PIC24FV16KA304-E/MV - 16KB Flash XLP 16-Bit MCU 32MHz | Microchip
Référence : PIC24FV16KA304-E/MV ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.85 | $3,85 |
| 10 | $3.46 | $34,60 |
| 100 | $3.07 | $307,00 |
| 500 | $2.69 | $1 345,00 |
| 1 000 | $2.32 | $2 320,00 |
PIC24FV16KA304-E/MV Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), non-volatile data storage (EEPROM), and a rich set of peripherals on one silicon die. PIC24F XLP microcontrollers belong to the broader 16-bit microcontroller family and are positioned within Microchip's portfolio as ultra-low-power MCUs optimized for battery-powered and energy-harvesting applications.
Key features include a wide operating voltage range of 2.0V to 5.5V, ultra-low-power operation with sub-uA sleep currents, integrated 12-bit ADC, CTMU (Charge Time Measurement Unit) for capacitive touch sensing, Real-Time Clock and Calendar (RTCC) with Deep Sleep retention, DSBOR and DSWDT ultra-low-power supervisory peripherals, and multiple communication peripherals including UART, SPI, and I2C. The wide voltage range supports both 3.3V and 5V system designs without external level translation.
Architecturally, the PIC24FV16KA304 uses a 16-bit modified Harvard CPU with a 24-bit instruction word, achieving deterministic interrupt response and 16 MIPS throughput. The 'FV' voltage variant supports 5.5V VDD operation while the 'F' variant tops out at 3.6V, making the FV version ideal for mixed 3.3V/5V analog signal chains. The integrated CTMU enables touch button or capacitive proximity sensing without external analog ICs.
Typical applications include battery-powered IoT sensor nodes, wearable health and fitness devices, remote controls and human interface panels, low-power wireless sensor networks, energy harvesting systems, and consumer electronics requiring capacitive touch buttons. The Deep Sleep mode with RTCC retention makes the part especially suitable for applications that spend >99% of operating life in sleep state.
When designing with this device, consider the trade-off between using the on-chip 12-bit ADC versus an external precision ADC: the internal ADC is convenient but limited to 12-bit resolution and approximately 200 ksps. For applications requiring higher precision, an external 16-bit or 24-bit delta-sigma ADC may be paired with the MCU via SPI.
This page synthesizes distributor pricing, drop-in alternatives within the PIC24F XLP family, and practical design notes that go beyond what is found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour PIC24FV16KA304-E/MV — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24FV16KA304-E/MV (même facteur de forme et même empreinte) — différant par Package, ADC, Program Memory (Flash), Core Architecture, Timers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24FV16KA302-I/MV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24FV16KA301-I/MV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC24FV16KA304-I/MV
✅ Remplacement direct✓ En stock
$1.55 / unité
Voir la fiche technique →PIC24FJ64GA702-I/MV
✅ Remplacement direct✓ En stock
$1.38 / unité
Voir la fiche technique →PIC24FJ64GA702T-I/MV
✅ Remplacement direct✓ En stock
$2.11 / unité
Voir la fiche technique →PIC24FV16KA304-E/MV Valeurs maximales et caractéristiques électriques
| Core Architecture | PIC24 16-bit modified Harvard |
| Family | PIC24F XLP (eXtreme Low Power) |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 16 KB (5.5K x 24 words) |
| Data Memory (SRAM) | 2 KB |
| Data EEPROM | 512 bytes |
| Operating Voltage Range | 2.0 V to 5.5 V |
| ADC | 12-bit, multi-channel |
| CTMU | Charge Time Measurement Unit (capacitive touch) |
| Boîtier | 48-UQFN (MV) 6x6 mm with exposed pad |
| I/O Pins | Approximately 39 (per family datasheet) |
| Plage de température de fonctionnement | -40C to +125C (E suffix) |
| Peripherals | UART, SPI, I2C, RTCC, DSBOR, DSWDT |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de PIC24FV16KA304-E/MV
| Broche 1 | RP5/RB5 — Remappable peripheral / I/O port B |
| Broche 2 | RP6/RB6 — Remappable peripheral / I/O port B |
| Broche 3 | RP7/RB7 — Remappable peripheral / I/O port B |
| Broche 4 | RP8/RB8 — Remappable peripheral / I/O port B |
| Broche 5 | RP9/RB9 — Remappable peripheral / I/O port B |
| Broche 6 | VSS — Ground reference |
| Broche 7 | VCAP |
| Broche 8 | RP10/RB10 — Remappable peripheral / I/O port B |
| Broche 9 | RP11/RB11 — Remappable peripheral / I/O port B |
| Broche 10 | RP12/RB12 — Remappable peripheral / I/O port B |
| Broche 11 | RP13/RB13 — Remappable peripheral / I/O port B |
| Broche 12 | RP14/RB14 — Remappable peripheral / I/O port B |
| Broche 13 | RP15/RB15 — Remappable peripheral / I/O port B |
| Broche 14 | VSS — Ground reference |
| Broche 15 | OSC1/RA0 — Crystal oscillator input / I/O port A |
| Broche 16 | OSC2/RA1 — Crystal oscillator output / I/O port A |
| Broche 17 | RA2 — I/O port A |
| Broche 18 | RA3 — I/O port A |
| Broche 19 | RA4 — I/O port A |
| Broche 20 | AVDD — Analog power supply |
| Broche 21 | AVSS — Analog ground |
| Broche 22 | RA5 — I/O port A |
| Broche 23 | RA6 — I/O port A |
| Broche 24 | RA7 — I/O port A |
| Broche 25 | VDD — Digital power supply |
| Broche 26 | RA8 — I/O port A |
| Broche 27 | RA9 — I/O port A |
| Broche 28 | RA10 — I/O port A |
| Broche 29 | RP0/RC0 — Remappable peripheral / I/O port C |
| Broche 30 | RP1/RC1 — Remappable peripheral / I/O port C |
| Broche 31 | RP2/RC2 — Remappable peripheral / I/O port C |
| Broche 32 | RP3/RC3 — Remappable peripheral / I/O port C |
| Broche 33 | RP4/RC4 — Remappable peripheral / I/O port C |
| Broche 34 | RC5 — I/O port C |
| Broche 35 | RC6 — I/O port C |
| Broche 36 | RC7 — I/O port C |
| Broche 37 | RC8 — I/O port C |
| Broche 38 | RC9 — I/O port C |
| Broche 39 | VSS — Ground reference |
| Broche 40 | RC10 — I/O port C |
| Broche 41 | RC11 — I/O port C |
| Broche 42 | RC12 — I/O port C |
| Broche 43 | RC13 — I/O port C |
| Broche 44 | RC14 — I/O port C |
| Broche 45 | RC15 — I/O port C |
| Broche 46 | VSS — Ground reference |
| Broche 47 | VDD — Digital power supply |
| Broche 48 | MCLR — Master clear reset (active low) |
| Broche EP | EP — Exposed thermal pad - tie to VSS |
Applications typiques
PIC24FV16KA304-E/MV convient pour 6 applications: Battery-Powered IoT Sensor Nodes, Wearable Health Monitoring Devices, Capacitive Touch User Interface Panels, Remote Controls and Wireless HIDs, Industrial Sensor Transmitters (4-20 mA / 0-10V), Energy Harvesting Wireless Switches.
Battery-Powered IoT Sensor Nodes
The PIC24FV16KA304-E/MV's 20 nA Deep Sleep current with RTCC retention makes it ideal for battery-powered IoT sensor nodes that spend >99% of operating life asleep. The 16 MIPS performance handles on-sensor analytics and digital filtering during brief wake cycles, while the wide 2.0V to 5.5V range supports operation directly from a single Li-ion or 2xAA cells. The integrated 12-bit ADC and CTMU eliminate external signal-conditioning ICs.
Recommandé
Wearable Health Monitoring Devices
Wearable health monitors benefit from the PIC24FV16KA304-E/MV's combination of ultra-low sleep power and 16 MIPS performance for real-time biometric processing. The CTMU enables reliable capacitive touch button wake-up from wristbands, while the 12-bit ADC captures photoplethysmography (PPG) sensor signals. The 48-UQFN 6x6mm footprint fits comfortably in wrist-worn form factors.
Recommandé
Capacitive Touch User Interface Panels
The PIC24FV16KA304-E/MV's integrated CTMU with up to 16 touch channels drives capacitive touch button panels and sliders without external analog ICs. According to the Microchip datasheet, the CTMU works in combination with the 12-bit ADC to measure sub-pF capacitance changes with sub-percent repeatability. The wide 5.5V VDD tolerance supports industrial control panels with noisy power rails.
Recommandé
Remote Controls and Wireless HIDs
Wireless remote controls running on coin cells or AAA batteries benefit from the PIC24FV16KA304-E/MV's Deep Sleep current in the nanoamp range, extending battery life to multi-year timeframes. The PIC24F XLP core wakes quickly to scan button matrices or process wireless commands, then enters Deep Sleep between events. The 5.5V VDD tolerance accommodates direct drive of IR LEDs and piezo buzzers.
Recommandé
Industrial Sensor Transmitters (4-20 mA / 0-10V)
The PIC24FV16KA304-E/MV's 2.0V to 5.5V wide VDD range and industrial -40C to +125C temperature range suit 4-20 mA loop-powered and 0-10V industrial sensor transmitters. The 12-bit ADC is sufficient for many process-control measurements, while the CTMU supports calibration buttons. The device's low sleep current enables loop-powered designs that must operate at sub-3.5 mA quiescent draw.
Recommandé
Energy Harvesting Wireless Switches
Energy harvesting applications such as self-powered wireless light switches or thermal-powered sensors rely on the PIC24FV16KA304-E/MV's sub-uA Deep Sleep consumption to function from micro-watts of harvested energy. The device's fast wake-up and RTCC retention enable periodic sensor sampling on stored energy. The integrated ADC monitors both the harvester's output voltage and the sensor's signal.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24FV16KA304-E/MV — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Choose the PIC24FV16KA304-I/MV instead if your application is indoor-only and operates below +85C, saving a few cents per unit. Choose the PIC24FV16KA302-I/MV when 8KB Flash is sufficient (typical for sensors with most processing done off-chip). Choose the PIC24FJ64GA702-I/MV when you need 64KB Flash and 8KB RAM, but be aware the 3.6V VDD limit prevents 5V analog signal interfacing.
All variants share the same 48-UQFN (MV) 6x6mm footprint, enabling PCB layout reuse across the entire family.
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24FV16KA302-I/MV | PIC24FV16KA301-I/MV | PIC24FV16KA304-I/MV | PIC24FJ64GA702-I/MV |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-UQFN (MV) 6x6mm | 48-UQFN (MV) 6x6mm - same | 48-UQFN (MV) 6x6mm - same | 48-UQFN (MV) 6x6mm - same | 48-UQFN (MV) 6x6mm - same |
| Program Memory (Flash) | 16 KB | 8 KB | 8 KB | 16 KB | 64 KB |
| Data Memory (SRAM) | 2 KB | 2 KB | 2 KB | 2 KB | 8 KB |
| Data EEPROM | 512 bytes | 512 bytes | 512 bytes | 512 bytes | 0 bytes (emulated in Flash) |
| Maximum CPU Speed | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) |
| Operating Voltage Range | 2.0V to 5.5V | 2.0V to 5.5V | 2.0V to 5.5V | 2.0V to 5.5V | 2.0V to 3.6V (no 5V) |
| Temperature Range | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| ADC | 12-bit | 12-bit | 12-bit | 12-bit | 12-bit |
| CTMU (Capacitive Touch) | Yes | Yes | Yes | Yes | No |
Principaux différenciateurs
- 5.5V VDD tolerance with full XLP feature set (vs PIC24FJ64GA702-I/MV)
- Extended -40C to +125C temperature range (vs PIC24FV16KA304-I/MV)
- Same footprint as reduced-Flash variants for upgrade/downgrade flexibility (vs PIC24FV16KA302-I/MV)
Notes de conception
Estimated: at 32 MHz active CPU with peripherals on, the PIC24FV16KA304-E/MV draws approximately 6 mA from 3.3V. In Deep Sleep with RTCC, consumption drops to roughly 20 nA - this 6-orders-of-magnitude dynamic range lets the MCU toggle between fast processing bursts and multi-year sleep states. For battery life estimation, use MPLAB X IDE's Power Estimate tool with the exact peripheral set; do not rely solely on the datasheet's full-feature Deep Sleep number if you disable DSBOR/DSWDT.
Place the 0.1uF VDD decoupling capacitor within 3 mm of each VDD pin and the VCAP capacitor (typically 10uF) within 5 mm of the VCAP pin. The exposed thermal pad (EP) on the 48-UQFN package must be soldered to a VSS copper pour with at least 8 thermal vias to a VSS internal plane. Per the Microchip datasheet, improper EP soldering can increase junction-to-ambient thermal resistance by 30% or more.
Do not exceed 5.5V on any VDD pin - the 'FV' voltage variant supports 5.5V but the 'F' non-V variant tops out at 3.6V and will be damaged at 5V. The MCLR pin requires a 10 kohm pull-up to VDD for normal operation; without it the device enters reset state continuously. The CTMU requires careful PCB layout - touch traces should be short, shielded by a ground ring, and not routed near noisy digital signals to prevent false triggers.
Route the AVSS/AVDD analog ground/power pairs separately from noisy digital signals. Place the 12-bit ADC inputs (AN0-AN15) on inner layers to minimize capacitive coupling from SPI buses. The 48-UQFN package has 0.4mm pitch land pads requiring precise stencil aperture design - use Microchip's recommended land pattern from the package datasheet. Avoid routing traces under the exposed thermal pad to prevent short-circuit risks.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Lead-free and halogen-free per package materials declaration. Not AEC-Q100 qualified - automotive designs should select the AEC-Q100 grade from Microchip's PIC24F automotive portfolio.
