PIC18LF2510-I/ML - 8-bit 32KB Flash MCU, 28-QFN | Microchip
Артикул: PIC18LF2510-I/ML ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $2.71 | $2,71 |
| 10 | $2.55 | $25,50 |
| 100 | $2.34 | $234,00 |
| 500 | $2.1 | $1.050,00 |
| 1.000 | $1.85 | $1.850,00 |
PIC18LF2510-I/ML Обзор
What is a microcontroller (MCU)? A microcontroller is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile working memory (RAM), non-volatile data storage (EEPROM), and programmable peripherals on one die. The PIC18F family from Microchip is an enhanced 8-bit architecture family: 8-bit MCU -> PIC18 family -> PIC microcontroller -> microcontroller -> semiconductor. Compared to 16-bit and 32-bit MCUs, 8-bit parts like the PIC18LF2510 typically deliver lower MIPS but lower cost, lower power, and simpler instruction sets for embedded control tasks.
Key features include a 10-bit A/D converter with up to 11 input channels, multiple serial communication peripherals (USART, MSSP for SPI/I2C), a 16-bit timer/counter, and configurable I/O pins. The nanoWatt Technology suite adds ultra-low-power sleep, idle, and run modes suited to battery-driven products.
Technically the PIC18LF2510 uses Microchip's enhanced Harvard architecture with separate program and data buses, an 8-bit data path, and 16-bit instructions, achieving approximately 10 MIPS at 40 MHz. The wide 2.0-5.5 V operating range lets it interface directly to 3.3 V and 5 V sensors without level shifters.
Typical applications include industrial sensor nodes, battery-powered data loggers, automotive body and chassis subsystems, low-power portable instruments, and consumer white goods that need an 8-bit MCU with generous Flash headroom and analog integration.
When designing with this part, ensure decoupling with a 100 nF ceramic capacitor on each VDD/AVDD pin, and use a regulated supply when ADC accuracy is critical. The QFN-28 exposed pad must be soldered to a sufficient copper pour to meet the datasheet's thermal and electrical grounding requirements.
This page synthesizes verified distributor pricing, drop-in compatible alternatives, and practical design notes not consolidated on any single manufacturer page, giving engineers a one-stop procurement and reference resource.
Аналоги без доработки для PIC18LF2510-I/ML — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC18LF2510-I/ML (тот же форм-фактор и посадочное место) — отличается по Package, Timers, Operating Temperature, ADC, Core Architecture.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC18F2510-I/ML
✅ Прямая замена✓ В наличии
$3.18 / шт.
Открыть даташит →PIC18LF2520-I/ML
✅ Прямая замена✓ В наличии
$4.32 / шт.
Открыть даташит →PIC18LF2610-I/ML
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC18LF2510-I/SO
✅ Прямая замена✓ В наличии
$3.34 / шт.
Открыть даташит →PIC18F24J10-I/ML
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC18LF24J11-I/ML
✅ Прямая замена✓ В наличии
$1.95 / шт.
Открыть даташит →PIC18LF2510-I/ML Максимальные параметры и электрические характеристики
| Core | PIC18 (enhanced 8-bit RISC) |
| Program Memory | 32 KB Flash (16K x 16) |
| RAM | 1536 bytes |
| EEPROM | 256 bytes |
| Max CPU Speed | 40 MHz |
| Operating Voltage | 2.0 V to 5.5 V |
| I/O Pins | 25 |
| A/D Converter | 10-bit, up to 11 channels |
| Timers | 4 (8-bit/16-bit) |
| Communication | USART, MSSP (SPI/I2C) |
| Корпус | 28-pin QFN (6x6 mm) with EP |
| Тип монтажа | Surface Mount |
| Рабочая температура | -40C to +85C (Industrial) |
| Power Technology | nanoWatt Technology |
| Lead-Free / RoHS | Yes / Compliant |
| Уровень MSL | 1 |
| Data Sheet Document Family | PIC18F2510/2520/2610 (PIC18F/LF2510/2520/2610 datasheet family) |
Конфигурация выводов PIC18LF2510-I/ML
| Контакт 1 | MCLR — Master Clear (active low reset) input |
| Контакт 2 | RA0 — Digital I/O / analog input AN0 |
| Контакт 3 | RA1 — Digital I/O / analog input AN1 |
| Контакт 4 | RA2 — Digital I/O / analog input AN2 / VREF- |
| Контакт 5 | RA3 — Digital I/O / analog input AN3 / VREF+ |
| Контакт 6 | RA4 — Digital I/O / analog input AN4 / T0CKI |
| Контакт 7 | RA5 — Digital I/O / analog input AN5 / HLVDIN |
| Контакт 8 | VSS — Ground reference |
| Контакт 9 | OSC1 — Crystal/oscillator input |
| Контакт 10 | OSC2 — Crystal/oscillator output |
| Контакт 11 | RC0 — Digital I/O / T1OSO / T13CKI |
| Контакт 12 | RC1 — Digital I/O / T1OSI / CCP2 |
| Контакт 13 | RC2 — Digital I/O / CCP1 |
| Контакт 14 | RC3 — Digital I/O / SCL (I2C clock) |
| Контакт 15 | RC4 — Digital I/O / SDA (I2C data) |
| Контакт 16 | RC5 — Digital I/O / SDO (SPI data out) |
| Контакт 17 | RC6 — Digital I/O / TX (USART transmit) |
| Контакт 18 | RC7 — Digital I/O / RX (USART receive) |
| Контакт 19 | VSS — Ground reference (digital) |
| Контакт 20 | VDD — Positive supply (digital) |
| Контакт 21 | RB0 — Digital I/O / INT0 external interrupt |
| Контакт 22 | RB1 — Digital I/O / INT1 external interrupt |
| Контакт 23 | RB2 — Digital I/O / INT2 external interrupt |
| Контакт 24 | RB3 — Digital I/O / CCP2 |
| Контакт 25 | RB4 — Digital I/O |
| Контакт 26 | RB5 — Digital I/O / PGM (LVP) |
| Контакт 27 | RB6 — Digital I/O / PGC (ICSP clock) |
| Контакт 28 | RB7 — Digital I/O / PGD (ICSP data) |
| Контакт EP | EP — Exposed pad - must be soldered to ground pad for thermal/electrical performance |
Типичное применение
PIC18LF2510-I/ML подходит для 6 применениеs: Battery-Powered Sensor Nodes, Industrial Control and Instrumentation, Automotive Body and Chassis Subsystems, Consumer Appliance and White Goods, Portable Medical Monitoring Devices, Educational and Hobbyist Development.
Battery-Powered Sensor Nodes
The PIC18LF2510-I/ML is well suited for battery-powered wireless sensor nodes because its 2.0-5.5 V input range lets it run directly from a single 3.3 V regulator or even from a discharged 5 V rail at end-of-life. Its nanoWatt Technology Sleep mode drops current to typically <1 uA, so an MCU spending most of its life in deep sleep between measurements is a natural fit. The 32 KB Flash provides ample headroom for stack-based wireless protocol implementations (e.g., LoRaWAN classes, Microchip MiWi, or ZigBee PRO) plus sensor-conditioning firmware, while 1536 bytes RAM buffers sensor frames before transmission. The 10-bit ADC with up to 11 input channels supports multi-sensor conditioning boards (temperature, humidity, voltage, current) without an external ADC. Designers should route an isolated analog supply to the AVDD pin via a ferrite bead to maximize ADC accuracy and use the chip's internal 8 MHz HFINTOSC source to reduce BOM.
Рекомендуется
Industrial Control and Instrumentation
In industrial instrumentation - process transmitters, factory-automation I/O modules, smart sensors - the PIC18LF2510-I/ML brings an industrial -40C to +85C temperature range and a 10-bit ADC that resolves to roughly 0.5 LSB with proper PCB layout. Its USART supports RS-232/RS-485 bridges for Modbus RTU communication, while MSSP provides SPI for sensor front-ends and I2C for EEPROM or RTC chips. The 32 KB Flash comfortably fits state-machine based control firmware plus bootloader for field upgrades. Compared to a 16-bit MCU, the PIC18LF2510 simplifies BOM by integrating peripherals and gives deterministic interrupt latency, which matters for closed-loop control loops up to a few kHz. The 28-QFN package is footprint-compatible with Microchip's newer PIC18F-K40/K42 families, easing future migration paths.
Рекомендуется
Automotive Body and Chassis Subsystems
The PIC18LF2510-I/ML fits non-safety automotive body and chassis subsystems such as door modules, mirror controllers, lighting drivers, and HVAC actuators, where it interfaces directly with 12 V system transients via simple external TVS protection. While not AEC-Q100 qualified, its industrial -40C to +85C specification meets many non-safety-capped subsystems, and it carries Microchip's well-known PIC18 long-term support commitments. The internal 32 KB Flash is sufficient for body-control state machines plus LIN-slave stacks, and the MSSP peripheral can drive SPI-controlled LED arrays or stepper-motor drivers. The exposed pad of the 28-QFN aids thermal dissipation when driving power FETs. Designers planning AEC-Q100 roadmaps should sample the PIC18F24K22-I/ML as the next-step migration with automotive qualification.
Рекомендуется
Consumer Appliance and White Goods
In washing machines, dishwashers, microwave ovens, induction cooktops, and other white goods, the PIC18LF2510-I/ML provides enough Flash (32 KB) for state-machine firmware plus an LCD or seven-segment UI, while the 10-bit ADC reads temperature and current feedback. Its nanoWatt modes reduce idle consumption to meet Energy Star standby requirements. The MSSP can drive I2C-controlled displays or EEPROMs, and the 25 I/O pins handle keypads, triac zero-cross circuits, and relay drivers directly. The 28-QFN package enables the slim profile required by modern appliance enclosures. Compared to a 32-bit ARM Cortex-M0+, the PIC18LF2510 delivers lower BOM cost and simpler firmware development for mid-complexity appliances that do not require a graphics RTOS.
Рекомендуется
Portable Medical Monitoring Devices
For portable medical monitoring devices such as pulse oximeters, thermometers, and glucose meters, the PIC18LF2510-I/ML provides low-power Sleep plus a 10-bit ADC sufficient for sensor front-ends reading thermistor bridges or photodiode current. Its 2.0-5.5 V range enables direct battery connection to two alkaline cells. The 32 KB Flash holds sensor-fusion firmware plus limited data logging in EEPROM, while the MSSP handles I2C to digital sensor front-ends. Designers should add proper isolation, ESD protection, and clinical-grade analog front-ends; the MCU itself is not medical-grade certified but is commonly used in non-critical adjunct devices. The 28-QFN footprint is small enough for wearable form factors and has enough thermal headroom for a sealed enclosure.
Рекомендуется
Educational and Hobbyist Development
The PIC18LF2510-I/ML is widely used in university embedded systems curricula and DIY maker projects thanks to Microchip's MPLAB X IDE, XC8 compiler, and the popular PICkit programmer ecosystem. With 32 KB Flash, students can implement multitasking demos, RTOS-lite kernels, USB stacks, and graphics libraries without immediate memory constraints. The QFN-28 package is achievable with breakout boards and the exposed pad is forgiving in hand-soldered prototypes when pre-heated with hot air. Compared to breadboard-friendly DIP parts, the QFN forces better soldering habits early, which is why many curricula use the SOIC variant (PIC18LF2510-I/SO) for breadboarding and reserve the QFN for final PCB projects.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC18LF2510-I/ML — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC18F2510-I/ML | PIC18LF2520-I/ML | PIC18LF2610-I/ML | PIC18LF2510-I/SO | PIC18F24J10-I/ML | PIC18LF24J11-I/ML |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6) | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-SOIC - different land pattern | 28-QFN (6x6) - same | 28-QFN (6x6) - same |
| Program Flash | 32 KB | 32 KB | 48 KB (+50%) | 96 KB (+200%) | 32 KB | 16 KB (-50%) | 16 KB (-50%) |
| RAM | 1536 bytes | 1536 bytes | 1536 bytes | 3968 bytes (+160%) | 1536 bytes | 1024 bytes (-33%) | 1024 bytes (-33%) |
| Operating Voltage | 2.0 V to 5.5 V | 4.2 V to 5.5 V (no LF) | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| Max CPU Speed | 40 MHz (10 MIPS) | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 48 MHz (faster) |
| I/O Pins | 25 | 25 | 25 | 25 | 25 | 21 (-16%) | 21 (-16%) |
| ADC | 10-bit, 11 channels | 10-bit, 11 channels | 10-bit, 11 channels | 10-bit, 11 channels | 10-bit, 11 channels | 10-bit, 13 channels (+18%) | 10-bit, 10 channels (-9%) |
| EEPROM | 256 bytes | 256 bytes | 256 bytes | 1024 bytes (+300%) | 256 bytes | 0 bytes (no on-chip EEPROM) | 0 bytes (no on-chip EEPROM) |
| Temp Range | -40C to +85C (I) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Ключевые отличия
- Wider operating voltage than PIC18F2510 (F variant) (против PIC18F2510-I/ML)
- Upgrade path to larger Flash without PCB change (против PIC18LF2520-I/ML)
- Lower Flash and tighter VDD than PIC18LF24J10-I/ML (против PIC18F24J10-I/ML)
- nanoWatt Technology and on-chip EEPROM for parameter storage (против PIC18F24J11-I/ML)
Заметки по проектированию
Add a 100 nF decoupling capacitor as close as possible to each VDD/AVDD pin (pins 20 and 11 respectively on the 28-QFN layout). The PIC18LF2510-I/ML's nanoWatt Technology Sleep mode drops the core current to the sub-diemicroampere range, but the MCU's I/O leakage and source impedance of the regulator set the floor. For battery applications, prefer a low-Iq LDO such as Microchip MCP1700 (<1.6 uA quiescent) so Sleep current is dominated by the MCU, not the regulator.
The 28-QFN (ML) package has an exposed thermal pad (EP) at its center that must be soldered to a sufficient copper pour on the PCB to meet the datasheet's thermal and electrical grounding requirements. The EP is internally bonded to VSS, so the pour doubles as both thermal relief and ground return. Recommended minimum is approximately 0.25 to 0.5 square inch of copper per JEDEC EIA/JESD51 guidance, with multiple thermal vias to the inner/ground plane.
Route the analog supply AVDD separately from the digital VDD if ADC accuracy matters; a small ferrite bead plus 100 nF + 10 uF capacitors on AVDD isolates noisy digital transients from the analog front-end. Keep analog traces short and avoid running them parallel to switching signals (PWM, clock, comms). For the MSSP I2C bus, use 2.2 k to 10 k pull-ups based on speed and capacitance, and route SDA/SCL as a differential pair to minimize EMI pickup.
Do not leave the MCLR pin floating: tie it to VDD through a 10 k resistor and add a 100 nF capacitor to ground for noise filtering. Unused I/O pins should be configured as outputs driving low or as inputs with internal weak pull-ups enabled, otherwise floating inputs can cause extra current draw in nanoWatt Sleep. The ICSP pins (RB6/PGD, RB7/PGC) must be accessible via the programming header without interfering with peripheral remapping.
When using the internal HFINTOSC source at 8 MHz or higher, the oscillator accuracy is +/- 2% across voltage; for crystal-sensitive protocols (UART at higher baud rates, USB), switch to an external crystal on OSC1/OSC2. For USART RS-485 bus termination, use 120 ohm resistors at both ends and bias the bus with a fail-safe resistor divider to keep the line idle-high. MSSP in SPI mode requires proper CPOL/CPHA matching; verify against the slave datasheet before PCB spin.
Информация о соответствии
RoHS and lead-free compliant per Microchip product page. Not AEC-Q100 qualified - for automotive designs use PIC18F24K22-I/ML (Q100) as the automotive-grade migration path. Halogen-free per Microchip green-compound labeling.
