P1023NSN5CFB - QorIQ P1023 500MHz Dual-Core e500v2 MPU | NXP
Артикул: P1023NSN5CFB ✓ АктивенP1023NSN5CFB Обзор
A microprocessor (MPU) is a single-chip CPU containing the full arithmetic logic unit, control unit, register file, and on-chip caches of a computer. QorIQ P1 devices such as the P1023 sit at the entry tier of NXP's QorIQ Power Architecture portfolio (P1 -> P2 -> P3 -> P4 -> P5), positioned above simple microcontrollers (MCU) but below high-end Layerscape LX2/LX2160 communications processors. The P1023 bridges the gap between legacy PowerQUICC communications processors and modern QorIQ Layerscape families for cost-sensitive SMB/SOHO networking, factory automation, and secure connected devices.
Key features include dual e500v2 cores with integrated 32 KB instruction and 32 KB data L1 caches per core, a unified 256 KB L2 cache, and integrated DDR2/DDR3 memory controller with ECC. The SoC also integrates three Gigabit Ethernet MACs (one RGMII + two SGMII), dual PCIe Gen1 controllers, USB 2.0, SD/MMC, SPI, I2C, UART, and an integrated security engine (SEC 3.x) for IPsec / SSL acceleration. The platform runs from a 1.0 V core supply with a 19x19 mm package suitable for standard 4-layer PCB stack-ups.
Typical applications include entry-level routers, switches and gateways, industrial PLC controllers, factory automation nodes, secure POS terminals, and networked MFP/multifunction peripherals. The dual-core architecture with hardware-accelerated encryption makes the P1023 a frequent choice for SOHO/SMB firewall and UTM appliances where deterministic packet processing and a mature BSP ecosystem matter more than peak throughput.
When designing with the P1023, ensure the 1.0 V core supply uses a buck converter with sufficient transient response to handle core load steps. DDR memory routing requires matched-length traces and proper termination per NXP's hardware design checklist; signal integrity on the two SGMII links is critical and usually demands a reference clock with low jitter.
This page synthesizes authorized distributor pricing, available stock across DigiKey / Mouser / Rochester Electronics, drop-in alternatives from the same P1 family, and practical design notes not consolidated in the NXP product brief.
Аналоги без доработки для P1023NSN5CFB — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
P1023NSE5CFB
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
P1024NSN5CFB
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
P1013NSN5CFB
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
P1022NSN5CFB
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
P1017NSN5HFB
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
P1023NSN5CFB Максимальные параметры и электрические характеристики
| Manufacturer | NXP Semiconductors |
| Series | QorIQ P1 |
| Core Architecture | PowerPC e500v2 |
| Number of Cores | 2 |
| Core Data Bus Width | 32-bit |
| Maximum Core Frequency | 500 MHz |
| Platform Frequency | 667 MHz |
| DDR Memory Frequency | 333 MHz |
| Core / DDR / Platform Triple | 500 / 333 / 667 MHz |
| L1 Cache (per core) | 32 KB instruction + 32 KB data |
| L2 Cache | 256 KB unified |
| Process Technology | 45 nm |
| Корпус | 457-TEPBGA-1 (19x19 mm) |
| Operating Supply Voltage (Core) | 1.0 V |
| Рабочая температура | -40C to +105C (industrial) |
| Тип монтажа | Surface Mount (BGA) |
| Integrated Ethernet MACs | 3x (1x RGMII + 2x SGMII) |
| PCIe Controllers | 2x PCIe Gen1 |
| USB | USB 2.0 |
| Security Engine | SEC 3.x |
Руководство по цоколевке P1023NSN5CFB в корпусе 457-tepbga-1 (19x19 mm)
Цоколевка для P1023NSN5CFB (корпус 457-tepbga-1 (19x19 mm)). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для P1023NSN5CFB.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
P1023NSN5CFB подходит для 6 применениеs: Entry-Level SOHO / SMB Router, Industrial PLC / Factory Automation Controller, UTM / SMB Firewall Appliance, Networked MFP / Multifunction Printer Controller, Secure POS / Payment Terminal, IoT Edge Gateway / Substation Node.
Entry-Level SOHO / SMB Router
Why P1023NSN5CFB fits: The dual 500 MHz e500v2 cores and integrated SEC 3.x engine handle ~1 Gbps NAT / firewall workloads at low BOM cost, while the 3x GbE MACs (1x RGMII + 2x SGMII) eliminate external switch silicon. How it is used: the SoC sits on a 4-layer PCB with two DDR2/DDR3 chips, an external PHY for the WAN port, and a small NOR/NAND boot flash. Performance consideration: deterministic packet processing via the hardware queues makes the P1023 a fit for sub-1 Gbps routing, but you should step up to P2040/LX2160 for multi-Gbps WAN aggregation or DPAA-accelerated workloads.
Рекомендуется
Industrial PLC / Factory Automation Controller
Why P1023NSN5CFB fits: The dual 32-bit e500v2 cores deliver deterministic, real-time response with hardware ECC memory support, while the -40C to +105C industrial temperature rating meets harsh factory-floor requirements. How it is used: typically paired with a Profinet / EtherCAT IP core in the FPGA fabric or external PHY, plus isolated RS-485 transceivers and digital I/O. Performance consideration: the PowerPC toolchain provides long-term ABI stability for multi-decade industrial product lifecycles, but the BGA package requires careful thermal design when sealed in an IP67 enclosure.
Рекомендуется
UTM / SMB Firewall Appliance
Why P1023NSN5CFB fits: The integrated SEC 3.x engine accelerates IPsec / SSL with ~500 Mbps IPsec throughput at 500 MHz, and the DDR2/DDR3 controller with ECC handles concurrent NAT + VPN flows without packet loss. How it is used: the two cores are typically partitioned between control plane (Linux) and data plane (DPDK or fast-path firmware), with the two SGMII ports feeding GbE WAN/LAN. Performance consideration: at large VIN-VOUT deltas the SoC dissipates noticeable power (~3-5 W at full load), so an adequate heatsink or copper pour is essential for closed-form-factor appliances.
Рекомендуется
Networked MFP / Multifunction Printer Controller
Why P1023NSN5CFB fits: The dual e500v2 cores handle concurrent scan-to-email, job queueing, and raster image processing at low cost, while the integrated USB 2.0, SD/MMC, and PCIe ports attach to scanner engines, NFC readers, and Wi-Fi modules. How it is used: the SoC runs an embedded Linux stack (Yocto BSP from NXP), with the RGMII port driving the wired NIC and one SGMII port reserved for future expansion. Performance consideration: the deterministic PowerPC interrupt model simplifies real-time scanner motor control, but the BGA package and 1.0 V core rail require careful PCB layout to meet CISPR 22 EMI limits.
Рекомендуется
Secure POS / Payment Terminal
Why P1023NSN5CFB fits: The SEC 3.x engine accelerates PCI-compliant encryption (AES / 3DES / SHA) and key management, while the integrated DDR controller with ECC supports tamper-detection memory scrubbing. How it is used: the SoC pairs with an external secure-element (SE), a touchscreen controller, a smartcard reader (via SPI/UART), and a 4G modem (via USB or PCIe). Performance consideration: PCI PTS 6.x certification typically requires hardware RNG and tamper pins, which the P1023 family provides - but for newer contactless EMVCo 3.0 stacks verify the BSP version supports the required crypto APIs.
Рекомендуется
IoT Edge Gateway / Substation Node
Why P1023NSN5CFB fits: The dual-core e500v2 handles edge protocol translation (Modbus / IEC 61850 / DNP3) plus secure cloud uplinks, while the wide industrial temperature rating suits outdoor substation or cabinet installations. How it is used: the SoC aggregates sensor data from RS-485 / CAN peripherals, runs edge analytics in userspace, and forwards to AWS / Azure via the GbE uplink. Performance consideration: the PowerPC's low interrupt latency is well suited to IEC 61850 GOOSE messaging, but for substation hardware that requires IEC 61850-3 EMI / surge compliance you will need additional external protection on the BGA PCB.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для P1023NSN5CFB — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | P1023NSE5CFB | P1024NSN5CFB | P1013NSN5CFB | P1022NSN5CFB |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 457-TEPBGA-1 (19x19 mm) | 457-TEPBGA-1 (19x19 mm) - same | 457-TEPBGA-1 (19x19 mm) - same | 457-TEPBGA-1 (19x19 mm) - same | 457-TEPBGA-1 (19x19 mm) - same |
| Core Count | 2 (dual-core) | 2 (dual-core) | 2 (dual-core) | 1 (single-core) | 2 (dual-core) |
| Core Frequency | 500 MHz | 667 MHz | 500 MHz | 500 MHz | 400 MHz |
| Platform Frequency | 667 MHz | 800 MHz | 667 MHz | 667 MHz | 533 MHz |
| DDR Frequency | 333 MHz | 400 MHz | 333 MHz | 333 MHz | 266 MHz |
| Security Engine | SEC 3.x | SEC 3.x | Enhanced SEC | SEC 3.x | SEC 3.x |
| Process Technology | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm |
| Core Architecture | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 |
Ключевые отличия
- Dual e500v2 cores with 500/333/667 MHz triple (против P1013NSN5CFB)
- Mature QorIQ P1 BSP ecosystem and 10+ year NXP longevity (против P1023NSE5CFB (higher speed grade))
- 3x integrated Gigabit Ethernet MACs (против P1017NXE5HFB (PowerQUICC))
Заметки по проектированию
Estimated: At 500 MHz dual-core load the P1023NSN5CFB typically draws ~3-4 W on the 1.0 V core rail plus ~0.5-1 W on the 1.5 V / 1.8 V / 2.5 V DDR I/O rails. Use a 4-phase buck converter with at least 6 A capability on the core rail, sized for the worst-case core transient step. Decouple each of the 457 BGA balls per NXP's hardware design checklist, with 0.1 uF MLCCs as close to the package as possible and a bulk 22 uF / 47 uF polymer cap per power domain.
The 457-TEPBGA-1 (19x19 mm) BGA package requires a 4- or 6-layer PCB stack-up with microvia-in-pad or HDI technology to break out the inner rows. Follow NXP's AN4325 hardware design guide for DDR2/DDR3 routing rules: matched-length (±25 mil) address/command traces, fly-by topology for DDR3, 100 ohm differential for SGMII, and a continuous ground reference plane under all high-speed signals. Do NOT route signals over split power planes under the BGA.
Estimated: at 5 W total dissipation on the 19x19 mm TEPBGA (theta_JA ~15-20 C/W on a 4-layer JEDEC test board), the junction-to-ambient delta is ~75-100 C. For the -40C to +105C industrial rating this is marginal without airflow or a heatsink; in sealed enclosures derate by 20-30% and verify with a thermocouple on the package top center. Place thermal vias in the central BGA ball array to spread heat into internal copper planes.
Do NOT confuse P1023NSN5CFB (500/333/667) with P1023NSE5CFB (667/400/800) when sourcing - they share the same datasheet but the higher-binned NSE5 variant draws more current at the same 1.0 V core supply and may require a beefier regulator. Also verify boot-mode strapping pins (cfg_rcw_src) for your specific boot source - misconfiguration is the #1 reason for no-debug P1023 prototypes. Finally, ensure the JTAG TAP is accessible even on production boards for field debug.
Информация о соответствии
RoHS / REACH compliance not explicitly stated in verified search snippets - [DATA_NEEDED] markers retained. NXP's QorIQ P1 family is generally RoHS compliant; verify with the manufacturer's CoC for production documentation. AEC-Q100 is not_applicable as this is an industrial/networking MPU, not an automotive-grade part.
