PIC24FJ512GB606T-I/MR - 16-Bit 32MHz 512KB Flash USB MCU | Microchip
Артикул: PIC24FJ512GB606T-I/MR ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $7.65 | $7,65 |
| 10 | $6.92 | $69,20 |
| 100 | $6.18 | $618,00 |
| 500 | $5.55 | $2.775,00 |
| 1.000 | $5.02 | $5.020,00 |
| 3.300 | $4.49 | $14.817,00 |
PIC24FJ512GB606T-I/MR Обзор
A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory, data memory, and programmable peripherals. The PIC24F architecture represents the mid-tier of Microchip's 16-bit MCU portfolio, sitting between the 8-bit PIC16/PIC18 devices and the 32-bit PIC32MX/dsPIC families, and belongs to the broader power management and embedded control category of semiconductors. The 'FJ' suffix denotes Flash-based program memory with XLP technology, while the 'GB' sub-family adds USB and graphics-friendly peripherals.
Key features include a 16-channel 12-bit ADC with 10-bit option, three I2C, two IrDA, three SPI, and six UART interfaces, plus a Parallel Master Port (PMP) for graphics or external memory expansion. The dual-partition Flash allows field firmware swap between two image banks without external memory, enabling Live Update for applications requiring zero-downtime firmware refresh. Hardware crypto accelerators and a True Random Number Generator support secure connectivity.
The device integrates a 32 kHz and a primary oscillator with PLL, four 16-bit timers, five capture/compare/PWM modules, and a CTMU for capacitive touch sensing. Advanced peripherals include a 9-bit or 16-bit Parallel Master Port, multiple DMA channels, and a real-time clock calendar. The QFN-64 package exposes 52 user I/O lines with multi-voltage I/O support.
Typical applications include industrial USB peripherals, medical fitness devices, portable data loggers, computer peripherals, and low-power wireless sensor nodes. The integrated USB OTG eliminates the need for external bridges, while XLP extends battery life in wearable designs.
Designers should plan for decoupling on all VDD/VSS pairs and follow Microchip's recommended analog/digital ground partitioning. Programming is supported via ICSP on dedicated PGECx/PGEDx pairs and the JTAG boundary scan.
This page synthesizes the Verified Web Data, drop-in alternatives in the same 64-QFN footprint, and practical design notes not assembled in the manufacturer datasheet alone.
Аналоги без доработки для PIC24FJ512GB606T-I/MR — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC24FJ512GB606T-I/MR (тот же форм-фактор и посадочное место) — отличается по Package, ADC, Core Architecture, DMA Channels, Operating Temperature Range.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC24FJ256GB606T-I/MR
✅ Прямая замена✓ В наличии
$2.92 / шт.
Открыть даташит →PIC24FJ128GB606T-I/MR
✅ Прямая замена✓ В наличии
$4.1 / шт.
Открыть даташит →PIC24FJ1024GB606T-I/MR
✅ Прямая замена✓ В наличии
$3.72 / шт.
Открыть даташит →PIC24FJ256GA606T-I/MR
✅ Прямая замена✓ В наличии
$2.95 / шт.
Открыть даташит →PIC24FJ128GA606-I/MR
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC24FJ128GB606-I/MR
✅ Прямая замена✓ В наличии
$3.62 / шт.
Открыть даташит →PIC24FJ512GB606T-I/MR Максимальные параметры и электрические характеристики
| Core Architecture | PIC24F 16-bit RISC, modified Harvard |
| Maximum CPU Frequency | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 512 KB (170K x 24) dual-partition with Live Update |
| Data RAM | 32 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| ADC | 16-channel, 12-bit (10-bit option) |
| USB Interface | USB 2.0 Full-Speed Device/Host/OTG |
| UART | 6 |
| SPI | 3 |
| I2C | 3 |
| IrDA | 2 |
| PMP (Parallel Master Port) | Yes (9/16-bit) |
| DMA Channels | Multiple (data not in verified sources) |
| Timers | 4 x 16-bit |
| CCP/PWM Modules | 5 |
| CTMU (Capacitive Touch) | Yes |
| RTCC (Real-Time Clock Calendar) | Yes |
| Диапазон рабочих температур | -40C to +85C (Industrial, I grade) |
| Корпус | 64-pin QFN (MR) 9x9 mm with exposed pad |
| Тип монтажа | Surface Mount |
| Lead-Free / RoHS | Compliant |
| User I/O Pins | 52 (multi-voltage I/O) |
Конфигурация выводов PIC24FJ512GB606T-I/MR
| Контакт 1 | RP15/RF6 — Remappable I/O / RF signal |
| Контакт 2 | RP14/RF5 — Remappable I/O |
| Контакт 3 | RP13/RF4 — Remappable I/O |
| Контакт 4 | RP12/RF3 — Remappable I/O |
| Контакт 5 | RP11/RF2 — Remappable I/O |
| Контакт 6 | RP10/RF1 — Remappable I/O |
| Контакт 7 | RP9/RF0 — Remappable I/O |
| Контакт 8 | VDD — Core supply 2.0V-3.6V |
| Контакт 9 | VSS — Ground |
| Контакт 10 | OSCI — Primary oscillator input |
| Контакт 11 | OSCO — Primary oscillator output |
| Контакт 12 | SOSCI/RPC0 — Secondary oscillator or remappable I/O |
| Контакт 13 | SOSCO/RPC1 — Secondary oscillator or remappable I/O |
| Контакт 14 | PGEC2/RPC2 — ICSP clock 2 / remappable I/O |
| Контакт 15 | PGED2/RPC3 — ICSP data 2 / remappable I/O |
| Контакт 16 | RP8/RG6 — Remappable I/O |
| Контакт 17 | RP7/RG7 — Remappable I/O |
| Контакт 18 | RP6/RG8 — Remappable I/O |
| Контакт 19 | RP5/RG9 — Remappable I/O |
| Контакт 20 | VDD — Core supply 2.0V-3.6V |
| Контакт 21 | VSS — Ground |
| Контакт 22 | AN0/RPB0 — ADC input or remappable I/O |
| Контакт 23 | AN1/RPB1 — ADC input or remappable I/O |
| Контакт 24 | AN2/RPB2 — ADC input or remappable I/O |
| Контакт 25 | AN3/RPB3 — ADC input or remappable I/O |
| Контакт 26 | AN4/RPB4 — ADC input or remappable I/O |
| Контакт 27 | AN5/RPB5 — ADC input or remappable I/O |
| Контакт 28 | VREF+/AN6/RPB6 — ADC reference positive |
| Контакт 29 | VREF-/AN7/RPB7 — ADC reference negative |
| Контакт 30 | AN8/RPB8 — ADC input or remappable I/O |
| Контакт 31 | AN9/RPB9 — ADC input or remappable I/O |
| Контакт 32 | AN10/RPB10 — ADC input or remappable I/O |
| Контакт 33 | AN11/RPB11 — ADC input or remappable I/O |
| Контакт 34 | AN12/RPB12 — ADC input or remappable I/O |
| Контакт 35 | AN13/RPB13 — ADC input or remappable I/O |
| Контакт 36 | AN14/RPB14 — ADC input or remappable I/O |
| Контакт 37 | AN15/RPB15 — ADC input or remappable I/O |
| Контакт 38 | VSS — Ground |
| Контакт 39 | VDD — Core supply 2.0V-3.6V |
| Контакт 40 | D+/RG2 — USB D+ / remappable I/O |
| Контакт 41 | D-/RG3 — USB D- / remappable I/O |
| Контакт 42 | VBUS/RG1 — USB VBUS detect / remappable I/O |
| Контакт 43 | VUSB3V3 — USB internal regulator 3.3V output |
| Контакт 44 | RPG0 — Remappable I/O |
| Контакт 45 | PMA0/RD0 — Parallel Master Port address / GPIO |
| Контакт 46 | PMA1/RD1 — Parallel Master Port address / GPIO |
| Контакт 47 | PMA2/RD2 — Parallel Master Port address / GPIO |
| Контакт 48 | PMA3/RD3 — Parallel Master Port address / GPIO |
| Контакт 49 | PMA4/RD4 — Parallel Master Port address / GPIO |
| Контакт 50 | PMA5/RD5 — Parallel Master Port address / GPIO |
| Контакт 51 | PMD0/RE0 — Parallel Master Port data / GPIO |
| Контакт 52 | PMD1/RE1 — Parallel Master Port data / GPIO |
| Контакт 53 | PMD2/RE2 — Parallel Master Port data / GPIO |
| Контакт 54 | PMD3/RE3 — Parallel Master Port data / GPIO |
| Контакт 55 | PMD4/RE4 — Parallel Master Port data / GPIO |
| Контакт 56 | PMD5/RE5 — Parallel Master Port data / GPIO |
| Контакт 57 | PMD6/RE6 — Parallel Master Port data / GPIO |
| Контакт 58 | PMD7/RE7 — Parallel Master Port data / GPIO |
| Контакт 59 | RD6 — GPIO |
| Контакт 60 | RD7 — GPIO |
| Контакт 61 | RPG3 — Remappable I/O |
| Контакт 62 | RPG4 — Remappable I/O |
| Контакт 63 | RPG5 — Remappable I/O |
| Контакт 64 | RPG6 — Remappable I/O / pad corner indicator |
Типичное применение
PIC24FJ512GB606T-I/MR подходит для 6 применениеs: Industrial USB HID Peripherals, Portable Medical and Fitness Devices, Computer Peripherals and Data Loggers, Low-Power Wireless Sensor Nodes, Automotive Infotainment Auxiliary Controllers, Portable Industrial Test and Measurement.
Industrial USB HID Peripherals
The PIC24FJ512GB606T-I/MR is well suited to industrial USB HID peripherals because it integrates a USB 2.0 Full-Speed OTG controller, eliminating external bridge ICs and reducing BOM cost. Its 512 KB of dual-partition Flash with Live Update lets OEMs field-deploy firmware updates to barcode scanners, programmable logic controllers, and HMI keypads without taking the machine offline. The 32 KB of RAM comfortably handles HID report buffers plus a TCP/IP or vendor protocol stack via the three SPI channels. Industrial grade -40C to +85C operation tolerates factory floor environments while the 64-QFN 9x9 mm package keeps the PCB compact behind the USB connector.
Рекомендуется
Portable Medical and Fitness Devices
Battery-powered medical and fitness devices benefit from the PIC24FJ512GB606T-I/MR's eXtreme Low Power (XLP) technology with sub-1 uA sleep currents and the integrated 12-bit 16-channel ADC for biopotential and motion sensor readings. The 2.0 V to 3.6 V supply range aligns directly with single-cell Li-ion chemistries, while 512 KB of Flash supports full BLE vendor stacks, sensor fusion algorithms, and FDA traceability logs. The CTMU peripheral enables reliable capacitive touch buttons without extra components, and the exposed pad QFN-64 package aids heat spreading during high ADC sampling bursts.
Рекомендуется
Computer Peripherals and Data Loggers
For USB-attached data loggers and computer peripherals, the PIC24FJ512GB606T-I/MR delivers 16 MIPS of performance through a USB CDC or vendor-class interface without needing an external PHY. Its 32 KB of RAM is sufficient for circular logging buffers, while the 512 KB Flash holds file-system code plus a multi-page configuration UI. The Parallel Master Port can drive an external SRAM for large dataset capture, and the RTCC provides accurate timestamping when offline. The compact 9x9 mm QFN package enables stick-style form factors behind USB Type-A connectors.
Рекомендуется
Low-Power Wireless Sensor Nodes
Wireless sensor nodes combining the PIC24FJ512GB606T-I/MR with sub-GHz or 2.4 GHz radios via SPI benefit from the MCU's XLP deep-sleep currents under 1 uA and fast wake-up via the RTCC alarm. The 512 KB Flash accommodates rolling firmware plus protocol stacks such as LoRaWAN, Zigbee, or vendor-proprietary MAC layers. Three I2C buses interface multiple digital sensors simultaneously, while the six UART channels support concurrent GPS, BLE, and debug pass-through. Industrial temperature tolerance suits outdoor and factory deployments.
Рекомендуется
Automotive Infotainment Auxiliary Controllers
Non-safety automotive auxiliary controllers such as HVAC control modules, USB charging ports, and rear-seat entertainment keypads benefit from the PIC24FJ512GB606T-I/MR's USB OTG, capacitive touch, and graphic-friendly Parallel Master Port. The 16 MIPS core renders menus while the 16-channel ADC reads potentiometers and NTC temperature sensors. Industrial temperature grade -40C to +85C covers cabin environments, and 512 KB of Flash fits extensive language and graphics tables. The 64-QFN exposed pad package simplifies PCB thermal layout for in-dash installations.
Рекомендуется
Portable Industrial Test and Measurement
Handheld test instruments leverage the PIC24FJ512GB606T-I/MR's 12-bit ADC sampling at high rates, the USB OTG for direct data transfer to PCs, and the abundant Flash for storing calibration tables and waveform DSP routines. The five CCP/PWM modules drive LCD backlights, buzzer tones, and signal generation, while the RTCC timestamps captured events with millisecond accuracy. Battery operation is supported by the 2.0 V minimum supply and XLP sleep modes, and the 64-QFN package fits inside pistol-grip enclosures with limited PCB area.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC24FJ512GB606T-I/MR — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC24FJ256GB606T-I/MR | PIC24FJ128GB606T-I/MR | PIC24FJ1024GB606T-I/MR | PIC24FJ256GA606T-I/MR | PIC24FJ128GA606-I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (MR) 9x9 mm | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same | 64-QFN (MR) 9x9 mm - same |
| Core | 16-bit PIC24F @ 32 MHz | 16-bit PIC24F @ 32 MHz | 16-bit PIC24F @ 32 MHz | 16-bit PIC24F @ 32 MHz | 16-bit PIC24F @ 32 MHz | 16-bit PIC24F @ 32 MHz |
| Flash Program Memory | 512 KB | 256 KB | 128 KB | 1024 KB | 256 KB | 128 KB |
| RAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| USB Controller | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | USB 2.0 FS Device/Host/OTG | None (GA sub-family) | None (GA sub-family) |
| ADC | 16-ch 12-bit | 16-ch 12-bit | 16-ch 12-bit | 16-ch 12-bit | 16-ch 12-bit | 16-ch 12-bit |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| Live Update Dual-Partition | Yes | Yes | Yes | Yes | Yes | Yes |
Ключевые отличия
- Largest Flash density in the GB606 64-QFN family besides 1024 KB (против PIC24FJ256GB606T-I/MR)
- Integrated USB 2.0 OTG controller on-chip (против PIC24FJ256GA606T-I/MR)
- 16 MIPS at 32 MHz with XLP sub-1 uA sleep (против PIC24FJ128GB606T-I/MR)
Заметки по проектированию
Decouple each VDD/VSS pair with a 100 nF ceramic capacitor placed as close as possible to the MCU pins, plus a single 10 uF bulk capacitor near the package. The 64-QFN exposed pad must be soldered to a grounded copper pour to provide thermal relief and a low-impedance ground return. The USB VUSB3V3 pin requires its own decoupling per the USB section of the PIC24FJ512GB606 datasheet to suppress internal regulator switching noise.
Route the USB D+ and D- differential pair with 90 ohm differential impedance and length matching within 150 mil. Place the ESD protection diode within 5 mm of the USB connector and provide a continuous ground return under the pair. Keep the 32 kHz secondary oscillator traces short and shielded from high-frequency digital lines to maintain RTCC accuracy across the industrial temperature range.
Use analog/digital ground partitioning with a single tie-point under or beside the QFN exposed pad. Shield analog traces (ADC inputs, VREF+, VREF-) from PWM and switching signals to preserve the 12-bit ADC accuracy. Remappable peripheral pins (RPx) should be assigned in software first to minimize PCB rewiring across PIC24FJ GB subfamily variants that share the 64-QFN footprint.
Do not apply voltage above 3.6 V to any VDD pin or the I/O ring will latch-up. Ensure PGECx/PGEDx pairs are routed together; mixing pairs breaks ICSP programming. When using the dual-partition Live Update feature, both image banks must be programmed before field deployment to guarantee a recoverable bootloader, and the boot configuration words must be set per Microchip application note TB3138.
Информация о соответствии
RoHS and lead-free confirmed via Microchip product page and DigiKey listing. AEC-Q100 not applicable for this part; contact Microchip for Q-grade automotive variants. Halogen-free status not specified in verified sources.