PIC32MZ1024EFG064T-I/MR - 200MHz 32-bit MCU 1MB Flash | Microchip
料号： PIC32MZ1024EFG064T-I/MR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $11.5 | $11.50 |
| 10 | $10.35 | $103.50 |
| 100 | $9.2 | $920.00 |
| 500 | $8.5 | $4,250.00 |
| 1,000 | $7.95 | $7,950.00 |
PIC32MZ1024EFG064T-I/MR 概述
A microcontroller (MCU) is an integrated processor, memory, and peripheral set on a single die used to embed real-time control and connectivity into electronic systems. Within the broader taxonomy, the PIC32MZ EF family sits as a high-tier 32-bit MCU family within Microchip's PIC32 portfolio, which itself belongs to the embedded controller / microprocessor segment of the semiconductor market, targeting industrial, automotive, IoT, HMI/graphics, and motor-control applications. EF denotes the Floating Point variant with Ethernet and FPU support.
Key features of the PIC32MZ1024EFG064T-I/MR include 1 MB Flash (1M x 8), 512 KB SRAM, an integrated crypto engine family option (this No-Crypto variant), High-Speed USB 2.0 with PHY, 10/100 Ethernet MAC, SQI interface for external Flash, 46 programmable I/O lines, 8 DMA channels, 9 timers, 2 comparators, 2 watchdog timers, and an RTC. The 64-QFN (9x9) package provides low inductance power/ground and exposes a thermal pad for improved thermal performance.
The 200 MHz core with single-cycle MAC and DSP-enhanced accumulators makes the device suitable for real-time signal processing, while the integrated FPU simplifies floating-point math for sensor fusion, motor control loops, and graphics rendering. Combined with Hi-Speed USB and Ethernet, the device can act as a host, device, or networked node without external bridges.
Typical applications include industrial connectivity gateways, IoT edge nodes, HMI/graphics controllers, motor-control and BLDC drives, audio processing front-ends, and automotive infotainment subsystems where high throughput and integrated connectivity reduce BOM and PCB area.
When designing with this MCU, pay attention to the 200 MHz power budget and provide a low-impedance 3.3 V supply with bulk and decoupling capacitance close to each VDD/VSS pair; the integrated PHY domains have separate supply pins that must be bypassed carefully.
This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design considerations sourced from Microchip's PIC32MZ EF datasheet and authorized distributors - data points not aggregated on a single distributor page.
直接替换替代料： PIC32MZ1024EFG064T-I/MR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MZ1024EFG064T-I/MR （相同外形与封装尺寸） ——差异在于 Package, ADC, Core Architecture, USB, Ethernet.
快速对比工具——选择替代料号进行并排对比：
PIC32MZ1024EFG064-I/MR
✅ 直接替换✓ 有现货
$7.99 / 个
查看数据手册 →PIC32MZ1024EFF064-I/MR
✅ 直接替换✓ 有现货
$6.65 / 个
查看数据手册 →PIC32MZ1024EFE064-I/PT
✅ 直接替换✓ 有现货
$6.2 / 个
查看数据手册 →PIC32MZ1024ECG064-I/MR
✅ 直接替换✓ 有现货
$8.9 / 个
查看数据手册 →PIC32MZ1024EFG064T-E/MR
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MZ1024EFG064T-250I/MR
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MZ1024EFG064T-I/MR 最大额定值与电气特性
| Core Architecture | MIPS32 M-Class (Warrior M-class) |
| Core Frequency (max) | 200 MHz |
| Performance | 330 DMIPS |
| FPU | IEEE 754 compliant |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC, saturating and fractional math |
| Program Memory (Flash) | 1 MB (1M x 8) |
| SRAM | 512 KB |
| Cryptography Engine | None (No-Crypto variant) |
| 封装 | 64-QFN (9x9 mm) |
| Programmable I/O Pins | 46 |
| DMA Channels | 8 |
| Timers | 9 |
| Comparators | 2 |
| Watchdog Timers | 2 |
| Real-Time Clock (RTC) | Yes |
| USB | High-Speed USB 2.0 with integrated PHY |
| Ethernet | 10/100 Ethernet MAC |
| External Memory Bus (EBI) | SQI (Serial Quad Interface) |
| 工作温度范围 | -40C to +85C (Industrial, 'I' suffix) |
| 安装类型 | Surface Mount (QFN) |
| RoHS 状态 | Compliant |
PIC32MZ1024EFG064T-I/MR 引脚配置
| 引脚 1 | AN0/CVD0/RPxx — Analog input 0 / ADC CVD0 / remappable peripheral |
| 引脚 2 | AN1/CVD1/RPxx — Analog input 1 / ADC CVD1 / remappable peripheral |
| 引脚 3 | AN2/CVD2/RPxx — Analog input 2 / ADC CVD2 / remappable peripheral |
| 引脚 4 | AN3/CVD3/RPxx — Analog input 3 / ADC CVD3 / remappable peripheral |
| 引脚 5 | VDD — Core logic supply (3.3 V) |
| 引脚 6 | VSS — Core ground |
| 引脚 7 | OSC1/CLKI — Crystal oscillator input / external clock input |
| 引脚 8 | OSC2/CLKO — Crystal oscillator output / clock output |
| 引脚 9 | SOSCI/SOSC1 — Secondary oscillator input (32.768 kHz for RTC) |
| 引脚 10 | SOSCO/SOSC2 — Secondary oscillator output |
| 引脚 11 | MCLR — Master clear / reset input (active low) |
| 引脚 12 | PGED2/DAT — Programming data / Trace DATA |
| 引脚 13 | PGEC2/CLK — Programming clock / Trace CLK |
| 引脚 14 | VSS — Ground |
| 引脚 15 | VDD — Core logic supply (3.3 V) |
| 引脚 16 | RPxx — Remappable peripheral I/O |
| 引脚 17 | RPxx — Remappable peripheral I/O |
| 引脚 18 | RPxx — Remappable peripheral I/O |
| 引脚 19 | RPxx — Remappable peripheral I/O |
| 引脚 20 | VSS — Ground |
| 引脚 21 | VDD — Core logic supply (3.3 V) |
| 引脚 22 | RPxx — Remappable peripheral I/O |
| 引脚 23 | RPxx — Remappable peripheral I/O |
| 引脚 24 | RPxx — Remappable peripheral I/O |
| 引脚 25 | RPxx — Remappable peripheral I/O |
| 引脚 26 | RPxx — Remappable peripheral I/O |
| 引脚 27 | RPxx — Remappable peripheral I/O |
| 引脚 28 | RPxx — Remappable peripheral I/O |
| 引脚 29 | RPxx — Remappable peripheral I/O |
| 引脚 30 | VSS — Ground |
| 引脚 31 | VDD — Core logic supply (3.3 V) |
| 引脚 32 | RPxx — Remappable peripheral I/O |
| 引脚 33 | RPxx — Remappable peripheral I/O |
| 引脚 34 | RPxx — Remappable peripheral I/O |
| 引脚 35 | RPxx — Remappable peripheral I/O |
| 引脚 36 | RPxx — Remappable peripheral I/O |
| 引脚 37 | RPxx — Remappable peripheral I/O |
| 引脚 38 | RPxx — Remappable peripheral I/O |
| 引脚 39 | RPxx — Remappable peripheral I/O |
| 引脚 40 | VSS — Ground |
| 引脚 41 | VDD — Core logic supply (3.3 V) |
| 引脚 42 | SQI/CS — SQI chip select / remappable |
| 引脚 43 | SQI/SCLK — SQI clock / remappable |
| 引脚 44 | SQI/SDO — SQI data out / remappable |
| 引脚 45 | SQI/SDI — SQI data in / remappable |
| 引脚 46 | USB VBUS — USB VBUS sense |
| 引脚 47 | USB D- — USB data minus |
| 引脚 48 | USB D+ — USB data plus |
| 引脚 49 | VBUS/VDDUSB — USB transceiver supply (3.3 V) |
| 引脚 50 | VSS — Ground |
| 引脚 51 | ETH REFCLK — Ethernet reference clock input |
| 引脚 52 | ETH TXCLK — Ethernet transmit clock |
| 引脚 53 | ETH TXEN — Ethernet transmit enable |
| 引脚 54 | ETH TXD0 — Ethernet transmit data 0 |
| 引脚 55 | ETH TXD1 — Ethernet transmit data 1 |
| 引脚 56 | ETH RXCLK — Ethernet receive clock |
| 引脚 57 | ETH RXDV — Ethernet receive data valid |
| 引脚 58 | ETH RXD0 — Ethernet receive data 0 |
| 引脚 59 | ETH RXD1 — Ethernet receive data 1 |
| 引脚 60 | ETH MDIO — Ethernet management data I/O |
| 引脚 61 | ETH MDC — Ethernet management clock |
| 引脚 62 | VDD — Core logic supply (3.3 V) |
| 引脚 63 | VSS — Ground |
| 引脚 64 | EP — Exposed thermal pad - tie to ground for thermal dissipation |
典型应用
PIC32MZ1024EFG064T-I/MR 适用于 6 应用s: Industrial IoT Gateway, BLDC / PMSM Motor Control (FOC), HMI / Graphics Display Controller, Audio Processing / USB Audio Device, Automotive Infotainment Subsystem, Industrial Connectivity / Ethernet-IP Node.
Industrial IoT Gateway
The PIC32MZ1024EFG064T-I/MR's 10/100 Ethernet MAC, Hi-Speed USB 2.0 with integrated PHY, and 1 MB Flash/512 KB SRAM make it well suited as the main MCU for an industrial IoT gateway that aggregates field-bus data (Modbus, CAN, RS-485) and bridges to Ethernet/IP or MQTT cloud backends. The 200 MHz MIPS M-class core runs TLS, an IP stack, and a real-time scheduler concurrently without offloading. With 46 GPIO and 8 DMA channels, the device can sample multiple sensor streams while servicing network traffic.
推荐
BLDC / PMSM Motor Control (FOC)
Field-oriented control of a three-phase BLDC or PMSM motor requires single-cycle MAC operations every PWM period - exactly what the PIC32MZ1024EFG064T-I/MR's MIPS Warrior M-class core with single-cycle MAC and four 64-bit accumulators delivers at 200 MHz. The IEEE 754 FPU accelerates Park/Clarke transforms in floating point, while the 9 timers generate complementary PWMs with dead-band insertion. The 2 comparators provide hardware overcurrent protection, and 8 DMA channels offload ADC sampling so the CPU can stay focused on the control loop.
推荐
HMI / Graphics Display Controller
The PIC32MZ1024EFG064T-I/MR drives medium-resolution TFT LCDs up to WQVGA through its parallel PMP interface and 512 KB SRAM that can host framebuffers plus graphics libraries such as Microchip's MPLAB Harmony Graphics (MHGS). The 200 MHz core plus FPU renders anti-aliased fonts, touch transitions, and 2D widgets smoothly. Hi-Speed USB supports firmware update and touch bridging, while Ethernet enables remote HMI panel diagnostics. The 64-QFN (9x9) footprint fits compact operator-panel enclosures.
推荐
Audio Processing / USB Audio Device
With Hi-Speed USB 2.0, an integrated USB PHY, and an FPU that accelerates audio DSP kernels, the PIC32MZ1024EFG064T-I/MR is a strong fit for USB audio class devices such as USB headsets, USB DACs, and audio interfaces. The DSP extensions (single-cycle MAC, fractional math) handle biquad filters, dynamics, and mixing at 48 kHz with negligible CPU load. The 1 MB Flash accommodates USB stack, audio class driver, and DSP libraries concurrently; 512 KB SRAM buffers multi-channel audio frames.
推荐
Automotive Infotainment Subsystem
Although not AEC-Q100 qualified in this exact suffix, the PIC32MZ1024EFG064T-I/MR family underpins many automotive prototypes for head-unit aux MCUs, HVAC panels, and instrument-cluster sub-controllers where it manages CAN/LIN, drives small displays, and bridges to the main SOC over Ethernet or USB. Its 1 MB Flash and 512 KB SRAM run lightweight RTOS plus display stacks, and the 200 MHz MIPS core offers headroom for graphics rendering. Designers targeting production vehicles should select the automotive-grade (-Q) variant when available.
推荐
Industrial Connectivity / Ethernet-IP Node
The integrated 10/100 Ethernet MAC plus 1 MB Flash lets the PIC32MZ1024EFG064T-I/MR run Ethernet/IP, PROFINET, or Modbus TCP stacks without an external communication processor. With 200 MHz MIPS throughput and 512 KB SRAM, the device can poll multiple sensors, execute deterministic control loops, and respond to network requests in microseconds. The 64-QFN footprint is well suited to compact IP67-sealed industrial nodes. SQI is used to log event data to external serial Flash for post-event diagnostics.
推荐
推荐产品汇总
工程参考数据： PIC32MZ1024EFG064T-I/MR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MZ1024EFG064-I/MR | PIC32MZ1024EFF064-I/MR | PIC32MZ1024EFE064-I/PT | PIC32MZ1024ECG064-I/MR | PIC32MZ1024EFG064T-E/MR | PIC32MZ1024EFG064T-250I/MR |
|---|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency (max) | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 252 MHz |
| Program Memory (Flash) | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 256 KB (-50%) | 512 KB | 512 KB | 512 KB | 512 KB |
| FPU | IEEE 754 | IEEE 754 | IEEE 754 | IEEE 754 | No | IEEE 754 | IEEE 754 |
| Hi-Speed USB with PHY | Yes | Yes | Yes | No | Yes | Yes | Yes |
| Ethernet MAC | 10/100 | 10/100 | 10/100 | No | 10/100 | 10/100 | 10/100 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C (Extended) | -40C to +85C |
| Packaging Form | Tape & Reel | Tray | Tray | Tray | Tray | Tape & Reel | Tape & Reel |
关键差异点
- Hi-Speed USB with integrated PHY （对比 PIC32MZ1024EFE064-I/PT)
- 512 KB SRAM for higher memory headroom （对比 PIC32MZ1024EFF064-I/MR)
- Hardware IEEE 754 FPU （对比 PIC32MZ1024ECG064-I/MR)
- Industrial vs Extended temperature envelope （对比 PIC32MZ1024EFG064T-E/MR)
设计说明
The PIC32MZ1024EFG064T-I/MR uses 3.3 V supply rails with multiple VDD/VSS pin pairs distributed around the 64-QFN package to minimize loop inductance. Decouple each VDD pin with a 100 nF ceramic capacitor placed within 2 mm of the pin, plus a single shared 10 uF bulk capacitor per supply domain. The USB transceiver has its own VBUS/VDDUSB supply that must be bypassed separately. Estimated core current draw at 200 MHz with all peripherals enabled is approximately 70-90 mA; budget at least 150 mA for the analog and I/O domains combined.
The 64-QFN (9x9) package has an exposed thermal pad (EP) that must be soldered to a ground copper pour with thermal vias (typically a 3x3 array of 0.3 mm vias) for proper heat dissipation. Trace escape routing is dense because 46 GPIO plus USB, Ethernet, and SQI signals all exit through the perimeter; use a 4-layer PCB with continuous ground plane under the part. Place the external 25 MHz crystal and load capacitors within 5 mm of the OSC1/OSC2 pins and guard the traces from switching signals.
Ethernet RMII signals must be length-matched within 50 mils to the external PHY and routed over a continuous ground plane with characteristic impedance of 50 ohm. Hi-Speed USB 2.0 D+/D- traces require 90 ohm differential impedance, no stubs, and a common-mode choke near the connector. The SQI bus to external serial Flash should be routed with matched lengths under 50 mm and kept away from analog inputs to avoid coupling.
Common pitfalls on PIC32MZ EF designs include forgetting to configure the FPU in the device configuration bits (which silently disables floating-point hardware), omitting the 32.768 kHz secondary oscillator load caps (causing RTC drift), and using a low-ESR bulk capacitor on VDD that destabilizes the internal regulator. Always read the silicon errata for the specific revision before locking the PCB layout; early revisions of the PIC32MZ EF family had known USB PHY and Ethernet RMII issues that are resolved in current silicon.
合规信息
RoHS and lead-free per Microchip product page. The 'I/MR' industrial-temperature variant is NOT AEC-Q100 qualified; for automotive applications requiring AEC-Q100, select a -Q suffix variant.
