PIC24FJ1024GB606T-I/MR - 16-bit MCU, 1MB Flash, USB | Microchip
Артикул: PIC24FJ1024GB606T-I/MR ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $6.13 | $6,13 |
| 10 | $5.49 | $54,90 |
| 100 | $4.62 | $462,00 |
| 500 | $4.1 | $2.050,00 |
| 1.000 | $3.72 | $3.720,00 |
PIC24FJ1024GB606T-I/MR Обзор
What is a PIC24F microcontroller? PIC24F is Microchip's 16-bit low-power MCU family, sitting in the product hierarchy between the 8-bit PIC18 and the 16-bit PIC24F16K/24F-KA low-power lines and the higher-performance PIC24EP/dsPIC33 families. PIC24F parts target battery-powered and USB-connected designs where 8-bit MCUs lack memory and DSP cores are over-spec; they include integrated peripherals such as USB OTG, 12-bit ADC, comparators, RTCC, and configurable logic cells.
Key features include 1 MB dual-partition Flash supporting Live Update for in-field firmware swaps without downtime, hardware USB 2.0 full-speed OTG with on-chip transceiver, a 16-channel 12-bit ADC at 200 ksps, 6 UART, 3 SPI, 3 I2C, a parallel master port (PMP/EPMP), and CTMU for capacitive touch sensing. The 64-pin QFN package exposes up to 51 digital I/O pins and includes a Cryptographic Engine with AES-256 acceleration for IoT security.
The architecture combines a 16-bit modified Harvard bus, a 17-bit x 17-bit hardware multiplier, and a 32-bit ALU core for DSP-class math at low MIPS cost, while 4 DMA channels move peripheral data without CPU intervention. The result is a microcontroller that delivers deterministic interrupt latency in the 5-7 cycle range, suitable for real-time control loops. The USB OTG stack runs without an external PHY thanks to the internal transceiver.
Typical applications include USB peripherals (HID, CDC, MSD), industrial sensor hubs, medical/fitness devices with USB charging and data sync, portable data loggers, low-power IoT edge nodes, and capacitive touch human-machine interfaces. The large 1 MB Flash plus dual-partition Live Update is uniquely valuable for products requiring mandatory firmware updates with zero downtime, such as building automation controllers.
Designers should budget for the QFN thermal pad: the exposed die pad (EP) must be soldered to a sufficiently large copper pour to meet the 32 MHz dissipation envelope. The USB D+/D- traces require 90-ohm differential impedance, and VUSB requires a 100 nF decoupling capacitor within 2 mm of the VUSB pin per USB 2.0 specification.
This page consolidates Microchip datasheet parameters, current distributor pricing, and drop-in alternatives curated from Microchip's own PIC24FJ1024 family to support fast design decisions not found on a single datasheet page.
Аналоги без доработки для PIC24FJ1024GB606T-I/MR — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC24FJ1024GB606T-I/MR (тот же форм-фактор и посадочное место) — отличается по ADC, Package, Core Architecture, Timers, Operating Temperature Range.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC24FJ1024GB606T-I/PT
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC24FJ1024GB606-I/MR
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC24FJ1024GB606T-E/MR
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC24FJ1024GA606T-I/MR
✅ Прямая замена✓ В наличии
$4.78 / шт.
Открыть даташит →PIC24FJ1024GA606-I/MR
✅ Прямая замена✓ В наличии
$4.85 / шт.
Открыть даташит →PIC24FJ1024GB606T-I/MR Максимальные параметры и электрические характеристики
| Core | PIC24F 16-bit |
| CPU Architecture | Modified Harvard, 16-bit data path |
| Max CPU Speed | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 1 MB dual-partition with Live Update |
| SRAM | 32 KB |
| USB | USB 2.0 Full-Speed OTG with on-chip transceiver |
| ADC | 12-bit, up to 16 channels |
| DMA Channels | 4 |
| Digital I/O Pins | Up to 51 |
| Корпус | 64-pin QFN (MR) 9x9 mm with exposed pad |
| Рабочая температура | -40C to +85C (industrial) |
| Supply Voltage (VDD) | 2.0 V to 3.6 V |
| Тип монтажа | Surface Mount |
| Уровень MSL | 3 (per JEDEC J-STD-020) |
| Статус RoHS | Compliant |
Руководство по цоколевке PIC24FJ1024GB606T-I/MR в корпусе 64-pin qfn (mr) 9x9 mm with exposed pad
Цоколевка для PIC24FJ1024GB606T-I/MR (корпус 64-pin qfn (mr) 9x9 mm with exposed pad). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для PIC24FJ1024GB606T-I/MR.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
PIC24FJ1024GB606T-I/MR подходит для 6 применениеs: USB Peripherals (HID / CDC / MSD), Industrial Sensor Hubs & IoT Edge Nodes, Medical & Fitness Devices with USB Sync, Portable Data Loggers, Capacitive Touch HMI Panels, Building Automation Controllers.
USB Peripherals (HID / CDC / MSD)
The PIC24FJ1024GB606T-I/MR is purpose-built for USB peripherals thanks to its integrated USB 2.0 full-speed OTG controller with on-chip transceiver - no external PHY is required, which slashes BOM cost by $0.40-$0.80 vs PHY-based designs. Its 1 MB Flash easily hosts USB stacks plus composite HID/CDC/MSD class descriptors, while 32 KB SRAM is sufficient for multi-CLUS HID reports and 64-byte USB endpoint buffers. The dual-partition Flash enables in-field firmware updates over USB without device downtime, critical for industrial keyboards, custom input devices, and diagnostic tools. Operating from 3.3 V, the part draws ~25 mA active with USB idle, and the integrated CTMU enables capacitive touch buttons on USB dock designs. The 64-pin QFN package supports up to 51 digital I/O for status LEDs and additional peripherals like SPI Flash for firmware storage.
Рекомендуется
Industrial Sensor Hubs & IoT Edge Nodes
The PIC24FJ1024GB606T-I/MR fits industrial sensor hubs by combining 16-channel 12-bit ADC sampling at 200 ksps with 4 DMA channels that move sensor data without CPU intervention - freeing the 32 MIPS core for protocol stack processing. The 1 MB dual-partition Flash supports OTA firmware updates over Modbus, CAN, or USB without shutting down the sensor hub, an essential feature for Industry 4.0 retrofits. The hardware AES-256 cryptographic engine secures MQTT-TLS payloads at line rate without software overhead. Industrial-grade -40C to +85C operation and integrated CTMU enable robust capacitive touch HMI panels. Operating current of approximately 9 mA at 32 MHz makes the part suitable for 4-20 mA loop-powered or 24 V bus-powered nodes, and the PMP/EPMP peripheral can directly drive parallel TFT displays for local HMI.
Рекомендуется
Medical & Fitness Devices with USB Sync
The PIC24FJ1024GB606T-I/MR suits battery-powered medical and fitness devices because it integrates a USB 2.0 full-speed OTG controller (no external PHY needed), runs from 2.0 V to 3.6 V on a single Li-Ion cell, and offers multiple low-power sleep modes drawing as little as 0.5 uA in Deep Sleep with RTCC running. Its 1 MB Flash accommodates BLE/USB dual-mode firmware, and 32 KB SRAM buffers sensor data between USB sync events. The CTMU peripheral supports capacitive touch buttons on wearable enclosures, while the integrated 12-bit ADC with internal temperature diode supports body temperature and battery monitoring. Hardware AES-256 protects patient data per HIPAA/GDPR requirements without firmware overhead, and the industrial temperature grade (-40C to +85C) handles fitness equipment operating environments.
Рекомендуется
Portable Data Loggers
The PIC24FJ1024GB606T-I/MR is well-suited for portable data loggers thanks to its 1 MB Flash that stores days or weeks of timestamped sensor readings without external storage, plus 32 KB SRAM to buffer multi-sensor acquisitions. Its 16-channel 12-bit ADC at 200 ksps captures fast transients, while 4 DMA channels offload logging overhead from the CPU. Low-power Sleep with RTCC operation at ~0.5 uA extends battery life to months on a single CR2032 cell for periodic-sampling applications. The USB OTG port enables direct drag-and-drop file access when plugged in, eliminating the need for a host-side driver or proprietary software. CTMU-based humidity and temperature sensor interfaces round out a complete portable logger with minimal external components. The QFN-64 package at 9x9 mm fits compact handheld enclosures.
Рекомендуется
Capacitive Touch HMI Panels
The PIC24FJ1024GB606T-I/MR drives capacitive touch HMI panels because its CTMU (Charge Time Measurement Unit) peripheral provides hardware-accelerated capacitive touch sensing on up to 16 channels with sub-10 ms response time. The integrated 12-bit ADC at 200 ksps reads CTMU timing precisely, while 32 KB SRAM holds touch debounce state machines and gesture recognition code. The PMP/EPMP peripheral drives parallel TFT or character LCDs directly without an external graphics controller, supporting up to 8-bit color depth on small QVGA panels. The 1 MB Flash accommodates full emWin/Microchip Graphics library builds, and USB OTG allows touch panels to act as USB HID input devices to PCs. Industrial -40C to +85C operation handles factory floor environments.
Рекомендуется
Building Automation Controllers
The PIC24FJ1024GB606T-I/MR is a strong fit for building automation controllers thanks to its dual-partition Flash with Live Update capability - mandatory for commercial HVAC, lighting, and access control systems where firmware updates cannot interrupt operation. Its USB 2.0 OTG port allows commissioning via USB stick or direct PC connection without external tools, while the integrated AES-256 engine secures BACnet/Modbus traffic. The 16-channel 12-bit ADC reads multiple temperature, humidity, and CO2 sensors per controller, and 6 UART peripherals handle RS-485 multi-drop fieldbus networks. With 32 KB SRAM, the part runs a real-time control loop at 1 ms cadence while managing TCP/IP via external Ethernet PHY, and the -40C to +85C industrial temperature range handles unheated equipment rooms.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC24FJ1024GB606T-I/MR — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC24FJ1024GB606T-I/PT | PIC24FJ1024GB606-I/MR | PIC24FJ1024GB606T-E/MR | PIC24FJ1024GA606T-I/MR | PIC24FJ1024GA606-I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | QFN-64 (MR) 9x9 mm | TQFP-64 (PT) 10x10 mm - same | QFN-64 (MR) 9x9 mm - same | QFN-64 (MR) 9x9 mm - same | QFN-64 (MR) 9x9 mm - same | QFN-64 (MR) 9x9 mm - same |
| CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Flash Memory | 1 MB dual-partition with Live Update | 1 MB dual-partition | 1 MB dual-partition | 1 MB dual-partition | 1 MB dual-partition | 1 MB dual-partition |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| USB OTG | Yes (USB 2.0 FS with on-chip transceiver) | Yes | Yes | Yes | No (GA series) | No (GA series) |
| AES-256 Crypto Engine | Yes (GB series) | Yes | Yes | Yes | No (GA series) | No (GA series) |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +125C (extended) | -40C to +85C | -40C to +85C |
| Price (qty 1, USD) | $6.13 | ~$6.10 | ~$6.00 | ~$6.50 | ~$5.20 | ~$5.10 |
Ключевые отличия
- Dual-partition Flash with Live Update for zero-downtime firmware updates (против PIC24FJ1024GA606T-I/MR)
- Integrated USB 2.0 OTG with on-chip transceiver (против PIC24FJ1024GA606T-I/MR)
- Hardware AES-256 cryptographic engine (против PIC24FJ1024GA606T-I/MR)
Заметки по проектированию
The 64-pin QFN (MR) package features an exposed thermal pad (EP) on the underside that must be soldered to a continuous ground copper pour of at least 1 square inch to meet the 32 MHz operating dissipation envelope. Vias-in-pad (4-8 thermal vias, 0.3 mm drill) are recommended under the EP to conduct heat to inner PCB ground planes. Without proper EP soldering, junction temperature can exceed +125C and trigger thermal shutdown under sustained USB activity. Per JEDEC EIA/JESD51 standards, the QFN-64 thermal resistance theta_JA is approximately 28 C/W on a standard JEDEC 4-layer test board; this rises sharply with reduced copper area.
USB D+/D- traces must be routed as a 90-ohm differential pair with continuous reference ground beneath, per USB 2.0 specification. Maximum trace length should be kept under 50 mm on FR-4 stack-up, and the pair must not cross any split-plane or via discontinuity. Place a 100 nF X7R decoupling capacitor within 2 mm of the VUSB pin and a 4.7 uF bulk capacitor within 5 mm. A common-mode choke (such as a BLM18AG601SN1D ferrite bead) on each line reduces EMI radiated emissions, which is critical for designs seeking USB-IF compliance certification.
Three pitfalls recur in PIC24FJ1024GB606T-I/MR designs: (1) Forgetting to configure the PGED1/PGEC1 pins as digital I/O after programming - leaving them in debug mode disables the pins for the application. (2) Attempting to read Flash during an in-field Live Update without first stopping peripheral DMA - DMA access during bank swap corrupts reads. (3) Powering the MCU below 2.0 V during Flash write operations, which causes incomplete programming and bit failures. Always verify AVDD is within 0.3 V of VDD before any Flash write, and use the on-chip voltage regulator's PWRGOOD signal to gate write operations.
At 32 MHz full activity with USB active, the PIC24FJ1024GB606T-I/MR dissipates approximately 120 mW of power. Estimated: using theta_JA of 28 C/W from a JEDEC 4-layer test board, junction temperature rise above ambient is approximately 3.4 C, well within the +125C absolute maximum. However, in sealed enclosures with limited airflow, ambient can climb to +70C, leaving only 55C margin. For industrial designs targeting +85C ambient, derate CPU clock to 16 MHz in firmware or provide forced-air cooling to maintain adequate thermal margin.
Place the 32.768 kHz crystal within 5 mm of the SOSCO/SOSCI pins with a continuous ground guard ring to reduce noise coupling from digital switching. Keep the high-speed USB D+/D- pair and the low-frequency crystal traces on separate PCB layers if possible. The MPLAB X IDE and Microchip's PIC24F peripherals library (legacy 16-bit) provide configuration bit settings and initialization routines that correctly handle oscillator startup timing - always include the low-power OscillatorType setting to avoid RTC drift in Sleep mode.
Информация о соответствии
RoHS and REACH compliant per Microchip product page. Industrial temperature grade (I suffix) is -40C to +85C, not AEC-Q100 qualified for automotive - choose -E suffix for extended temperature up to +125C. Lead-free and halogen-free per Microchip material declaration.