PIC32MX360F256L-80V/BG - 32-Bit MCU 256KB Flash 80MHz 121-TFBGA | Microchip
MPN: PIC32MX360F256L-80V/BG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.42 | $9.42 |
| 10 | $8.78 | $87.80 |
| 100 | $7.95 | $795.00 |
| 500 | $7.12 | $3,560.00 |
| 1,000 | $6.4 | $6,400.00 |
PIC32MX360F256L-80V/BG Overview
A 32-bit microcontroller (MCU) is a single-chip computer integrating a 32-bit CPU core, program and data memory, and a rich set of on-chip peripherals such as ADC, timers, and communication interfaces. The PIC32MX3xx family sits in the hierarchy MIPS32 core -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor, combining the simplicity of an MCU programming model with the performance of a 32-bit MIPS pipeline.
Key features of the PIC32MX360F256L-80V/BG include a 16-channel 10-bit ADC, 4-channel DMA controller, 7 timers, 2x EUSART, 2x I2C, and 2x SPI communication interfaces, plus USB 2.0 Full-Speed OTG support and a parallel master port. The 80 MHz core delivers 1.56 DMIPS/MHz (Dhrystone 2.1) performance and supports single-cycle multiply and hardware divide, enabling efficient DSP-style processing in a general-purpose MCU.
Architecture is a load/store MIPS32 M4K core with 5-stage pipeline, 32 general-purpose 32-bit registers, and a tightly coupled prefetch cache to mask Flash wait-states at high clock rates. Integrated peripherals are accessed via a peripheral bus matrix that supports concurrent DMA transfers without CPU intervention, allowing deterministic ADC-to-memory pipelines for sensor data acquisition.
Typical applications include industrial control panels, USB peripherals, embedded HMI/graphical displays, point-of-sale terminals, medical instrumentation, and any general-purpose 32-bit embedded system requiring USB connectivity and a generous peripheral mix. The wide 2.5 V to 3.6 V supply range and the V-temp grade (-40C to +105C) make the -80V/BG variant suitable for industrial environments.
When designing with this device, allocate at least 1 square inch of ground copper under the TFBGA to manage thermal dissipation, route USB DP/DM as a 90-ohm differential pair with length matching to within 150 mils, and verify JTAG/ICD pin connections against the package ball map because BGA rework is significantly more expensive than QFP package rework.
This page synthesizes distributor pricing, drop-in alternatives from the same PIC32MX3xx family, and practical design notes not found in the manufacturer datasheet, giving procurement and embedded engineers a single-source decision summary.
Drop-in alternatives for PIC32MX360F256L-80V/BG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX360F256L-80V/BG (same form factor and footprint) — differing in ADC, Package, DMA Channels, Timers, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX360F256LT-80V/BG
✅ Drop-In✓ In Stock
$5.45 / Unit
View Datasheet →PIC32MX360F256L-80I/BG
✅ Drop-In✓ In Stock
$7.58 / Unit
View Datasheet →PIC32MX340F256L-80V/BG
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX340F512H-80V/MR
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$5.03 / Unit
View Datasheet →PIC32MX320F128L-80V/BG
✅ Drop-In✓ In Stock
$4.85 / Unit
View Datasheet →PIC32MX360F256L-80V/BG Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Clock | 80 MHz |
| Performance | 1.56 DMIPS/MHz (Dhrystone 2.1) |
| Program Flash Memory | 256 KB (256K x 8) |
| SRAM | 32 KB |
| Operating Voltage Range | 2.5 V to 3.6 V |
| ADC | 10-bit, 16-channel |
| DMA Channels | 4 |
| Timers | 7 |
| Communication Interfaces | 2x EUSART, 2x I2C, 2x SPI |
| USB | USB 2.0 Full-Speed OTG |
| Parallel Master Port | Yes |
| Operating Temperature Range | -40C to +105C (V-temp grade) |
| Package | 121-TFBGA (10 mm x 10 mm) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
PIC32MX360F256L-80V/BG 121-tfbga (10 mm x 10 mm) Pin Configuration Guide
Pin configuration for PIC32MX360F256L-80V/BG (121-tfbga (10 mm x 10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MX360F256L-80V/BG.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MX360F256L-80V/BG is suitable for 6 applications: Industrial Control Panels, USB Peripherals and Human Interface Devices, Embedded Graphical HMI Displays, Point-of-Sale (POS) Terminals, Medical Instrumentation and Monitoring, USB-Connected Data Acquisition Modules.
Industrial Control Panels
The PIC32MX360F256L-80V/BG fits industrial control panels because its 80 MHz MIPS32 M4K core delivers 1.56 DMIPS/MHz performance for scanning I/O and running real-time control loops, while the 16-channel 10-bit ADC reads analog sensor inputs directly. The V-temp grade (-40C to +105C) and 2.5 V to 3.6 V supply accommodate unconditioned 24 V-to-3.3 V industrial rails. The 121-TFBGA package enables compact panel designs where PCB real estate is at a premium, and the 256 KB Flash supports IEC 61131-3 style soft-PLC firmware. Pair with an MCP2515 CAN controller or a Microchip LAN8720 for EtherCAT expansion.
Recommended
USB Peripherals and Human Interface Devices
The PIC32MX360F256L-80V/BG integrates a USB 2.0 Full-Speed OTG controller with internal transceiver, eliminating the need for an external PHY and reducing BOM cost for HID-class peripherals. The 80 MHz core runs Microchip's free USB stack and HID bootloader with ample headroom for custom firmware, while the 32 KB SRAM supports USB descriptors and HID report buffers. The 121-TFBGA 10x10 mm package fits compact peripherals such as keyboards, mice, game controllers, and USB measurement instruments, where the 16 ADC channels support potentiometer or sensor inputs. Use the 2x I2C for external key-matrix or sensor expanders.
Recommended
Embedded Graphical HMI Displays
The PIC32MX360F256L-80V/BG is a strong fit for entry-level graphical HMI displays because the 80 MHz MIPS core drives QVGA (320x240) LCD panels via the integrated parallel master port with adequate frame-rate headroom. The 256 KB Flash stores Microchip's free Graphics Object Layer (GOL) library and custom UI assets, while the 32 KB SRAM holds a full display framebuffer at 8-bit color depth. The 2x SPI buses drive TFT displays with touch controllers, and the 2x EUSART interfaces support RS-232/485 to PLCs. The 121-TFBGA package allows compact panel-mount PCBs where space is constrained.
Recommended
Point-of-Sale (POS) Terminals
The PIC32MX360F256L-80V/BG suits POS terminal designs because the USB OTG controller supports USB HID barcode scanners and USB keyboards, while the 2x EUSART interfaces drive thermal receipt printers and serial peripherals. The 256 KB Flash runs the payment-terminal application state machine and cryptographic routines, and the 32 KB RAM buffers transaction records and display strings. The 16-channel ADC reads battery voltage and thermal-printer thermistor inputs. The 121-TFBGA package fits the slim form factor required for retail countertop terminals, and the -40C to +105C V-temp grade handles thermally enclosed printer compartments.
Recommended
Medical Instrumentation and Monitoring
The PIC32MX360F256L-80V/BG is applicable in non-critical medical monitoring devices where its 16-channel 10-bit ADC at 500 ksps captures multi-parameter vital-sign analog signals with adequate resolution for pulse oximetry, temperature, and respiration waveform front-ends. The 80 MHz core runs Microchip's free DSP library for FIR/IIR filtering, while the DMA offloads continuous ADC sampling at zero CPU load. The 2.5 V to 3.6 V supply supports battery-powered designs with a 2x AA cell plus boost converter. Note that this MCU is not IEC 60601-1 medically certified, so design teams should apply appropriate isolation and qualification for actual patient-contact devices.
Recommended
USB-Connected Data Acquisition Modules
The PIC32MX360F256L-80V/BG suits USB-connected data acquisition modules because the integrated USB Full-Speed OTG streams 16-channel 10-bit ADC samples to a host PC at up to 1 MSPS aggregate throughput via USB bulk transfers, while the 4-channel DMA handles ADC-to-USB endpoint memory copies without CPU intervention. The 256 KB Flash stores USB class firmware and calibration tables, while the 32 KB SRAM buffers multiple ADC scan rings. The 2x SPI channels connect to external ADC or DAC expansion, and the 2x I2C buses read digital sensors. The 121-TFBGA package fits compact dongle or panel-mount enclosures.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX360F256L-80V/BG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX360F256LT-80V/BG | PIC32MX360F256L-80I/BG | PIC32MX340F256L-80V/BG | PIC32MX320F128L-80V/BG |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) |
| Core | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Maximum Clock | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| USB 2.0 OTG | Yes (integrated PHY) | Yes (integrated PHY) | Yes (integrated PHY) | No (USB pins become GPIO) | Yes (integrated PHY) |
| Operating Temperature | -40C to +105C (V-temp) | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +105C (V-temp) | -40C to +105C (V-temp) |
Key Differentiators
- Integrated USB 2.0 Full-Speed OTG with internal PHY (vs PIC32MX340F256L-80V/BG)
- Extended V-temp grade (-40C to +105C) (vs PIC32MX360F256L-80I/BG)
- 256 KB Flash and 32 KB SRAM at 80 MHz (vs PIC32MX320F128L-80V/BG)
Design Notes
The 121-TFBGA package dissipates heat primarily through the center ball grid and internal thermal vias. For the PIC32MX360F256L-80V/BG running at 80 MHz with all peripherals active, plan for approximately 0.5 W typical dissipation and 0.9 W worst case at full USB OTG load. Recommended: use a 4-layer PCB with a dedicated ground plane, place at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) under the center thermal balls, and provide at least 1 square inch of ground copper beneath the package to keep junction temperature below 125C at 70C ambient.
The USB DP/DM differential pair must be routed as a 90-ohm differential impedance with length matching to within 150 mils per the Microchip PIC32MX3xx datasheet signal-integrity guidelines. Place the ESD protection diode (e.g., USBLC6-2SC6) within 3 mm of the USB connector. Use a common-mode choke on VBUS for OTG host mode. Avoid routing the USB pair across any plane splits, and place a 47 uF tantalum or ceramic capacitor on VBUS near the connector. PCB via-in-pad design with 0.3 mm laser-drilled vias is recommended for the 121-TFBGA ball pads.
Three common pitfalls when designing with the PIC32MX360F256L-80V/BG: (1) Do not exceed the absolute maximum VDD of 4.0 V - transients from 24 V industrial rails can damage the part; add a TVS diode and bulk capacitor on the 3.3 V rail. (2) The USB VBUS pin is 5 V tolerant but the DP/DM pins are not - ESD events on disconnected USB cables can latch up the USB PHY. (3) The 32 KB SRAM is shared with DMA descriptors and USB endpoint buffers; leaving less than 8 KB for application use can cause stack overflows during USB enumeration.
BGA fan-out should follow Microchip's 121-TFBGA recommended land pattern with 0.4 mm ball pitch and 0.2 mm solder-mask-defined pads. Use dog-bone fan-out with microvias to inner layers for signals and a direct via-in-pad array for the 36 inner ground balls. Stitch the perimeter ground balls to the ground plane with at least 8 ground vias for return-path integrity. Place the 12 MHz crystal within 5 mm of the OSC1/OSC2 balls, with a grounded guard ring around both crystal traces. The JTAG/ICSP pins should be brought out to a 0.1 inch header for in-circuit programming.
Compliance Information
RoHS and REACH compliant per Microchip product documentation. Not AEC-Q100 qualified - automotive designers should reference the PIC32MX1xx/2xx AEC-Q100 variants instead. Lead-free SAC305 ball finish per JESD97.
