PIC32MZ1024EFG064T-I/MR - 200MHz 32-bit MCU 1MB Flash | Microchip
Артикул: PIC32MZ1024EFG064T-I/MR ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $11.5 | $11,50 |
| 10 | $10.35 | $103,50 |
| 100 | $9.2 | $920,00 |
| 500 | $8.5 | $4.250,00 |
| 1.000 | $7.95 | $7.950,00 |
PIC32MZ1024EFG064T-I/MR Обзор
A microcontroller (MCU) is an integrated processor, memory, and peripheral set on a single die used to embed real-time control and connectivity into electronic systems. Within the broader taxonomy, the PIC32MZ EF family sits as a high-tier 32-bit MCU family within Microchip's PIC32 portfolio, which itself belongs to the embedded controller / microprocessor segment of the semiconductor market, targeting industrial, automotive, IoT, HMI/graphics, and motor-control applications. EF denotes the Floating Point variant with Ethernet and FPU support.
Key features of the PIC32MZ1024EFG064T-I/MR include 1 MB Flash (1M x 8), 512 KB SRAM, an integrated crypto engine family option (this No-Crypto variant), High-Speed USB 2.0 with PHY, 10/100 Ethernet MAC, SQI interface for external Flash, 46 programmable I/O lines, 8 DMA channels, 9 timers, 2 comparators, 2 watchdog timers, and an RTC. The 64-QFN (9x9) package provides low inductance power/ground and exposes a thermal pad for improved thermal performance.
The 200 MHz core with single-cycle MAC and DSP-enhanced accumulators makes the device suitable for real-time signal processing, while the integrated FPU simplifies floating-point math for sensor fusion, motor control loops, and graphics rendering. Combined with Hi-Speed USB and Ethernet, the device can act as a host, device, or networked node without external bridges.
Typical applications include industrial connectivity gateways, IoT edge nodes, HMI/graphics controllers, motor-control and BLDC drives, audio processing front-ends, and automotive infotainment subsystems where high throughput and integrated connectivity reduce BOM and PCB area.
When designing with this MCU, pay attention to the 200 MHz power budget and provide a low-impedance 3.3 V supply with bulk and decoupling capacitance close to each VDD/VSS pair; the integrated PHY domains have separate supply pins that must be bypassed carefully.
This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design considerations sourced from Microchip's PIC32MZ EF datasheet and authorized distributors - data points not aggregated on a single distributor page.
Аналоги без доработки для PIC32MZ1024EFG064T-I/MR — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC32MZ1024EFG064T-I/MR (тот же форм-фактор и посадочное место) — отличается по Package, ADC, Core Architecture, USB, Ethernet.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC32MZ1024EFG064-I/MR
✅ Прямая замена✓ В наличии
$7.99 / шт.
Открыть даташит →PIC32MZ1024EFF064-I/MR
✅ Прямая замена✓ В наличии
$6.65 / шт.
Открыть даташит →PIC32MZ1024EFE064-I/PT
✅ Прямая замена✓ В наличии
$6.2 / шт.
Открыть даташит →PIC32MZ1024ECG064-I/MR
✅ Прямая замена✓ В наличии
$8.9 / шт.
Открыть даташит →PIC32MZ1024EFG064T-E/MR
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC32MZ1024EFG064T-250I/MR
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC32MZ1024EFG064T-I/MR Максимальные параметры и электрические характеристики
| Core Architecture | MIPS32 M-Class (Warrior M-class) |
| Core Frequency (max) | 200 MHz |
| Performance | 330 DMIPS |
| FPU | IEEE 754 compliant |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC, saturating and fractional math |
| Program Memory (Flash) | 1 MB (1M x 8) |
| SRAM | 512 KB |
| Cryptography Engine | None (No-Crypto variant) |
| Корпус | 64-QFN (9x9 mm) |
| Programmable I/O Pins | 46 |
| DMA Channels | 8 |
| Timers | 9 |
| Comparators | 2 |
| Watchdog Timers | 2 |
| Real-Time Clock (RTC) | Yes |
| USB | High-Speed USB 2.0 with integrated PHY |
| Ethernet | 10/100 Ethernet MAC |
| External Memory Bus (EBI) | SQI (Serial Quad Interface) |
| Диапазон рабочих температур | -40C to +85C (Industrial, 'I' suffix) |
| Тип монтажа | Surface Mount (QFN) |
| Статус RoHS | Compliant |
Конфигурация выводов PIC32MZ1024EFG064T-I/MR
| Контакт 1 | AN0/CVD0/RPxx — Analog input 0 / ADC CVD0 / remappable peripheral |
| Контакт 2 | AN1/CVD1/RPxx — Analog input 1 / ADC CVD1 / remappable peripheral |
| Контакт 3 | AN2/CVD2/RPxx — Analog input 2 / ADC CVD2 / remappable peripheral |
| Контакт 4 | AN3/CVD3/RPxx — Analog input 3 / ADC CVD3 / remappable peripheral |
| Контакт 5 | VDD — Core logic supply (3.3 V) |
| Контакт 6 | VSS — Core ground |
| Контакт 7 | OSC1/CLKI — Crystal oscillator input / external clock input |
| Контакт 8 | OSC2/CLKO — Crystal oscillator output / clock output |
| Контакт 9 | SOSCI/SOSC1 — Secondary oscillator input (32.768 kHz for RTC) |
| Контакт 10 | SOSCO/SOSC2 — Secondary oscillator output |
| Контакт 11 | MCLR — Master clear / reset input (active low) |
| Контакт 12 | PGED2/DAT — Programming data / Trace DATA |
| Контакт 13 | PGEC2/CLK — Programming clock / Trace CLK |
| Контакт 14 | VSS — Ground |
| Контакт 15 | VDD — Core logic supply (3.3 V) |
| Контакт 16 | RPxx — Remappable peripheral I/O |
| Контакт 17 | RPxx — Remappable peripheral I/O |
| Контакт 18 | RPxx — Remappable peripheral I/O |
| Контакт 19 | RPxx — Remappable peripheral I/O |
| Контакт 20 | VSS — Ground |
| Контакт 21 | VDD — Core logic supply (3.3 V) |
| Контакт 22 | RPxx — Remappable peripheral I/O |
| Контакт 23 | RPxx — Remappable peripheral I/O |
| Контакт 24 | RPxx — Remappable peripheral I/O |
| Контакт 25 | RPxx — Remappable peripheral I/O |
| Контакт 26 | RPxx — Remappable peripheral I/O |
| Контакт 27 | RPxx — Remappable peripheral I/O |
| Контакт 28 | RPxx — Remappable peripheral I/O |
| Контакт 29 | RPxx — Remappable peripheral I/O |
| Контакт 30 | VSS — Ground |
| Контакт 31 | VDD — Core logic supply (3.3 V) |
| Контакт 32 | RPxx — Remappable peripheral I/O |
| Контакт 33 | RPxx — Remappable peripheral I/O |
| Контакт 34 | RPxx — Remappable peripheral I/O |
| Контакт 35 | RPxx — Remappable peripheral I/O |
| Контакт 36 | RPxx — Remappable peripheral I/O |
| Контакт 37 | RPxx — Remappable peripheral I/O |
| Контакт 38 | RPxx — Remappable peripheral I/O |
| Контакт 39 | RPxx — Remappable peripheral I/O |
| Контакт 40 | VSS — Ground |
| Контакт 41 | VDD — Core logic supply (3.3 V) |
| Контакт 42 | SQI/CS — SQI chip select / remappable |
| Контакт 43 | SQI/SCLK — SQI clock / remappable |
| Контакт 44 | SQI/SDO — SQI data out / remappable |
| Контакт 45 | SQI/SDI — SQI data in / remappable |
| Контакт 46 | USB VBUS — USB VBUS sense |
| Контакт 47 | USB D- — USB data minus |
| Контакт 48 | USB D+ — USB data plus |
| Контакт 49 | VBUS/VDDUSB — USB transceiver supply (3.3 V) |
| Контакт 50 | VSS — Ground |
| Контакт 51 | ETH REFCLK — Ethernet reference clock input |
| Контакт 52 | ETH TXCLK — Ethernet transmit clock |
| Контакт 53 | ETH TXEN — Ethernet transmit enable |
| Контакт 54 | ETH TXD0 — Ethernet transmit data 0 |
| Контакт 55 | ETH TXD1 — Ethernet transmit data 1 |
| Контакт 56 | ETH RXCLK — Ethernet receive clock |
| Контакт 57 | ETH RXDV — Ethernet receive data valid |
| Контакт 58 | ETH RXD0 — Ethernet receive data 0 |
| Контакт 59 | ETH RXD1 — Ethernet receive data 1 |
| Контакт 60 | ETH MDIO — Ethernet management data I/O |
| Контакт 61 | ETH MDC — Ethernet management clock |
| Контакт 62 | VDD — Core logic supply (3.3 V) |
| Контакт 63 | VSS — Ground |
| Контакт 64 | EP — Exposed thermal pad - tie to ground for thermal dissipation |
Типичное применение
PIC32MZ1024EFG064T-I/MR подходит для 6 применениеs: Industrial IoT Gateway, BLDC / PMSM Motor Control (FOC), HMI / Graphics Display Controller, Audio Processing / USB Audio Device, Automotive Infotainment Subsystem, Industrial Connectivity / Ethernet-IP Node.
Industrial IoT Gateway
The PIC32MZ1024EFG064T-I/MR's 10/100 Ethernet MAC, Hi-Speed USB 2.0 with integrated PHY, and 1 MB Flash/512 KB SRAM make it well suited as the main MCU for an industrial IoT gateway that aggregates field-bus data (Modbus, CAN, RS-485) and bridges to Ethernet/IP or MQTT cloud backends. The 200 MHz MIPS M-class core runs TLS, an IP stack, and a real-time scheduler concurrently without offloading. With 46 GPIO and 8 DMA channels, the device can sample multiple sensor streams while servicing network traffic.
Рекомендуется
BLDC / PMSM Motor Control (FOC)
Field-oriented control of a three-phase BLDC or PMSM motor requires single-cycle MAC operations every PWM period - exactly what the PIC32MZ1024EFG064T-I/MR's MIPS Warrior M-class core with single-cycle MAC and four 64-bit accumulators delivers at 200 MHz. The IEEE 754 FPU accelerates Park/Clarke transforms in floating point, while the 9 timers generate complementary PWMs with dead-band insertion. The 2 comparators provide hardware overcurrent protection, and 8 DMA channels offload ADC sampling so the CPU can stay focused on the control loop.
Рекомендуется
HMI / Graphics Display Controller
The PIC32MZ1024EFG064T-I/MR drives medium-resolution TFT LCDs up to WQVGA through its parallel PMP interface and 512 KB SRAM that can host framebuffers plus graphics libraries such as Microchip's MPLAB Harmony Graphics (MHGS). The 200 MHz core plus FPU renders anti-aliased fonts, touch transitions, and 2D widgets smoothly. Hi-Speed USB supports firmware update and touch bridging, while Ethernet enables remote HMI panel diagnostics. The 64-QFN (9x9) footprint fits compact operator-panel enclosures.
Рекомендуется
Audio Processing / USB Audio Device
With Hi-Speed USB 2.0, an integrated USB PHY, and an FPU that accelerates audio DSP kernels, the PIC32MZ1024EFG064T-I/MR is a strong fit for USB audio class devices such as USB headsets, USB DACs, and audio interfaces. The DSP extensions (single-cycle MAC, fractional math) handle biquad filters, dynamics, and mixing at 48 kHz with negligible CPU load. The 1 MB Flash accommodates USB stack, audio class driver, and DSP libraries concurrently; 512 KB SRAM buffers multi-channel audio frames.
Рекомендуется
Automotive Infotainment Subsystem
Although not AEC-Q100 qualified in this exact suffix, the PIC32MZ1024EFG064T-I/MR family underpins many automotive prototypes for head-unit aux MCUs, HVAC panels, and instrument-cluster sub-controllers where it manages CAN/LIN, drives small displays, and bridges to the main SOC over Ethernet or USB. Its 1 MB Flash and 512 KB SRAM run lightweight RTOS plus display stacks, and the 200 MHz MIPS core offers headroom for graphics rendering. Designers targeting production vehicles should select the automotive-grade (-Q) variant when available.
Рекомендуется
Industrial Connectivity / Ethernet-IP Node
The integrated 10/100 Ethernet MAC plus 1 MB Flash lets the PIC32MZ1024EFG064T-I/MR run Ethernet/IP, PROFINET, or Modbus TCP stacks without an external communication processor. With 200 MHz MIPS throughput and 512 KB SRAM, the device can poll multiple sensors, execute deterministic control loops, and respond to network requests in microseconds. The 64-QFN footprint is well suited to compact IP67-sealed industrial nodes. SQI is used to log event data to external serial Flash for post-event diagnostics.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC32MZ1024EFG064T-I/MR — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC32MZ1024EFG064-I/MR | PIC32MZ1024EFF064-I/MR | PIC32MZ1024EFE064-I/PT | PIC32MZ1024ECG064-I/MR | PIC32MZ1024EFG064T-E/MR | PIC32MZ1024EFG064T-250I/MR |
|---|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency (max) | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 252 MHz |
| Program Memory (Flash) | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 256 KB (-50%) | 512 KB | 512 KB | 512 KB | 512 KB |
| FPU | IEEE 754 | IEEE 754 | IEEE 754 | IEEE 754 | No | IEEE 754 | IEEE 754 |
| Hi-Speed USB with PHY | Yes | Yes | Yes | No | Yes | Yes | Yes |
| Ethernet MAC | 10/100 | 10/100 | 10/100 | No | 10/100 | 10/100 | 10/100 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C (Extended) | -40C to +85C |
| Packaging Form | Tape & Reel | Tray | Tray | Tray | Tray | Tape & Reel | Tape & Reel |
Ключевые отличия
- Hi-Speed USB with integrated PHY (против PIC32MZ1024EFE064-I/PT)
- 512 KB SRAM for higher memory headroom (против PIC32MZ1024EFF064-I/MR)
- Hardware IEEE 754 FPU (против PIC32MZ1024ECG064-I/MR)
- Industrial vs Extended temperature envelope (против PIC32MZ1024EFG064T-E/MR)
Заметки по проектированию
The PIC32MZ1024EFG064T-I/MR uses 3.3 V supply rails with multiple VDD/VSS pin pairs distributed around the 64-QFN package to minimize loop inductance. Decouple each VDD pin with a 100 nF ceramic capacitor placed within 2 mm of the pin, plus a single shared 10 uF bulk capacitor per supply domain. The USB transceiver has its own VBUS/VDDUSB supply that must be bypassed separately. Estimated core current draw at 200 MHz with all peripherals enabled is approximately 70-90 mA; budget at least 150 mA for the analog and I/O domains combined.
The 64-QFN (9x9) package has an exposed thermal pad (EP) that must be soldered to a ground copper pour with thermal vias (typically a 3x3 array of 0.3 mm vias) for proper heat dissipation. Trace escape routing is dense because 46 GPIO plus USB, Ethernet, and SQI signals all exit through the perimeter; use a 4-layer PCB with continuous ground plane under the part. Place the external 25 MHz crystal and load capacitors within 5 mm of the OSC1/OSC2 pins and guard the traces from switching signals.
Ethernet RMII signals must be length-matched within 50 mils to the external PHY and routed over a continuous ground plane with characteristic impedance of 50 ohm. Hi-Speed USB 2.0 D+/D- traces require 90 ohm differential impedance, no stubs, and a common-mode choke near the connector. The SQI bus to external serial Flash should be routed with matched lengths under 50 mm and kept away from analog inputs to avoid coupling.
Common pitfalls on PIC32MZ EF designs include forgetting to configure the FPU in the device configuration bits (which silently disables floating-point hardware), omitting the 32.768 kHz secondary oscillator load caps (causing RTC drift), and using a low-ESR bulk capacitor on VDD that destabilizes the internal regulator. Always read the silicon errata for the specific revision before locking the PCB layout; early revisions of the PIC32MZ EF family had known USB PHY and Ethernet RMII issues that are resolved in current silicon.
Информация о соответствии
RoHS and lead-free per Microchip product page. The 'I/MR' industrial-temperature variant is NOT AEC-Q100 qualified; for automotive applications requiring AEC-Q100, select a -Q suffix variant.
