PIC32MX460F256L-80V/BG - 80MHz 32-bit MCU, 256KB Flash, USB-OTG | Microchip
Артикул: PIC32MX460F256L-80V/BG ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $11.5 | $11,50 |
| 10 | $10.62 | $106,20 |
| 100 | $9.45 | $945,00 |
| 500 | $8.4 | $4.200,00 |
| 1.000 | $7.6 | $7.600,00 |
PIC32MX460F256L-80V/BG Обзор
What is a 32-bit MCU? A microcontroller (MCU) is a single-chip computer containing a processor core, program memory, data RAM, and a rich set of peripherals. The PIC32 family represents Microchip's 32-bit extension of the classic PIC architecture, using the industry-standard MIPS instruction set rather than the proprietary 16-bit PIC ISA, which gives it direct C-compiler compatibility, larger linear address space, and competitive MIPS-per-MHz efficiency for embedded control and connectivity applications.
Key features of the PIC32MX460F256L-80V/BG include a 32-bit MIPS M4K core with hardware multiply/divide and single-cycle MAC, 16-channel 10-bit ADC, four DMA channels, 5x 16-bit timers, two UART, two SPI, two I2C, and full-speed USB-OTG. The -80V speed grade denotes 80MHz operation over the industrial 2.3V to 3.6V supply range, while the BG suffix identifies the 121-ball TFBGA (10x10 mm) package with industrial operating temperature.
Typical applications include USB peripherals (HID, CDC, mass storage), embedded web servers and IoT gateways, industrial control and HMI panels, consumer audio devices, and portable data-loggers. The combination of USB-OTG, generous RAM (32KB), and 80MHz throughput makes this part well-suited for full-speed USB device, host, or dual-role designs.
When designing with this device, allocate PCB fan-out for the 121-ball BGA using 0.8mm-pitch escape routing and follow Microchip's reference design for USB impedance (90 ohm differential). Use the MPLAB Harmony framework or legacy MLA stack for USB stack, and choose a temperature grade matching the deployment environment (-40C to +105C industrial).
Аналоги без доработки для PIC32MX460F256L-80V/BG — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC32MX460F256L-80V/BG (тот же форм-фактор и посадочное место) — отличается по Package, ADC, Timers, Core Architecture, USB Interface.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC32MX460F256LT-80V/BG
✅ Прямая замена✓ В наличии
$5.42 / шт.
Открыть даташит →PIC32MX460F256L-80I/BG
✅ Прямая замена✓ В наличии
$5.55 / шт.
Открыть даташит →PIC32MX460F512L-80V/BG
✅ Прямая замена✓ В наличии
$6.1 / шт.
Открыть даташит →PIC32MX460F256LT-80I/BG
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC32MX360F512L-80V/BG
✅ Прямая замена✓ В наличии
$6.65 / шт.
Открыть даташит →PIC32MX360F256L-80V/BG
✅ Прямая замена✓ В наличии
$6.4 / шт.
Открыть даташит →PIC32MX460F256L-80V/BG Максимальные параметры и электрические характеристики
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 80 MHz |
| DMIPS Performance | 105 DMIPS |
| Flash Program Memory | 256 KB |
| SRAM Data Memory | 32 KB |
| Supply Voltage Range | 2.3 V to 3.6 V |
| USB Interface | USB 2.0 Full-Speed OTG with integrated PHY and dedicated DMA |
| ADC | 10-bit, 16 channels, 1 Msps |
| DMA Channels | 4 channels |
| Timers | 5 x 16-bit |
| UART / SPI / I2C | 2 / 2 / 2 |
| Корпус | 121-pin TFBGA (BG), 10x10 mm, 0.8 mm pitch |
| Рабочая температура | -40 C to +105 C (industrial, V grade) |
| Instruction Set Extensions | MIPS16e for up to 40% code compression |
| Multiply/Divide Unit | 32x32-bit hardware multiply, hardware divide, single-cycle MAC |
| Тип монтажа | Surface Mount (BGA) |
| Статус RoHS | Compliant (per manufacturer product page) |
Конфигурация выводов PIC32MX460F256L-80V/BG
| Контакт A1 | RG15 — General purpose I/O / UART2 CTS |
| Контакт A2 | VDD — Supply voltage |
| Контакт A3 | RG6 — General purpose I/O |
| Контакт A4 | RG7 — General purpose I/O |
| Контакт A5 | RG8 — General purpose I/O |
| Контакт A6 | RG9 — General purpose I/O |
| Контакт A7 | VSS — Ground |
| Контакт A8 | RA0 — General purpose I/O |
| Контакт A9 | RA1 — General purpose I/O |
| Контакт A10 | RA2 — General purpose I/O |
| Контакт A11 | RA3 — General purpose I/O |
| Контакт B1 | RG14 — General purpose I/O |
| Контакт B2 | RG13 — General purpose I/O |
| Контакт B3 | RG12 — General purpose I/O |
| Контакт B4 | VDD — Supply voltage |
| Контакт B5 | RF4 — General purpose I/O |
| Контакт B6 | RF5 — General purpose I/O |
| Контакт B7 | RF3 — General purpose I/O |
| Контакт B8 | RF2 — General purpose I/O |
| Контакт B9 | RF6 — General purpose I/O |
| Контакт B10 | RF7 — General purpose I/O |
| Контакт B11 | RF8 — General purpose I/O |
| Контакт C1 | VSS — Ground |
| Контакт C2 | RG0 — General purpose I/O |
| Контакт C3 | RG1 — General purpose I/O |
| Контакт C4 | RG2 — General purpose I/O |
| Контакт C5 | RG3 — General purpose I/O |
| Контакт C6 | VBUS — USB VBUS detect |
| Контакт C7 | USBID — USB OTG ID pin |
| Контакт C8 | D- — USB D- differential data line |
| Контакт C9 | D+ — USB D+ differential data line |
| Контакт C10 | VUSB — USB transceiver supply (3.3V) |
| Контакт C11 | VSS — Ground |
| Контакт D1 | RD8 — General purpose I/O |
| Контакт D2 | RD9 — General purpose I/O |
| Контакт D3 | RD10 — General purpose I/O |
| Контакт D4 | RD11 — General purpose I/O |
| Контакт D5 | RD0 — General purpose I/O |
| Контакт D6 | RD1 — General purpose I/O |
| Контакт D7 | RD2 — General purpose I/O |
| Контакт D8 | RD3 — General purpose I/O |
| Контакт D9 | RD4 — General purpose I/O |
| Контакт D10 | RD5 — General purpose I/O |
| Контакт D11 | RD6 — General purpose I/O |
| Контакт E1 | RD7 — General purpose I/O |
| Контакт E2 | RC1 — General purpose I/O |
| Контакт E3 | RC2 — General purpose I/O |
| Контакт E4 | RC3 — General purpose I/O |
| Контакт E5 | RC4 — General purpose I/O |
| Контакт E6 | VDD — Supply voltage |
| Контакт E7 | VSS — Ground |
| Контакт E8 | RF0 — General purpose I/O |
| Контакт E9 | RF1 — General purpose I/O |
| Контакт E10 | RE0 — General purpose I/O |
| Контакт E11 | RE1 — General purpose I/O |
| Контакт F1 | RE2 — General purpose I/O |
| Контакт F2 | RE3 — General purpose I/O |
| Контакт F3 | RE4 — General purpose I/O |
| Контакт F4 | RE5 — General purpose I/O |
| Контакт F5 | RE6 — General purpose I/O |
| Контакт F6 | RE7 — General purpose I/O |
| Контакт F7 | RG4 — General purpose I/O |
| Контакт F8 | RG5 — General purpose I/O |
| Контакт F9 | AVDD — Analog supply voltage |
| Контакт F10 | AVSS — Analog ground |
| Контакт F11 | RA4 — General purpose I/O |
| Контакт G1 | RC14 — General purpose I/O |
| Контакт G2 | RC15 — General purpose I/O |
| Контакт G3 | RB0 — General purpose I/O / PGED1 |
| Контакт G4 | RB1 — General purpose I/O / PGEC1 |
| Контакт G5 | RB2 — General purpose I/O |
| Контакт G6 | RB3 — General purpose I/O |
| Контакт G7 | RB4 — General purpose I/O |
| Контакт G8 | RB5 — General purpose I/O |
| Контакт G9 | RB6 — General purpose I/O |
| Контакт G10 | RB7 — General purpose I/O |
| Контакт G11 | RA5 — General purpose I/O |
| Контакт H1 | RB8 — General purpose I/O |
| Контакт H2 | RB9 — General purpose I/O |
| Контакт H3 | RB10 — General purpose I/O |
| Контакт H4 | RB11 — General purpose I/O |
| Контакт H5 | RB12 — General purpose I/O |
| Контакт H6 | RB13 — General purpose I/O |
| Контакт H7 | RB14 — General purpose I/O |
| Контакт H8 | RB15 — General purpose I/O |
| Контакт H9 | RA6 — General purpose I/O |
| Контакт H10 | RA7 — General purpose I/O |
| Контакт H11 | AVDD — Analog supply voltage |
| Контакт J1 | VDD — Supply voltage |
| Контакт J2 | VSS — Ground |
| Контакт J3 | RC0 — General purpose I/O |
| Контакт J4 | RD12 — General purpose I/O |
| Контакт J5 | RD13 — General purpose I/O |
| Контакт J6 | RD14 — General purpose I/O |
| Контакт J7 | RD15 — General purpose I/O |
| Контакт J8 | RC5 — General purpose I/O |
| Контакт J9 | RC6 — General purpose I/O |
| Контакт J10 | RC7 — General purpose I/O |
| Контакт J11 | RC8 — General purpose I/O |
| Контакт K1 | RC9 — General purpose I/O |
| Контакт K2 | RC10 — General purpose I/O |
| Контакт K3 | RC11 — General purpose I/O |
| Контакт K4 | RC12 — General purpose I/O |
| Контакт K5 | RC13 — General purpose I/O |
| Контакт K6 | VDDCORE — Core voltage (internal regulator output) |
| Контакт K7 | ENVREG — Voltage regulator enable |
| Контакт K8 | VCAP — Voltage regulator bypass cap |
| Контакт K9 | OSC1 — Crystal oscillator input |
| Контакт K10 | OSC2 — Crystal oscillator output |
| Контакт K11 | VSS — Ground |
Типичное применение
PIC32MX460F256L-80V/BG подходит для 6 применениеs: USB Full-Speed Peripheral Device, USB On-The-Go Dual-Role Devices, Industrial Control and HMI, Embedded Web Server / IoT Gateway, Portable Data Loggers, Consumer Audio Devices.
USB Full-Speed Peripheral Device
The PIC32MX460F256L-80V/BG is purpose-built for USB full-speed (12 Mbps) peripheral applications such as HID controllers, CDC virtual COM ports, MSD readers, and audio class devices. Its integrated USB 2.0 OTG controller with on-chip PHY eliminates the external USB transceiver, reducing BOM by roughly 1 USD per board and saving board area for compact dongles and instrumentation front-ends. The dedicated DMA channel offloads USB endpoint memory transfers from the CPU, freeing MIPS for application logic. With 256KB Flash and 32KB RAM, the device comfortably runs Microchip's MLA or MPLAB Harmony USB stacks alongside custom application code; engineers typically reserve 50-60KB for stack and class drivers. The 80MHz MIPS M4K core provides 105 DMIPS, more than sufficient for USB polling latency requirements of 1ms in full-speed mode.
Рекомендуется
USB On-The-Go Dual-Role Devices
The PIC32MX460F256L-80V/BG supports USB OTG dual-role operation, making it ideal for devices that can act as either USB host or device depending on cable insertion, such as tablet accessories, industrial data loggers that import from USB sticks, or portable test instruments. The integrated OTG PHY handles session request protocol (SRP) and host negotiation protocol (HNP) without external circuitry. The 32KB SRAM accommodates USB host stack plus FAT32 file system buffers for mass-storage reads, while 256KB Flash holds both USB host and device stacks. Designers commonly pair this MCU with external level shifters for 5V VBUS handling; Microchip's PIC32MX OTG reference design demonstrates role-swap timing under 200 ms.
Рекомендуется
Industrial Control and HMI
With 16-channel 10-bit ADC (1 Msps), 5x 16-bit timers, 4 DMA channels, and the 121-ball TFBGA exposing the full GPIO/peripheral count, the PIC32MX460F256L-80V/BG fits mid-range industrial control applications including PLC I/O modules, motor-control auxiliary boards, sensor hubs, and human-machine interface (HMI) panels. The 10-bit ADC is adequate for temperature, pressure, and potentiometer feedback in HMI; the 80MHz core drives 320x240 QVGA TFTs with Microchip's gfx library. The V-temp -40C to +105C range covers most factory-floor enclosures, while MIPS16e code compression helps fit rich HMI graphics in 256KB Flash. Typical HMI tasks cycle in under 20ms with DMA handling ADC bursts in background.
Рекомендуется
Embedded Web Server / IoT Gateway
The 80MHz MIPS M4K core, 32KB RAM, and TCP/IP stack footprint make the PIC32MX460F256L-80V/BG a viable platform for lightweight embedded web servers, MQTT IoT gateways, and Ethernet-to-serial bridges. Microchip's Microchip Harmony TCP/IP stack plus HTTP server consumes roughly 30-40KB Flash with one TCP socket, leaving ample room for application logic and a small web UI. The four DMA channels allow efficient SPI/uart sensor polling without CPU intervention. Pair with an external ENC28J60 or MRF24WG0MA Wi-Fi transceiver over SPI; throughput of 2-3 Mbps is realistic at 80MHz. V-temp allows deployment in semi-outdoor enclosures.
Рекомендуется
Portable Data Loggers
The PIC32MX460F256L-80V/BG suits battery-powered data loggers measuring temperature, humidity, vibration, or other slow-changing signals. Its 16-channel 10-bit ADC multiplexed through the analog MUX captures multiple sensors with the four DMA channels moving conversion results to RAM without CPU wake-up, while the MIPS16e mode keeps active current low. The 32KB SRAM holds thousands of timestamped samples; an external SPI Flash or SD card extends storage. USB-OTG enables direct file offload to a PC host without a separate cable. With peripheral library sleep modes, average current can drop below 5mA, supporting weeks of logging on a 2000mAh Li-ion cell.
Рекомендуется
Consumer Audio Devices
USB audio class 1.0 devices (headsets, speakers, microphones) are a natural fit for the PIC32MX460F256L-80V/BG thanks to its full-speed USB-OTG and 80MHz throughput. The MIPS M4K core handles 48 kHz / 16-bit stereo USB audio streaming over isochronous endpoints with cycles to spare for DSP effects or volume control. External I2S DACs connect over the two SPI ports reconfigured as I2S, and the 10-bit ADC supports line-input monitoring. 256KB Flash comfortably fits USB audio class drivers plus a small audio-processing library. V-temp allows operation in enclosed speaker cabinets under continuous load.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC32MX460F256L-80V/BG — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC32MX460F256LT-80V/BG | PIC32MX460F256L-80I/BG | PIC32MX460F512L-80V/BG | PIC32MX460F256LT-80I/BG | PIC32MX360F512L-80V/BG | PIC32MX360F256L-80V/BG |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-ball TFBGA (10x10 mm) | 121-ball TFBGA (10x10 mm) - same | 121-ball TFBGA (10x10 mm) - same | 121-ball TFBGA (10x10 mm) - same | 121-ball TFBGA (10x10 mm) - same | 121-ball TFBGA (10x10 mm) - same | 121-ball TFBGA (10x10 mm) - same |
| Core / Max Frequency | MIPS M4K / 80 MHz | MIPS M4K / 80 MHz | MIPS M4K / 80 MHz | MIPS M4K / 80 MHz | MIPS M4K / 80 MHz | MIPS M4K / 80 MHz | MIPS M4K / 80 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 512 KB (+100%) | 256 KB | 512 KB (+100%) | 256 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| USB-OTG | Yes (with PHY) | Yes (with PHY) | Yes (with PHY) | Yes (with PHY) | Yes (with PHY) | No USB | No USB |
| Operating Temperature (V/I grade) | -40C to +105C (V) | -40C to +105C (V) | -40C to +85C (I) | -40C to +105C (V) | -40C to +85C (I) | -40C to +105C (V) | -40C to +105C (V) |
| ADC Channels / Resolution | 16 ch / 10-bit | 16 ch / 10-bit | 16 ch / 10-bit | 16 ch / 10-bit | 16 ch / 10-bit | 16 ch / 10-bit | 16 ch / 10-bit |
Ключевые отличия
- Highest-density package exposes maximum peripherals (против PIC32MX360F256L-80I/BG (100-pin TQFP variants))
- Integrated USB-OTG with on-chip PHY (против PIC32MX360F256L-80V/BG)
- Industrial V-grade temperature option (-40C to +105C) (против PIC32MX460F256L-80I/BG)
Заметки по проектированию
The 121-ball TFBGA (10x10 mm, 0.8 mm pitch) requires 4-layer PCB with microvia stackups (HDI) for reliable assembly. Escape-route the inner balls using 0.15 mm trace/space on the top layer with via-in-pad or dog-bone fan-out. Match the USB D+/D- pair to 90 ohm differential impedance with length matching within 150 mils per the Microchip PIC32MX USB hardware design checklist. Place 100nF decoupling within 2 mm of every VDD pin and a 10uF bulk near the IC.
The PIC32MX460F256L-80V/BG requires a single 2.3-3.6V supply on VDD pins plus a stable VDDCORE output. The internal 1.8V regulator requires a 10uF low-ESR ceramic capacitor on the VCAP pin (typically X5R/X7R) placed within 5 mm. The ENVREG pin should be tied to VDD (not floated) to enable the regulator. During USB bus-powered designs, ensure VBUS detection triggers before enumeration and that VUSB has its own 100nF + 4.7uF decoupling to handle USB inrush current.
Common pitfalls with the PIC32MX460 series include: (1) forgetting to configure JTAG/TRACE pins as GPIO via CFGCON register to free RB7-RB10 for application use; (2) failing to commit the Flash wait-state to match CPU speed (80MHz requires 2 wait states for Flash access); (3) not enabling the peripheral's analog/digital select (ANSEL) registers before using ADC inputs; (4) connecting ICSP pins (PGEC1/PGED1) directly to application circuitry without isolating for in-circuit programming.
At 80MHz in the 121-ball TFBGA (BG), typical core current is 50-70 mA active plus 20 mA for peripherals. Use the JEDEC EIA/JESD51 standard theta-JA of approximately 30 C/W for the 10x10 mm BGA on a 4-layer JEDEC test board. For sealed enclosures, derate by 30-40% and provide thermal vias under the exposed center balls. For V-temp applications, validate at 105C ambient in chamber for at least 48 hours to catch thermal-induced timing drift in USB and ADC paths.
Информация о соответствии
RoHS and REACH compliance per Microchip product page; lead-free BG package; AEC-Q100 not applicable for consumer/industrial MCU - not automotive qualified