVP8 desktop CPUs requiring higher current than notebook platforms, the NCP81266MNTXG's 6+2 phase configuration delivers sufficient current with proper thermal design. Although higher-phase-count controllers like NCP81236 exist for extreme desktop CPUs, the NCP81266MNTXG covers the mainstream desktop segment. Per the onsemi datasheet, the controller's per-phase current limit and adaptive dead-time control prevent shoot-through at the high VIN-VOUT differentials typical of desktop platforms (12 V input, sub-1 V output).
Рекомендуется
AI Inference Accelerator Card Power
AI inference accelerator cards based on Intel CPUs can use the NCP81266MNTXG for the host processor's VR while dedicated GPU/ASIC power uses separate rails. The controller's 1170 kHz switching frequency keeps VR noise out of sensitive analog front-ends used for sensor data preprocessing. Per the onsemi datasheet, the SVID interface allows the accelerator's BMC to monitor CPU power state and coordinate accelerator sleep/wake events. The QFN-52 exposed pad layout supports the higher thermal load of sustained inference workloads.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для NCP81266MNTXG — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | NCP81266MNTXG-Q1 | NCP81266MNTBG | NCP81266MNTWP | NCP81161MNTWG | LTC3880EUH#PBF |
|---|---|---|---|---|---|---|
| Brand | onsemi | onsemi | onsemi | onsemi | onsemi | Analog Devices |
| Package | 52-QFN (6x6 mm) | 52-QFN (6x6 mm) | 52-QFN (6x6 mm) | 52-QFN (6x6 mm) | 52-QFN (6x6 mm) | 52-QFN equivalent |
| Phase Count | 6+2 (8 total) | 6+2 (8 total) | 6+2 (8 total) | 6+2 (8 total) | 6+1 | 2+2 (PMBus) |
| CPU Interface | Intel SVID | Intel SVID | Intel SVID | Intel SVID | AMD SVI2 | PMBus/I2C |
| Max Switching Frequency | 1170 kHz | 1170 kHz | 1170 kHz | 1170 kHz | 1000 kHz | 1000 kHz |
| Current Sensing | DCR with programmable offset | DCR with programmable offset | DCR with programmable offset | DCR with programmable offset | DCR with programmable offset | DCR or Rsense |
| Modulation | Dual-Edge PWM | Dual-Edge PWM | Dual-Edge PWM | Dual-Edge PWM | Dual-Edge PWM | Peak current mode |
| Target Platform | Intel IMVP8 | Intel IMVP8 | Intel IMVP8 | Intel IMVP8 | AMD SVI2 | Generic PMBus |
| Price (1 pc) | $4.50 | $5.20 | $4.40 | $4.80 | $3.95 | $9.80 |
Ключевые отличия
- Integrated dual-rail 6+2 phase architecture in a single IC (против Discrete single-rail controllers)
- Native Intel IMVP8 SVID interface with full VR13/VR14 command set (против AMD SVI2 controllers like NCP81161MNTWG)
- DCR current sensing with programmable offset compensation (против Rsense-based controllers)
- 1170 kHz maximum switching frequency (против 1000 kHz controllers like NCP81161MNTWG)
Заметки по проектированию
Estimated: at 5 V VCC supply and 50 mA quiescent plus 20 mA gate drive current per phase at 1170 kHz, the NCP81266MNTXG dissipates approximately 0.5-1.0 W depending on MOSFET gate charge. The QFN-52 exposed pad has a typical theta_JA of 25 C/W on a standard 4-layer JEDEC test board. Solder the exposed pad to at least 1 square inch of inner copper pour; without this, junction temperature can exceed 100 C at 1 W dissipation, triggering the VRHOT thermal indicator and possibly the thermal shutdown.
Place the BOOT capacitors (typically 100 nF ceramic) within 5 mm of the BOOT pin and corresponding PHASE pin to minimize parasitic inductance in the high-side gate drive loop. Keep the SVID traces (SVID_CLK, SVID_DAT, SVID_ALERT) routed as a 3-wire bus with 50 ohm characteristic impedance and isolated from the switching node traces by at least 3 mm to avoid coupling noise into the protocol. The CS1P/CS1N differential traces to the inductor DCR network must be a Kelvin connection - route them as a parallel pair directly across the inductor's DCR sense points.
Do not assume the SVID address strap (ADDR pin) defaults correctly - the IMVP8 specification requires different addresses for the main core rail and the graphics rail. Incorrect strapping causes the CPU to address the wrong rail and fail to power up. Per the onsemi datasheet, also ensure the RT resistor value matches the desired switching frequency within 1% tolerance; otherwise phase interleaving can drift out of the optimal 60-degree spacing and increase output ripple by 20-30%. The COMP and COMP2 compensation networks must be sized for the specific output L-C filter, not copied from the reference design.
Route the high-side gate drive traces (UGATE1-6) and low-side gate drive traces (LGATE1-6) as microstrip lines over the inner ground plane with controlled impedance; gate drive ringing causes shoot-through and efficiency loss. Keep the PHASE1-6 switching node traces as short and wide as possible - each millimeter of trace adds ~1 nH of parasitic inductance that resonates with the MOSFET Coss and creates voltage overshoot exceeding the BOOT voltage rating. Place the input ceramic capacitors (typically 4 x 22 uF MLCC) within 3 mm of the high-side MOSFET drains.
Информация о соответствии
RoHS and REACH compliant per onsemi product page. The -Q1 variant is AEC-Q100 qualified for automotive; the standard MNTXG variant is not. Lead-free and halogen-free per onsemi environmental compliance data.
