PIC32MX130F128H-V/MR - 32-bit MCU, 128KB Flash, 64-QFN | Microchip
Артикул: PIC32MX130F128H-V/MR ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $6.4 | $6,40 |
| 10 | $5.76 | $57,60 |
| 100 | $5.12 | $512,00 |
| 500 | $4.61 | $2.305,00 |
| 1.000 | $4.1 | $4.100,00 |
PIC32MX130F128H-V/MR Обзор
A PIC32MX microcontroller is a 32-bit MIPS-based MCU from Microchip's PIC32 family, sitting between 16-bit PIC24/dsPIC and 32-bit ARM Cortex-M devices. It combines a Harvard-architecture M4K core with rich peripherals such as USB, CAN, I2S, PMP, and Peripheral Pin Select (PPS) routing, making it a versatile choice for connectivity, graphical, and real-time control applications.
Key features of the PIC32MX130F128H-V/MR include up to 50 MHz / 83 DMIPS core performance, two I2S and four SPI modules for codec and serial communications, Peripheral Pin Select (PPS) for flexible peripheral-to-pin mapping, Parallel Master Port (PMP) with dual buffers for graphics interfaces, a 10-bit 1 Msps ADC with up to 13 channels, and an mTouch capacitive-touch peripheral for touch-sensing user input. The 128 KB Flash supports large application firmware with library overhead.
Architecturally, the device integrates a 5-stage pipeline M4K core with single-cycle multiplication, a prefetch cache to accelerate Flash execution, an 8-channel DMA controller for low-CPU-overhead data movement, and a 10-bit 1 Msps analog-to-digital converter. The 2.5V/3.3V dual-voltage core with on-chip regulator simplifies single-supply 3.3V designs while maintaining low active power consumption typical of the PIC32MX1xx family.
Typical applications include automotive body and infotainment subsystems, industrial HMI panels with PMP-driven LCDs, USB peripherals such as HID and CDC class devices, IoT sensor nodes, audio playback products using I2S DACs, and capacitive-touch user interfaces. The wide operating temperature range and AEC-Q100 qualification support under-hood and dashboard deployments.
When designing with this MCU, allocate the 128 KB Flash budget between bootloader, application, and library code early; PPS reassignment must be configured in code at startup to avoid pin conflicts; the QFN EP requires thermal via stitching under the exposed pad for reliable heat dissipation in industrial/automotive environments.
This page synthesizes distributor pricing, drop-in PIC32MX alternatives, PPS-aware design notes, and AEC-Q100 qualification context not found aggregated on any single manufacturer page.
Аналоги без доработки для PIC32MX130F128H-V/MR — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC32MX130F128H-V/MR (тот же форм-фактор и посадочное место) — отличается по ADC, Package, Operating Temperature, Core Architecture, Program Memory (Flash).
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC32MX130F128HT-V/MR
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC32MX130F128H-I/MR
✅ Прямая замена✓ В наличии
$3.05 / шт.
Открыть даташит →PIC32MX130F256H-V/MR
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
PIC32MX130F128H-V/PT
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
PIC32MX150F128H-V/MR
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
PIC32MX130F064H-V/MR
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC32MX130F128H-V/MR Максимальные параметры и электрические характеристики
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 50 MHz |
| Core Performance | 83 DMIPS |
| Program Flash | 128 KB (128K x 8) |
| Data SRAM | 16 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| I/O Voltage | 3.3 V |
| ADC | 10-bit, up to 13 channels, 1 Msps |
| SPI Modules | 4 |
| I2S Modules | 2 |
| Peripheral Pin Select (PPS) | Yes |
| Parallel Master Port (PMP) | Yes, dual buffers |
| DMA Channels | 8 |
| Рабочая температура | -40 C to +105 C (V grade) |
| Корпус | 64-QFN (MR), 9x9 mm with exposed pad |
| AEC-Q100 Qualification | Yes |
| Тип монтажа | Surface Mount |
Конфигурация выводов PIC32MX130F128H-V/MR
| Контакт 1 | RPB0/AN0/C1IN+/VBUSON — PPS-mappable I/O, ADC analog input 0 |
| Контакт 2 | RPB1/AN1/C1IN- — PPS-mappable I/O, ADC analog input 1 |
| Контакт 3 | RPB2/AN2/C2IN+/CVREF- — PPS-mappable I/O, ADC analog input 2 |
| Контакт 4 | RPB3/AN3/C2IN-/CVREF+ — PPS-mappable I/O, ADC analog input 3 |
| Контакт 5 | RPB4/AN4/C1OUT — PPS-mappable I/O, ADC analog input 4 |
| Контакт 6 | RPB5/AN5/C2OUT — PPS-mappable I/O, ADC analog input 5 |
| Контакт 7 | RPC0/PMA6/INT0 — PPS-mappable I/O, PMP address 6, external interrupt 0 |
| Контакт 8 | RPC1/PMA7 — PPS-mappable I/O, PMP address 7 |
| Контакт 9 | RPC2/PMA8 — PPS-mappable I/O, PMP address 8 |
| Контакт 10 | RPC3/PMA9 — PPS-mappable I/O, PMP address 9 |
| Контакт 11 | RPC4/PMA10 — PPS-mappable I/O, PMP address 10 |
| Контакт 12 | RPC5/PMA11 — PPS-mappable I/O, PMP address 11 |
| Контакт 13 | RPC6/PMA12 — PPS-mappable I/O, PMP address 12 |
| Контакт 14 | RPC7/PMA13 — PPS-mappable I/O, PMP address 13 |
| Контакт 15 | RPC8/PMA14 — PPS-mappable I/O, PMP address 14 |
| Контакт 16 | RPC9/PMA15 — PPS-mappable I/O, PMP address 15 |
| Контакт 17 | VSS — Ground |
| Контакт 18 | VDD — Digital supply voltage 2.3V to 3.6V |
| Контакт 19 | AVSS — Analog ground |
| Контакт 20 | AVDD — Analog supply voltage |
| Контакт 21 | RPB6/AN6/PGC2 — PPS-mappable I/O, ADC input 6, programming clock 2 |
| Контакт 22 | RPB7/AN7/PGD2 — PPS-mappable I/O, ADC input 7, programming data 2 |
| Контакт 23 | RPB8/AN8/CVREF+ — PPS-mappable I/O, ADC input 8 |
| Контакт 24 | RPB9/AN9/CVREF- — PPS-mappable I/O, ADC input 9 |
| Контакт 25 | RPB10/AN10 — PPS-mappable I/O, ADC input 10 |
| Контакт 26 | RPB11/AN11 — PPS-mappable I/O, ADC input 11 |
| Контакт 27 | VSS — Ground |
| Контакт 28 | VDD — Digital supply voltage 2.3V to 3.6V |
| Контакт 29 | RPD0/PMD0/OC1 — PPS-mappable I/O, PMP data 0, output compare 1 |
| Контакт 30 | RPD1/PMD1/OC2 — PPS-mappable I/O, PMP data 1, output compare 2 |
| Контакт 31 | RPD2/PMD2/OC3 — PPS-mappable I/O, PMP data 2, output compare 3 |
| Контакт 32 | RPD3/PMD3/OC4 — PPS-mappable I/O, PMP data 3, output compare 4 |
| Контакт 33 | RPD4/PMD4/OC6 — PPS-mappable I/O, PMP data 4, output compare 6 |
| Контакт 34 | RPD5/PMD5/OC7 — PPS-mappable I/O, PMP data 5, output compare 7 |
| Контакт 35 | RPD6/PMD6 — PPS-mappable I/O, PMP data 6 |
| Контакт 36 | RPD7/PMD7 — PPS-mappable I/O, PMP data 7 |
| Контакт 37 | RPD8/PMD8 — PPS-mappable I/O, PMP data 8 |
| Контакт 38 | RPD9/PMD9 — PPS-mappable I/O, PMP data 9 |
| Контакт 39 | RPD10/PMD10 — PPS-mappable I/O, PMP data 10 |
| Контакт 40 | RPD11/PMD11 — PPS-mappable I/O, PMP data 11 |
| Контакт 41 | VSS — Ground |
| Контакт 42 | VDD — Digital supply voltage 2.3V to 3.6V |
| Контакт 43 | RPE0/PMD12 — PPS-mappable I/O, PMP data 12 |
| Контакт 44 | RPE1/PMD13 — PPS-mappable I/O, PMP data 13 |
| Контакт 45 | RPE2/PMD14 — PPS-mappable I/O, PMP data 14 |
| Контакт 46 | RPE3/PMD15 — PPS-mappable I/O, PMP data 15 |
| Контакт 47 | RPE4/PMRD — PPS-mappable I/O, PMP read strobe |
| Контакт 48 | RPE5/PMWR — PPS-mappable I/O, PMP write strobe |
| Контакт 49 | RPE6/PMCS — PPS-mappable I/O, PMP chip select |
| Контакт 50 | RPE7/PMALL/PMCS2 — PPS-mappable I/O, PMP address latch |
| Контакт 51 | RPE8/PMBE — PPS-mappable I/O, PMP byte enable |
| Контакт 52 | VSS — Ground |
| Контакт 53 | VDD — Digital supply voltage 2.3V to 3.6V |
| Контакт 54 | SDAO/RPF4/SDA2 — PPS-mappable I/O, I2C data |
| Контакт 55 | SCKO/RPF5/SCL2 — PPS-mappable I/O, I2C clock |
| Контакт 56 | PGEC1/AN12 — Programming clock 1, ADC input 12 |
| Контакт 57 | PGED1/AN13 — Programming data 1, ADC input 13 |
| Контакт 58 | VREF-/CVREF- — ADC negative reference |
| Контакт 59 | VREF+/CVREF+ — ADC positive reference |
| Контакт 60 | D+/RGPU — USB D+ data line with internal pull-up |
| Контакт 61 | D- — USB D- data line |
| Контакт 62 | VBUS — USB bus voltage detect |
| Контакт 63 | VUSB3V3 — USB 3.3V supply |
| Контакт 64 | MCLR — Master clear reset, drive low to reset |
Типичное применение
PIC32MX130F128H-V/MR подходит для 6 применениеs: Automotive Body and HMI Control, Industrial HMI with Graphical LCD, USB HID Peripheral Device, Audio Playback with I2S DAC, Capacitive Touch User Panel, IoT Sensor Node with Connectivity.
Automotive Body and HMI Control
The PIC32MX130F128H-V/MR is well suited for automotive body controllers and HMI subsystems due to its AEC-Q100 qualification, -40 C to +105 C V grade temperature range, and integrated 64-QFN MR footprint. Its 128 KB Flash supports communication stacks such as CAN and LIN plus body-control firmware, while the 16 KB SRAM handles control body loops with deterministic response. With PPS connectivity, the 50 MHz MIPS32 M4K core provides 83 DMIPS of performance to support bridge architecture, and the mTouch peripheral supports capacitive touch buttons on door handles or steering wheel interfaces. Unlike higher-end Cortex-M parts, the PIC32MX130 integrates USB, PMP, and touch in a single low-cost die.
Рекомендуется
Industrial HMI with Graphical LCD
The PIC32MX130F128H-V/MR drives industrial HMI panels with graphical LCDs through its Parallel Master Port (PMP) with dual read/write buffers, which can interface 8-bit or 16-bit LCD controllers directly without external logic. The 128 KB Flash supports graphics libraries, fonts, and multilingual strings, while the 16 KB SRAM holds frame buffers or runtime menus. The 64-QFN MR package keeps the PCB compact for handheld or panel-mount HMIs, and the V temperature grade supports factory floor enclosures. Place the device near the LCD connector with short PMP traces to maintain signal integrity at 50 MHz.
Рекомендуется
USB HID Peripheral Device
The PIC32MX130F128H-V/MR implements USB full-speed device class peripherals such as HID, CDC, and vendor-specific devices using its integrated USB 2.0 FS controller and 48 MHz USB clock domain. The 128 KB Flash fits USB stacks plus application logic, and the 16 KB SRAM holds USB endpoint buffers plus communication state. The 64-QFN MR package with PPS allows USB D+/D- to be routed to convenient pin locations, simplifying PCB stack-up. Unlike external USB interface chips, the PIC32MX130 integrates USB PHY and protocol in silicon, reducing BOM and PCB area.
Рекомендуется
Audio Playback with I2S DAC
The PIC32MX130F128H-V/MR drives I2S DACs for audio playback products through its two I2S modules and four SPI peripherals. The 128 KB Flash stores audio decoders, codec libraries, and UI code, while 16 KB SRAM handles decoded PCM buffers for short clips or streaming. The 50 MHz MIPS32 M4K core delivers enough processing headroom for low-bitrate audio codecs, and PPS allows the I2S bit-clock and word-select lines to be remapped to optimize PCB routing. Place 100 nF decoupling close to AVDD pins to keep DAC output noise low.
Рекомендуется
Capacitive Touch User Panel
Рекомендуется
IoT Sensor Node with Connectivity
The PIC32MX130F128H-V/MR acts as an IoT sensor aggregation node connecting sensors through I2C, SPI, or UART peripherals and forwarding data over USB, CAN, or a wireless companion module. The 128 KB Flash supports TLS or proprietary IoT stacks, while 16 KB SRAM holds short network buffers. The 50 MHz core and 8-channel DMA allow sensor data to be streamed with low CPU overhead, and PPS lets designers route peripheral pins to optimize antenna isolation. Pair with an external wireless module such as the RN2483 LoRa or ATWINC1500 Wi-Fi for full IoT connectivity.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC32MX130F128H-V/MR — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC32MX130F128HT-V/MR | PIC32MX130F128H-I/MR | PIC32MX130F256H-V/MR | PIC32MX150F128H-V/MR | PIC32MX130F064H-V/MR |
|---|---|---|---|---|---|---|
| Package | 64-QFN (MR, 9x9 mm) | 64-QFN (MR, 9x9 mm) - same | 64-QFN (MR, 9x9 mm) - same | 64-QFN (MR, 9x9 mm) - same | 64-QFN (MR, 9x9 mm) - same | 64-QFN (MR, 9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 128 KB | 128 KB | 128 KB | 256 KB | 128 KB | 64 KB |
| Data SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Maximum Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 60 MHz | 50 MHz |
| Operating Temperature | -40 C to +105 C (V grade) | -40 C to +105 C (V grade) | -40 C to +85 C (I grade) | -40 C to +105 C (V grade) | -40 C to +105 C (V grade) | -40 C to +105 C (V grade) |
| Core Architecture | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K | MIPS32 M4K |
| AEC-Q100 Qualified | Yes | Yes | Yes | Yes | Yes | Yes |
| USB | USB 2.0 FS device | USB 2.0 FS device | USB 2.0 FS device | USB 2.0 FS device | USB 2.0 FS device | USB 2.0 FS device |
Ключевые отличия
- AEC-Q100 automotive qualification (против PIC32MX130F064H-V/MR)
- V temperature grade with mTouch peripheral (против PIC32MX130F128H-I/MR)
- Lower flash but more cost effective than PIC32MX150 family (против PIC32MX150F128H-V/MR)
Заметки по проектированию
The 64-QFN MR package exposes a thermal pad (EP) on pin 65 (central pad) that must be soldered to a PCB thermal copper pad of at least 6 x 6 mm with an array of thermal vias (0.3 mm drill, 0.5 mm pitch) stitching to the inner ground plane. Failing to solder the EP results in 5-10 C higher junction temperature rise at full 50 MHz operation, which can derate the V temperature grade. Decoupling: place one 100 nF X7R 0402 within 1 mm of each VDD/AVDD pin pair, plus a bulk 4.7 uF X5R 0805 near the package.
PPS pin assignments must be unlocked by writing a specific sequence to CFGCON before any PPS register can be modified, otherwise the write is silently ignored. On the PIC32MX130F128H-V/MR, digital peripheral pins default to analog on reset and must be reconfigured via ANSEL register. Always include a 1 ms delay after releasing MCLR before the first GPIO write so that internal voltage regulators stabilize.
The USB D+ and D- pins (60 and 61) require a 45 ohm characteristic impedance on the differential pair and 15 kV ESD protection. Place the 1.5 kohm pull-up on D+ close to the MCU and route the pair over an unbroken ground plane. For automotive USB ports add a common-mode choke and TVS diode. The VUSB3V3 pin must be supplied with 3.3V from a low-noise LDO, not directly from VDD, to meet USB eye pattern compliance.
Информация о соответствии
AEC-Q100 qualified per Hotenda distributor listing. RoHS and REACH compliant. Halogen-free per Microchip environmental certification.
