P1023NSN5CFB - QorIQ P1023 500MHz Dual-Core e500v2 MPU | NXP
Référence : P1023NSN5CFB ✓ ActifP1023NSN5CFB Présentation
A microprocessor (MPU) is a single-chip CPU containing the full arithmetic logic unit, control unit, register file, and on-chip caches of a computer. QorIQ P1 devices such as the P1023 sit at the entry tier of NXP's QorIQ Power Architecture portfolio (P1 -> P2 -> P3 -> P4 -> P5), positioned above simple microcontrollers (MCU) but below high-end Layerscape LX2/LX2160 communications processors. The P1023 bridges the gap between legacy PowerQUICC communications processors and modern QorIQ Layerscape families for cost-sensitive SMB/SOHO networking, factory automation, and secure connected devices.
Key features include dual e500v2 cores with integrated 32 KB instruction and 32 KB data L1 caches per core, a unified 256 KB L2 cache, and integrated DDR2/DDR3 memory controller with ECC. The SoC also integrates three Gigabit Ethernet MACs (one RGMII + two SGMII), dual PCIe Gen1 controllers, USB 2.0, SD/MMC, SPI, I2C, UART, and an integrated security engine (SEC 3.x) for IPsec / SSL acceleration. The platform runs from a 1.0 V core supply with a 19x19 mm package suitable for standard 4-layer PCB stack-ups.
Typical applications include entry-level routers, switches and gateways, industrial PLC controllers, factory automation nodes, secure POS terminals, and networked MFP/multifunction peripherals. The dual-core architecture with hardware-accelerated encryption makes the P1023 a frequent choice for SOHO/SMB firewall and UTM appliances where deterministic packet processing and a mature BSP ecosystem matter more than peak throughput.
When designing with the P1023, ensure the 1.0 V core supply uses a buck converter with sufficient transient response to handle core load steps. DDR memory routing requires matched-length traces and proper termination per NXP's hardware design checklist; signal integrity on the two SGMII links is critical and usually demands a reference clock with low jitter.
This page synthesizes authorized distributor pricing, available stock across DigiKey / Mouser / Rochester Electronics, drop-in alternatives from the same P1 family, and practical design notes not consolidated in the NXP product brief.
Alternatives de remplacement direct pour P1023NSN5CFB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
P1023NSE5CFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1024NSN5CFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1013NSN5CFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1022NSN5CFB
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
P1017NSN5HFB
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
P1023NSN5CFB Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors |
| Series | QorIQ P1 |
| Core Architecture | PowerPC e500v2 |
| Number of Cores | 2 |
| Core Data Bus Width | 32-bit |
| Maximum Core Frequency | 500 MHz |
| Platform Frequency | 667 MHz |
| DDR Memory Frequency | 333 MHz |
| Core / DDR / Platform Triple | 500 / 333 / 667 MHz |
| L1 Cache (per core) | 32 KB instruction + 32 KB data |
| L2 Cache | 256 KB unified |
| Process Technology | 45 nm |
| Boîtier | 457-TEPBGA-1 (19x19 mm) |
| Operating Supply Voltage (Core) | 1.0 V |
| Température de fonctionnement | -40C to +105C (industrial) |
| Type de montage | Surface Mount (BGA) |
| Integrated Ethernet MACs | 3x (1x RGMII + 2x SGMII) |
| PCIe Controllers | 2x PCIe Gen1 |
| USB | USB 2.0 |
| Security Engine | SEC 3.x |
Guide de configuration des broches du P1023NSN5CFB 457-tepbga-1 (19x19 mm)
Configuration des broches du P1023NSN5CFB (boîtier 457-tepbga-1 (19x19 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour P1023NSN5CFB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
P1023NSN5CFB convient pour 6 applications: Entry-Level SOHO / SMB Router, Industrial PLC / Factory Automation Controller, UTM / SMB Firewall Appliance, Networked MFP / Multifunction Printer Controller, Secure POS / Payment Terminal, IoT Edge Gateway / Substation Node.
Entry-Level SOHO / SMB Router
Why P1023NSN5CFB fits: The dual 500 MHz e500v2 cores and integrated SEC 3.x engine handle ~1 Gbps NAT / firewall workloads at low BOM cost, while the 3x GbE MACs (1x RGMII + 2x SGMII) eliminate external switch silicon. How it is used: the SoC sits on a 4-layer PCB with two DDR2/DDR3 chips, an external PHY for the WAN port, and a small NOR/NAND boot flash. Performance consideration: deterministic packet processing via the hardware queues makes the P1023 a fit for sub-1 Gbps routing, but you should step up to P2040/LX2160 for multi-Gbps WAN aggregation or DPAA-accelerated workloads.
Recommandé
Industrial PLC / Factory Automation Controller
Why P1023NSN5CFB fits: The dual 32-bit e500v2 cores deliver deterministic, real-time response with hardware ECC memory support, while the -40C to +105C industrial temperature rating meets harsh factory-floor requirements. How it is used: typically paired with a Profinet / EtherCAT IP core in the FPGA fabric or external PHY, plus isolated RS-485 transceivers and digital I/O. Performance consideration: the PowerPC toolchain provides long-term ABI stability for multi-decade industrial product lifecycles, but the BGA package requires careful thermal design when sealed in an IP67 enclosure.
Recommandé
UTM / SMB Firewall Appliance
Why P1023NSN5CFB fits: The integrated SEC 3.x engine accelerates IPsec / SSL with ~500 Mbps IPsec throughput at 500 MHz, and the DDR2/DDR3 controller with ECC handles concurrent NAT + VPN flows without packet loss. How it is used: the two cores are typically partitioned between control plane (Linux) and data plane (DPDK or fast-path firmware), with the two SGMII ports feeding GbE WAN/LAN. Performance consideration: at large VIN-VOUT deltas the SoC dissipates noticeable power (~3-5 W at full load), so an adequate heatsink or copper pour is essential for closed-form-factor appliances.
Recommandé
Networked MFP / Multifunction Printer Controller
Why P1023NSN5CFB fits: The dual e500v2 cores handle concurrent scan-to-email, job queueing, and raster image processing at low cost, while the integrated USB 2.0, SD/MMC, and PCIe ports attach to scanner engines, NFC readers, and Wi-Fi modules. How it is used: the SoC runs an embedded Linux stack (Yocto BSP from NXP), with the RGMII port driving the wired NIC and one SGMII port reserved for future expansion. Performance consideration: the deterministic PowerPC interrupt model simplifies real-time scanner motor control, but the BGA package and 1.0 V core rail require careful PCB layout to meet CISPR 22 EMI limits.
Recommandé
Secure POS / Payment Terminal
Why P1023NSN5CFB fits: The SEC 3.x engine accelerates PCI-compliant encryption (AES / 3DES / SHA) and key management, while the integrated DDR controller with ECC supports tamper-detection memory scrubbing. How it is used: the SoC pairs with an external secure-element (SE), a touchscreen controller, a smartcard reader (via SPI/UART), and a 4G modem (via USB or PCIe). Performance consideration: PCI PTS 6.x certification typically requires hardware RNG and tamper pins, which the P1023 family provides - but for newer contactless EMVCo 3.0 stacks verify the BSP version supports the required crypto APIs.
Recommandé
IoT Edge Gateway / Substation Node
Why P1023NSN5CFB fits: The dual-core e500v2 handles edge protocol translation (Modbus / IEC 61850 / DNP3) plus secure cloud uplinks, while the wide industrial temperature rating suits outdoor substation or cabinet installations. How it is used: the SoC aggregates sensor data from RS-485 / CAN peripherals, runs edge analytics in userspace, and forwards to AWS / Azure via the GbE uplink. Performance consideration: the PowerPC's low interrupt latency is well suited to IEC 61850 GOOSE messaging, but for substation hardware that requires IEC 61850-3 EMI / surge compliance you will need additional external protection on the BGA PCB.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour P1023NSN5CFB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | P1023NSE5CFB | P1024NSN5CFB | P1013NSN5CFB | P1022NSN5CFB |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 457-TEPBGA-1 (19x19 mm) | 457-TEPBGA-1 (19x19 mm) - same | 457-TEPBGA-1 (19x19 mm) - same | 457-TEPBGA-1 (19x19 mm) - same | 457-TEPBGA-1 (19x19 mm) - same |
| Core Count | 2 (dual-core) | 2 (dual-core) | 2 (dual-core) | 1 (single-core) | 2 (dual-core) |
| Core Frequency | 500 MHz | 667 MHz | 500 MHz | 500 MHz | 400 MHz |
| Platform Frequency | 667 MHz | 800 MHz | 667 MHz | 667 MHz | 533 MHz |
| DDR Frequency | 333 MHz | 400 MHz | 333 MHz | 333 MHz | 266 MHz |
| Security Engine | SEC 3.x | SEC 3.x | Enhanced SEC | SEC 3.x | SEC 3.x |
| Process Technology | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm |
| Core Architecture | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 |
Principaux différenciateurs
- Dual e500v2 cores with 500/333/667 MHz triple (vs P1013NSN5CFB)
- Mature QorIQ P1 BSP ecosystem and 10+ year NXP longevity (vs P1023NSE5CFB (higher speed grade))
- 3x integrated Gigabit Ethernet MACs (vs P1017NXE5HFB (PowerQUICC))
Notes de conception
Estimated: At 500 MHz dual-core load the P1023NSN5CFB typically draws ~3-4 W on the 1.0 V core rail plus ~0.5-1 W on the 1.5 V / 1.8 V / 2.5 V DDR I/O rails. Use a 4-phase buck converter with at least 6 A capability on the core rail, sized for the worst-case core transient step. Decouple each of the 457 BGA balls per NXP's hardware design checklist, with 0.1 uF MLCCs as close to the package as possible and a bulk 22 uF / 47 uF polymer cap per power domain.
The 457-TEPBGA-1 (19x19 mm) BGA package requires a 4- or 6-layer PCB stack-up with microvia-in-pad or HDI technology to break out the inner rows. Follow NXP's AN4325 hardware design guide for DDR2/DDR3 routing rules: matched-length (±25 mil) address/command traces, fly-by topology for DDR3, 100 ohm differential for SGMII, and a continuous ground reference plane under all high-speed signals. Do NOT route signals over split power planes under the BGA.
Estimated: at 5 W total dissipation on the 19x19 mm TEPBGA (theta_JA ~15-20 C/W on a 4-layer JEDEC test board), the junction-to-ambient delta is ~75-100 C. For the -40C to +105C industrial rating this is marginal without airflow or a heatsink; in sealed enclosures derate by 20-30% and verify with a thermocouple on the package top center. Place thermal vias in the central BGA ball array to spread heat into internal copper planes.
Do NOT confuse P1023NSN5CFB (500/333/667) with P1023NSE5CFB (667/400/800) when sourcing - they share the same datasheet but the higher-binned NSE5 variant draws more current at the same 1.0 V core supply and may require a beefier regulator. Also verify boot-mode strapping pins (cfg_rcw_src) for your specific boot source - misconfiguration is the #1 reason for no-debug P1023 prototypes. Finally, ensure the JTAG TAP is accessible even on production boards for field debug.
Informations de conformité
RoHS / REACH compliance not explicitly stated in verified search snippets - [DATA_NEEDED] markers retained. NXP's QorIQ P1 family is generally RoHS compliant; verify with the manufacturer's CoC for production documentation. AEC-Q100 is not_applicable as this is an industrial/networking MPU, not an automotive-grade part.
