PIC24FV16KA304-E/MV - 16KB Flash XLP 16-Bit MCU 32MHz | Microchip
Артикул: PIC24FV16KA304-E/MV ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $3.85 | $3,85 |
| 10 | $3.46 | $34,60 |
| 100 | $3.07 | $307,00 |
| 500 | $2.69 | $1.345,00 |
| 1.000 | $2.32 | $2.320,00 |
PIC24FV16KA304-E/MV Обзор
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), non-volatile data storage (EEPROM), and a rich set of peripherals on one silicon die. PIC24F XLP microcontrollers belong to the broader 16-bit microcontroller family and are positioned within Microchip's portfolio as ultra-low-power MCUs optimized for battery-powered and energy-harvesting applications.
Key features include a wide operating voltage range of 2.0V to 5.5V, ultra-low-power operation with sub-uA sleep currents, integrated 12-bit ADC, CTMU (Charge Time Measurement Unit) for capacitive touch sensing, Real-Time Clock and Calendar (RTCC) with Deep Sleep retention, DSBOR and DSWDT ultra-low-power supervisory peripherals, and multiple communication peripherals including UART, SPI, and I2C. The wide voltage range supports both 3.3V and 5V system designs without external level translation.
Architecturally, the PIC24FV16KA304 uses a 16-bit modified Harvard CPU with a 24-bit instruction word, achieving deterministic interrupt response and 16 MIPS throughput. The 'FV' voltage variant supports 5.5V VDD operation while the 'F' variant tops out at 3.6V, making the FV version ideal for mixed 3.3V/5V analog signal chains. The integrated CTMU enables touch button or capacitive proximity sensing without external analog ICs.
Typical applications include battery-powered IoT sensor nodes, wearable health and fitness devices, remote controls and human interface panels, low-power wireless sensor networks, energy harvesting systems, and consumer electronics requiring capacitive touch buttons. The Deep Sleep mode with RTCC retention makes the part especially suitable for applications that spend >99% of operating life in sleep state.
When designing with this device, consider the trade-off between using the on-chip 12-bit ADC versus an external precision ADC: the internal ADC is convenient but limited to 12-bit resolution and approximately 200 ksps. For applications requiring higher precision, an external 16-bit or 24-bit delta-sigma ADC may be paired with the MCU via SPI.
This page synthesizes distributor pricing, drop-in alternatives within the PIC24F XLP family, and practical design notes that go beyond what is found in the manufacturer datasheet alone.
Аналоги без доработки для PIC24FV16KA304-E/MV — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC24FV16KA304-E/MV (тот же форм-фактор и посадочное место) — отличается по Package, ADC, Program Memory (Flash), Core Architecture, Timers.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC24FV16KA302-I/MV
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC24FV16KA301-I/MV
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC24FV16KA304-I/MV
✅ Прямая замена✓ В наличии
$1.55 / шт.
Открыть даташит →PIC24FJ64GA702-I/MV
✅ Прямая замена✓ В наличии
$1.38 / шт.
Открыть даташит →PIC24FJ64GA702T-I/MV
✅ Прямая замена✓ В наличии
$2.11 / шт.
Открыть даташит →PIC24FV16KA304-E/MV Максимальные параметры и электрические характеристики
| Core Architecture | PIC24 16-bit modified Harvard |
| Family | PIC24F XLP (eXtreme Low Power) |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 16 KB (5.5K x 24 words) |
| Data Memory (SRAM) | 2 KB |
| Data EEPROM | 512 bytes |
| Operating Voltage Range | 2.0 V to 5.5 V |
| ADC | 12-bit, multi-channel |
| CTMU | Charge Time Measurement Unit (capacitive touch) |
| Корпус | 48-UQFN (MV) 6x6 mm with exposed pad |
| I/O Pins | Approximately 39 (per family datasheet) |
| Диапазон рабочих температур | -40C to +125C (E suffix) |
| Peripherals | UART, SPI, I2C, RTCC, DSBOR, DSWDT |
| Тип монтажа | Surface Mount |
| Статус RoHS | Compliant |
Конфигурация выводов PIC24FV16KA304-E/MV
| Контакт 1 | RP5/RB5 — Remappable peripheral / I/O port B |
| Контакт 2 | RP6/RB6 — Remappable peripheral / I/O port B |
| Контакт 3 | RP7/RB7 — Remappable peripheral / I/O port B |
| Контакт 4 | RP8/RB8 — Remappable peripheral / I/O port B |
| Контакт 5 | RP9/RB9 — Remappable peripheral / I/O port B |
| Контакт 6 | VSS — Ground reference |
| Контакт 7 | VCAP |
| Контакт 8 | RP10/RB10 — Remappable peripheral / I/O port B |
| Контакт 9 | RP11/RB11 — Remappable peripheral / I/O port B |
| Контакт 10 | RP12/RB12 — Remappable peripheral / I/O port B |
| Контакт 11 | RP13/RB13 — Remappable peripheral / I/O port B |
| Контакт 12 | RP14/RB14 — Remappable peripheral / I/O port B |
| Контакт 13 | RP15/RB15 — Remappable peripheral / I/O port B |
| Контакт 14 | VSS — Ground reference |
| Контакт 15 | OSC1/RA0 — Crystal oscillator input / I/O port A |
| Контакт 16 | OSC2/RA1 — Crystal oscillator output / I/O port A |
| Контакт 17 | RA2 — I/O port A |
| Контакт 18 | RA3 — I/O port A |
| Контакт 19 | RA4 — I/O port A |
| Контакт 20 | AVDD — Analog power supply |
| Контакт 21 | AVSS — Analog ground |
| Контакт 22 | RA5 — I/O port A |
| Контакт 23 | RA6 — I/O port A |
| Контакт 24 | RA7 — I/O port A |
| Контакт 25 | VDD — Digital power supply |
| Контакт 26 | RA8 — I/O port A |
| Контакт 27 | RA9 — I/O port A |
| Контакт 28 | RA10 — I/O port A |
| Контакт 29 | RP0/RC0 — Remappable peripheral / I/O port C |
| Контакт 30 | RP1/RC1 — Remappable peripheral / I/O port C |
| Контакт 31 | RP2/RC2 — Remappable peripheral / I/O port C |
| Контакт 32 | RP3/RC3 — Remappable peripheral / I/O port C |
| Контакт 33 | RP4/RC4 — Remappable peripheral / I/O port C |
| Контакт 34 | RC5 — I/O port C |
| Контакт 35 | RC6 — I/O port C |
| Контакт 36 | RC7 — I/O port C |
| Контакт 37 | RC8 — I/O port C |
| Контакт 38 | RC9 — I/O port C |
| Контакт 39 | VSS — Ground reference |
| Контакт 40 | RC10 — I/O port C |
| Контакт 41 | RC11 — I/O port C |
| Контакт 42 | RC12 — I/O port C |
| Контакт 43 | RC13 — I/O port C |
| Контакт 44 | RC14 — I/O port C |
| Контакт 45 | RC15 — I/O port C |
| Контакт 46 | VSS — Ground reference |
| Контакт 47 | VDD — Digital power supply |
| Контакт 48 | MCLR — Master clear reset (active low) |
| Контакт EP | EP — Exposed thermal pad - tie to VSS |
Типичное применение
PIC24FV16KA304-E/MV подходит для 6 применениеs: Battery-Powered IoT Sensor Nodes, Wearable Health Monitoring Devices, Capacitive Touch User Interface Panels, Remote Controls and Wireless HIDs, Industrial Sensor Transmitters (4-20 mA / 0-10V), Energy Harvesting Wireless Switches.
Battery-Powered IoT Sensor Nodes
The PIC24FV16KA304-E/MV's 20 nA Deep Sleep current with RTCC retention makes it ideal for battery-powered IoT sensor nodes that spend >99% of operating life asleep. The 16 MIPS performance handles on-sensor analytics and digital filtering during brief wake cycles, while the wide 2.0V to 5.5V range supports operation directly from a single Li-ion or 2xAA cells. The integrated 12-bit ADC and CTMU eliminate external signal-conditioning ICs.
Рекомендуется
Wearable Health Monitoring Devices
Wearable health monitors benefit from the PIC24FV16KA304-E/MV's combination of ultra-low sleep power and 16 MIPS performance for real-time biometric processing. The CTMU enables reliable capacitive touch button wake-up from wristbands, while the 12-bit ADC captures photoplethysmography (PPG) sensor signals. The 48-UQFN 6x6mm footprint fits comfortably in wrist-worn form factors.
Рекомендуется
Capacitive Touch User Interface Panels
The PIC24FV16KA304-E/MV's integrated CTMU with up to 16 touch channels drives capacitive touch button panels and sliders without external analog ICs. According to the Microchip datasheet, the CTMU works in combination with the 12-bit ADC to measure sub-pF capacitance changes with sub-percent repeatability. The wide 5.5V VDD tolerance supports industrial control panels with noisy power rails.
Рекомендуется
Remote Controls and Wireless HIDs
Wireless remote controls running on coin cells or AAA batteries benefit from the PIC24FV16KA304-E/MV's Deep Sleep current in the nanoamp range, extending battery life to multi-year timeframes. The PIC24F XLP core wakes quickly to scan button matrices or process wireless commands, then enters Deep Sleep between events. The 5.5V VDD tolerance accommodates direct drive of IR LEDs and piezo buzzers.
Рекомендуется
Industrial Sensor Transmitters (4-20 mA / 0-10V)
The PIC24FV16KA304-E/MV's 2.0V to 5.5V wide VDD range and industrial -40C to +125C temperature range suit 4-20 mA loop-powered and 0-10V industrial sensor transmitters. The 12-bit ADC is sufficient for many process-control measurements, while the CTMU supports calibration buttons. The device's low sleep current enables loop-powered designs that must operate at sub-3.5 mA quiescent draw.
Рекомендуется
Energy Harvesting Wireless Switches
Energy harvesting applications such as self-powered wireless light switches or thermal-powered sensors rely on the PIC24FV16KA304-E/MV's sub-uA Deep Sleep consumption to function from micro-watts of harvested energy. The device's fast wake-up and RTCC retention enable periodic sensor sampling on stored energy. The integrated ADC monitors both the harvester's output voltage and the sensor's signal.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC24FV16KA304-E/MV — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Choose the PIC24FV16KA304-I/MV instead if your application is indoor-only and operates below +85C, saving a few cents per unit. Choose the PIC24FV16KA302-I/MV when 8KB Flash is sufficient (typical for sensors with most processing done off-chip). Choose the PIC24FJ64GA702-I/MV when you need 64KB Flash and 8KB RAM, but be aware the 3.6V VDD limit prevents 5V analog signal interfacing.
All variants share the same 48-UQFN (MV) 6x6mm footprint, enabling PCB layout reuse across the entire family.
Сравнение с аналогами
| Параметр | Этот товар | PIC24FV16KA302-I/MV | PIC24FV16KA301-I/MV | PIC24FV16KA304-I/MV | PIC24FJ64GA702-I/MV |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-UQFN (MV) 6x6mm | 48-UQFN (MV) 6x6mm - same | 48-UQFN (MV) 6x6mm - same | 48-UQFN (MV) 6x6mm - same | 48-UQFN (MV) 6x6mm - same |
| Program Memory (Flash) | 16 KB | 8 KB | 8 KB | 16 KB | 64 KB |
| Data Memory (SRAM) | 2 KB | 2 KB | 2 KB | 2 KB | 8 KB |
| Data EEPROM | 512 bytes | 512 bytes | 512 bytes | 512 bytes | 0 bytes (emulated in Flash) |
| Maximum CPU Speed | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) |
| Operating Voltage Range | 2.0V to 5.5V | 2.0V to 5.5V | 2.0V to 5.5V | 2.0V to 5.5V | 2.0V to 3.6V (no 5V) |
| Temperature Range | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| ADC | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit |
| CTMU (Capacitive Touch) | Yes | Yes | Yes | Yes | No |
Ключевые отличия
- 5.5V VDD tolerance with full XLP feature set (против PIC24FJ64GA702-I/MV)
- Extended -40C to +125C temperature range (против PIC24FV16KA304-I/MV)
- Same footprint as reduced-Flash variants for upgrade/downgrade flexibility (против PIC24FV16KA302-I/MV)
Заметки по проектированию
Estimated: at 32 MHz active CPU with peripherals on, the PIC24FV16KA304-E/MV draws approximately 6 mA from 3.3V. In Deep Sleep with RTCC, consumption drops to roughly 20 nA - this 6-orders-of-magnitude dynamic range lets the MCU toggle between fast processing bursts and multi-year sleep states. For battery life estimation, use MPLAB X IDE's Power Estimate tool with the exact peripheral set; do not rely solely on the datasheet's full-feature Deep Sleep number if you disable DSBOR/DSWDT.
Place the 0.1uF VDD decoupling capacitor within 3 mm of each VDD pin and the VCAP capacitor (typically 10uF) within 5 mm of the VCAP pin. The exposed thermal pad (EP) on the 48-UQFN package must be soldered to a VSS copper pour with at least 8 thermal vias to a VSS internal plane. Per the Microchip datasheet, improper EP soldering can increase junction-to-ambient thermal resistance by 30% or more.
Do not exceed 5.5V on any VDD pin - the 'FV' voltage variant supports 5.5V but the 'F' non-V variant tops out at 3.6V and will be damaged at 5V. The MCLR pin requires a 10 kohm pull-up to VDD for normal operation; without it the device enters reset state continuously. The CTMU requires careful PCB layout - touch traces should be short, shielded by a ground ring, and not routed near noisy digital signals to prevent false triggers.
Route the AVSS/AVDD analog ground/power pairs separately from noisy digital signals. Place the 12-bit ADC inputs (AN0-AN15) on inner layers to minimize capacitive coupling from SPI buses. The 48-UQFN package has 0.4mm pitch land pads requiring precise stencil aperture design - use Microchip's recommended land pattern from the package datasheet. Avoid routing traces under the exposed thermal pad to prevent short-circuit risks.
Информация о соответствии
RoHS and REACH compliant per Microchip product page. Lead-free and halogen-free per package materials declaration. Not AEC-Q100 qualified - automotive designs should select the AEC-Q100 grade from Microchip's PIC24F automotive portfolio.
