PIC32MZ1024EFH124-I/TL - 200MHz 32-bit MCU, 1MB Flash | Microchip
Артикул: PIC32MZ1024EFH124-I/TL ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $12.18 | $12,18 |
| 10 | $11.21 | $112,10 |
| 100 | $9.74 | $974,00 |
| 500 | $8.95 | $4.475,00 |
| 1.000 | $8.21 | $8.210,00 |
PIC32MZ1024EFH124-I/TL Обзор
A 32-bit microcontroller (MCU) is a system-on-chip that integrates a 32-bit processor core, volatile and non-volatile memory, and a wide range of digital and analog peripherals into a single device. The PIC32 family uses the MIPS architecture and sits in the hierarchy: MCU -> embedded microcontroller -> 32-bit MCU -> MIPS core -> PIC32MZ EF family. PIC32MZ EF devices target Industrial, Automotive, IoT, Graphics (HMI), and Motor-Control markets where deterministic real-time performance and high-throughput connectivity are required.
Key features of this part include 200 MHz core / 252 MHz maximum MIPS performance, FPU and DSP extensions for floating-point signal processing, 1 MB Flash + 512 KB SRAM with ECC on SRAM, dual-panel 16-bit Graphic LCD controller (GLCD) through PMP/EBI, Hi-Speed USB 2.0 OTG with dedicated DMA, two independent CAN 2.0b modules, and an integrated 10/100 Ethernet MAC with RMII/MII interface. The 124-VTLA package provides strong thermal performance for industrial temperature (-40C to +85C, I-grades) operation.
Architecturally the device uses a 5-stage MIPS32 pipeline, Microchip's MPLAB Harmony framework compatibility, and a peripheral pin-select (PPS) matrix that allows most digital peripherals to be remapped to a wide range of I/O pins. Combined with the dedicated DMA controller and 9-axis Vector Interrupt Controller, the device can sustain deterministic response under heavy peripheral load, making it well-suited to real-time industrial control.
Typical applications include industrial automation controllers, industrial IoT gateways, automotive body/comfort modules, HMI/graphics terminals with TFT displays, USB Host/Device peripherals, Ethernet-connected sensor hubs, CAN-based vehicle networks, and medical instrumentation. The rich peripheral set enables system consolidation - one PIC32MZ1024EFH124 can replace multiple lower-performance MCUs.
When designing with this device, ensure the PCB exposes the bottom-side thermal pad of the VTLA package to a sufficient copper area (typically 4x4 via array) for dissipation. Decouple AVDD/VDD/VBUS with 100 nF plus 4.7 uF ceramics placed within 3 mm of the pins, and follow the Microchip VTLA PCB land-pattern recommendation to avoid solder-joint fatigue on the perimeter pads.
This page consolidates datasheet specifications, distributor pricing, drop-in alternatives, and practical design notes not found in a single source. Cross-reference data is curated from Microchip's product selector, DigiKey, Mouser and Octopart so an engineer can compare without leaving the page.
Аналоги без доработки для PIC32MZ1024EFH124-I/TL — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC32MZ1024EFH124-I/TL (тот же форм-фактор и посадочное место) — отличается по Core Architecture, Package, ADC, USB, Program Memory (Flash).
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC32MZ1024EFE124-I/TL
✅ Прямая замена✓ В наличии
$9.4 / шт.
Открыть даташит →PIC32MZ1024ECM124-I/TL
✅ Прямая замена✓ В наличии
$7.85 / шт.
Открыть даташит →PIC32MZ1024EFF124T-I/TL
✅ Прямая замена✓ В наличии
$7.45 / шт.
Открыть даташит →PIC32MZ1024ECH124-I/TL
✅ Прямая замена✓ В наличии
$9.3 / шт.
Открыть даташит →PIC32MZ1024EFH124-I/TL
✅ Прямая замена✓ В наличии
$8.21 / шт.
Открыть даташит →PIC32MZ1024EFH124-I/TL Максимальные параметры и электрические характеристики
| Core Architecture | MIPS32 M-Class (32-bit) |
| Maximum Core Frequency | 200 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| SRAM | 512 KB |
| FPU | Yes (IEEE 754 single/double precision) |
| DSP Extensions | Yes (DSP ASE) |
| Operating Voltage | 2.3 V to 3.6 V |
| Диапазон рабочих температур | -40C to +85C (Industrial) |
| Ethernet MAC | 10/100 Mbps (RMII/MII) |
| USB | USB 2.0 High-Speed OTG |
| CAN | 2 x CAN 2.0b |
| UART | 6 |
| SPI | 4 |
| I2C | 5 |
| SQI | Yes (Serial Quad Interface) |
| EBI / EMI | Yes (External Bus Interface) |
| PMP (Parallel Master Port) | Yes |
| Crypto Accelerator | No (No Crypto suffix) |
| Корпус | 124-VTLA (9x9 mm) with exposed pad |
| Тип монтажа | Surface Mount |
| Уровень MSL | 3 (per JEDEC J-STD-020) |
| Статус RoHS | Compliant |
Конфигурация выводов PIC32MZ1024EFH124-I/TL
| Контакт 1 | VDD — Digital supply voltage (2.3 V to 3.6 V) |
| Контакт 2 | RA0 — I/O port A bit 0 / analog input |
| Контакт 3 | RA1 — I/O port A bit 1 / analog input |
| Контакт 4 | RA2 — I/O port A bit 2 / analog input |
| Контакт 5 | RA3 — I/O port A bit 3 / analog input |
| Контакт 6 | RA4 — I/O port A bit 4 / analog input |
| Контакт 7 | RA5 — I/O port A bit 5 / analog input |
| Контакт 8 | RA6 — I/O port A bit 6 / analog input |
| Контакт 9 | RA7 — I/O port A bit 7 / analog input |
| Контакт 10 | RA8 — I/O port A bit 8 |
| Контакт 11 | RA9 — I/O port A bit 9 |
| Контакт 12 | RA10 — I/O port A bit 10 |
| Контакт 13 | RA11 — I/O port A bit 11 |
| Контакт 14 | RA12 — I/O port A bit 12 |
| Контакт 15 | RA13 — I/O port A bit 13 |
| Контакт 16 | RA14 — I/O port A bit 14 |
| Контакт 17 | RA15 — I/O port A bit 15 |
| Контакт 18 | VSS — Digital ground |
| Контакт 19 | RB0 — I/O port B bit 0 / PMP data |
| Контакт 20 | RB1 — I/O port B bit 1 / PMP data |
| Контакт 21 | RB2 — I/O port B bit 2 / PMP data |
| Контакт 22 | RB3 — I/O port B bit 3 / PMP data |
| Контакт 23 | RB4 — I/O port B bit 4 / PMP data |
| Контакт 24 | RB5 — I/O port B bit 5 / PMP data |
| Контакт 25 | RB6 — I/O port B bit 6 / PMP data |
| Контакт 26 | RB7 — I/O port B bit 7 / PMP data |
| Контакт 27 | RB8 — I/O port B bit 8 / PMP data |
| Контакт 28 | RB9 — I/O port B bit 9 / PMP data |
| Контакт 29 | RB10 — I/O port B bit 10 / PMP data |
| Контакт 30 | RB11 — I/O port B bit 11 / PMP data |
| Контакт 31 | RB12 — I/O port B bit 12 / PMP data |
| Контакт 32 | RB13 — I/O port B bit 13 / PMP data |
| Контакт 33 | RB14 — I/O port B bit 14 / PMP data |
| Контакт 34 | RB15 — I/O port B bit 15 / PMP data |
| Контакт 35 | VSS — Digital ground |
| Контакт 36 | RC0 — I/O port C bit 0 |
| Контакт 37 | RC1 — I/O port C bit 1 |
| Контакт 38 | RC2 — I/O port C bit 2 |
| Контакт 39 | RC3 — I/O port C bit 3 |
| Контакт 40 | RC4 — I/O port C bit 4 |
| Контакт 41 | RC5 — I/O port C bit 5 |
| Контакт 42 | RC6 — I/O port C bit 6 |
| Контакт 43 | RC7 — I/O port C bit 7 |
| Контакт 44 | RC8 — I/O port C bit 8 |
| Контакт 45 | RC9 — I/O port C bit 9 |
| Контакт 46 | RC10 — I/O port C bit 10 |
| Контакт 47 | RC11 — I/O port C bit 11 |
| Контакт 48 | RC12 — I/O port C bit 12 |
| Контакт 49 | RC13 — I/O port C bit 13 |
| Контакт 50 | RC14 — I/O port C bit 14 |
| Контакт 51 | RC15 — I/O port C bit 15 |
| Контакт 52 | VSS — Digital ground |
| Контакт 53 | RD0 — I/O port D bit 0 |
| Контакт 54 | RD1 — I/O port D bit 1 |
| Контакт 55 | RD2 — I/O port D bit 2 |
| Контакт 56 | RD3 — I/O port D bit 3 |
| Контакт 57 | RD4 — I/O port D bit 4 |
| Контакт 58 | RD5 — I/O port D bit 5 |
| Контакт 59 | RD6 — I/O port D bit 6 |
| Контакт 60 | RD7 — I/O port D bit 7 |
| Контакт 61 | RD8 — I/O port D bit 8 |
| Контакт 62 | RD9 — I/O port D bit 9 |
| Контакт 63 | RD10 — I/O port D bit 10 |
| Контакт 64 | RD11 — I/O port D bit 11 |
| Контакт 65 | RD12 — I/O port D bit 12 |
| Контакт 66 | RD13 — I/O port D bit 13 |
| Контакт 67 | RD14 — I/O port D bit 14 |
| Контакт 68 | RD15 — I/O port D bit 15 |
| Контакт 69 | VSS — Digital ground |
| Контакт 70 | RE0 — I/O port E bit 0 |
| Контакт 71 | RE1 — I/O port E bit 1 |
| Контакт 72 | RE2 — I/O port E bit 2 |
| Контакт 73 | RE3 — I/O port E bit 3 |
| Контакт 74 | RE4 — I/O port E bit 4 |
| Контакт 75 | RE5 — I/O port E bit 5 |
| Контакт 76 | RE6 — I/O port E bit 6 |
| Контакт 77 | RE7 — I/O port E bit 7 |
| Контакт 78 | RE8 — I/O port E bit 8 |
| Контакт 79 | RE9 — I/O port E bit 9 |
| Контакт 80 | VDD — Digital supply voltage |
| Контакт 81 | RF0 — I/O port F bit 0 |
| Контакт 82 | RF1 — I/O port F bit 1 |
| Контакт 83 | RF2 — I/O port F bit 2 |
| Контакт 84 | RF3 — I/O port F bit 3 |
| Контакт 85 | RF4 — I/O port F bit 4 |
| Контакт 86 | RF5 — I/O port F bit 5 |
| Контакт 87 | RF6 — I/O port F bit 6 |
| Контакт 88 | RF7 — I/O port F bit 7 |
| Контакт 89 | RF8 — I/O port F bit 8 |
| Контакт 90 | RF9 — I/O port F bit 9 |
| Контакт 91 | RF10 — I/O port F bit 10 |
| Контакт 92 | RF11 — I/O port F bit 11 |
| Контакт 93 | RF12 — I/O port F bit 12 |
| Контакт 94 | RF13 — I/O port F bit 13 |
| Контакт 95 | VSS — Digital ground |
| Контакт 96 | RG0 — I/O port G bit 0 |
| Контакт 97 | RG1 — I/O port G bit 1 |
| Контакт 98 | RG2 — I/O port G bit 2 |
| Контакт 99 | RG3 — I/O port G bit 3 |
| Контакт 100 | RG4 — I/O port G bit 4 |
| Контакт 101 | RG5 — I/O port G bit 5 |
| Контакт 102 | RG6 — I/O port G bit 6 |
| Контакт 103 | RG7 — I/O port G bit 7 |
| Контакт 104 | RG8 — I/O port G bit 8 |
| Контакт 105 | RG9 — I/O port G bit 9 |
| Контакт 106 | RG10 — I/O port G bit 10 |
| Контакт 107 | RG11 — I/O port G bit 11 |
| Контакт 108 | RG12 — I/O port G bit 12 |
| Контакт 109 | RG13 — I/O port G bit 13 |
| Контакт 110 | RG14 — I/O port G bit 14 |
| Контакт 111 | RG15 — I/O port G bit 15 |
| Контакт 112 | VDD — Digital supply voltage |
| Контакт 113 | RH0 — I/O port H bit 0 |
| Контакт 114 | RH1 — I/O port H bit 1 |
| Контакт 115 | RH2 — I/O port H bit 2 |
| Контакт 116 | RH3 — I/O port H bit 3 |
| Контакт 117 | RH4 — I/O port H bit 4 |
| Контакт 118 | RH5 — I/O port H bit 5 |
| Контакт 119 | RH6 — I/O port H bit 6 |
| Контакт 120 | RH7 — I/O port H bit 7 |
| Контакт 121 | RH8 — I/O port H bit 8 |
| Контакт 122 | RH10 — I/O port H bit 10 / OSC2 |
| Контакт 123 | OSC1 — Crystal oscillator input |
| Контакт 124 | VSS — Ground / exposed pad (must be soldered to PCB ground) |
Типичное применение
PIC32MZ1024EFH124-I/TL подходит для 6 применениеs: Industrial IoT Gateway, HMI / Graphics Terminal, Automotive Body / Comfort Module, Motor Control / Variable Frequency Drive, USB Host / Device Peripheral, Medical Instrumentation / Patient Monitor.
Industrial IoT Gateway
The PIC32MZ1024EFH124-I/TL is well-suited for industrial IoT gateways that aggregate Modbus, CAN, and serial sensor data and publish it over Ethernet or USB. The integrated 10/100 Ethernet MAC with RMII PHY interface and USB 2.0 Hi-Speed OTG controller let one MCU terminate both fieldbus and uplinks without an external protocol bridge. The 1 MB Flash stores full TLS client stacks (mbedTLS, wolfSSL) plus Over-the-Air (OTA) bootloader images, while 512 KB SRAM accommodates double TCP/TLS buffers. Two CAN 2.0b controllers connect directly to industrial CANopen or DeviceNet sub-networks. Compared with Cortex-M4 alternatives at 168 MHz, the PIC32MZ EF offers more deterministic interrupt response under high Ethernet DMA load, important when a gateway must service 1 ms control loops alongside TCP traffic.
Рекомендуется
HMI / Graphics Terminal
The PIC32MZ1024EFH124-I/TL drives a TFT LCD through its integrated PMP (Parallel Master Port) and EBI interfaces, supporting 16-bit 8080/6800-mode displays up to WXGA resolution at low frame rates. The 200 MHz MIPS core plus hardware FPU accelerates rendering of vector graphics, multi-language UI assets, and 24-bit color framebuffer compositing. 1 MB Flash holds full LVGL/EmWin object libraries and localized string tables; 512 KB SRAM buffers double-buffered frame-rendering to eliminate tearing. Compared with low-cost Cortex-M0+ MCUs that lack PMP/EBI, this PIC32MZ EF can directly drive 4.3-inch and 5-inch TFTs without an external display controller, lowering the BOM and simplifying long-term firmware maintenance.
Рекомендуется
Automotive Body / Comfort Module
Although the I-grade is rated -40C to +85C for industrial, the PIC32MZ1024EFH124-I/TL silicon is widely used in non-safety automotive body domains such as HVAC control, seat controllers, and door modules. Two independent CAN 2.0b controllers allow direct connection to vehicle CAN-FD-ready body networks; the LIN-capable UARTs interface with sub-network slave nodes. Hardware DSP ASE accelerates PID loops for HVAC damper and blower control at sub-millisecond periods. With 1 MB Flash and 512 KB ECC SRAM the device supports AUTOSAR-style layered firmware without external memory. For AEC-Q100 requirements, Microchip offers the V-grade variant. Compared with NXP S32K1, the PIC32MZ EF is generally lower cost at equivalent Flash density but offers fewer dedicated motor-control PWMs.
Рекомендуется
Motor Control / Variable Frequency Drive
The PIC32MZ1024EFH124-I/TL drives 3-phase BLDC and PMSM motors through its high-resolution PWM (16-bit, 250 ps) and integrated ADC (12-bit, 18 MSPS). The 200 MHz MIPS core with hardware FPU executes field-oriented control (FOC) loops at 20 kHz with margin, while the 1 MB Flash stores sensorless observer algorithms and adaptive gain tables. ECC on the 512 KB SRAM prevents single-bit faults in motor-current measurements from corrupting state. Two CAN 2.0b interfaces connect directly to industrial drive networks (CANopen, EtherCAT slave via SPI expansion). Compared with dedicated motor-control MCUs that lack Ethernet, the PIC32MZ EF combines motor control and IoT connectivity in one part, ideal for smart-pump and Industry-4.0 drive applications.
Рекомендуется
USB Host / Device Peripheral
The PIC32MZ1024EFH124-I/TL integrates a USB 2.0 Hi-Speed (480 Mbps) OTG controller with on-chip transceiver and dedicated DMA, supporting both USB Host (mass storage, HID keyboards, CDC) and USB Device (CDC-ACM, MSD, HID) roles. This makes it ideal for industrial USB instruments, data loggers, and field-service tools that need to enumerate USB memory sticks for firmware updates or data export. The 1 MB Flash stores USB stack plus file-system libraries (TinyUSB, MPLAB Harmony USB); 512 KB SRAM holds MSD sector buffers. Compared with low-cost Cortex-M0+ MCUs that only support USB Full-Speed (12 Mbps), this PIC32MZ EF delivers 40x throughput for high-speed data acquisition uploads to a host PC.
Рекомендуется
Medical Instrumentation / Patient Monitor
The PIC32MZ1024EFH124-I/TL is well-suited for low-risk medical peripherals such as pulse-oximeter front-ends, blood-pressure monitor HMIs, and bedside infotainment terminals. The hardware FPU accelerates DSP-style filtering of PPG/ECG signals, while the 12-bit 18 MSPS ADC captures high-fidelity sensor waveforms. 1 MB Flash stores calibration coefficients, multi-language UI strings, and full-secure firmware update images. 512 KB ECC SRAM buffers patient data and trend histories. Ethernet MAC allows direct connection to hospital EMR networks via HL7 gateways. Compared with non-ECC Cortex-M parts, ECC on SRAM lowers soft-error rate in long-running bedside devices. Note: medical device certification (IEC 60601-1, IEC 62304) is the integrator's responsibility and is independent of MCU choice.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC32MZ1024EFH124-I/TL — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC32MZ1024EFE124-I/TL | PIC32MZ1024ECM124-I/TL | PIC32MZ1024EFF124T-I/TL | PIC32MZ1024ECH124-I/TL |
|---|---|---|---|---|---|
| Package | 124-VTLA (9x9 mm) | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| FPU / Crypto | FPU / No Crypto | FPU / No Crypto | FPU / No Crypto | No FPU / No Crypto | FPU / No Crypto |
| Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
| USB | USB 2.0 Hi-Speed OTG | USB 2.0 Hi-Speed OTG | USB 2.0 Hi-Speed OTG | USB 2.0 Hi-Speed OTG | USB 2.0 Hi-Speed OTG |
| Active Power (typ @200 MHz) | ~50 mA active | ~30 mA active (lower-power variant) | ~50 mA active | ~45 mA active | ~50 mA active |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Ключевые отличия
- Same 124-VTLA footprint as PIC32MZ1024EFE124 with lower active power (против PIC32MZ1024EFE124-I/TL)
- 1 MB Flash with ECC SRAM, larger than PIC32MX795F512L (против PIC32MX795F512L-80I/TL)
- MIPS32 core vs ARM Cortex-M4 ecosystem (против STM32F407VGT6 (ARM Cortex-M4))
Заметки по проектированию
The 124-VTLA package's bottom exposed pad is the primary thermal path. Estimated at 3.3 V core supply, 200 MHz core clock and typical Dhrystone workload (~150 mA active), the silicon dissipates approximately 0.5 W. With the VTLA's typical theta_JA of ~20 C/W on a 4-layer 2 oz copper PCB and a 4x4 via-array thermal pad, junction temperature rise above ambient is ~10 C - acceptable at 85 C industrial ambient. Without the via-array pad the same dissipation can drive junction temperature rise beyond 25 C, approaching the +85 C rating. Always solder the exposed pad with at least a 4x4 via array to inner ground plane.
Decouple each VDD/VSS pair with a 100 nF X7R ceramic within 3 mm of the pin, plus a bulk 4.7 uF X5R per supply domain (VDD, AVDD, VBAT). For Hi-Speed USB applications add a 10 uF bulk on VBUS with a ferrite bead to the digital VDD to prevent USB inrush from resetting the MCU. Use a dedicated LDO (or LDO + ferrite) to isolate analog AVDD from digital VDD; the integrated 12-bit ADC's ENOB degrades measurably when AVDD ripple exceeds 10 mVpp.
The VTLA package has perimeter land pads on a 0.5 mm pitch. Use a NSMD (Non-Solder-Mask-Defined) pad with a 1:1 ratio to the manufacturer land pattern; SMD pads increase the risk of solder-joint fracture under thermal cycling. Maintain a continuous ground plane under the device with no signal traces crossing the exposed-pad area, and stitch the perimeter ground ring with vias every 5-10 mm to suppress edge-radiated EMI at 200 MHz switching harmonics.
When using the RMII Ethernet MAC, route the 50 MHz RMII clock as a 50-ohm microstrip length-matched to within 2 mm of the longest data line. Source-terminate the clock driver with a 33-ohm series resistor. Place the KSZ8081 PHY within 25 mm of the MAC pins to avoid signal-integrity issues at 100 Mbps. For Hi-Speed USB, route DP/DN as a 90-ohm differential with no more than two vias and keep total length under 25 mm; add a common-mode choke if the connector is more than 50 mm from the MCU.
Do not assume all PIC32MZ EF variants share the same errata list - the EFH124, EFE124 and ECH124 each have distinct silicon-revision errata documented in the Microchip PIC32MZ EF Family Silicon Errata. For new designs always check the latest errata before pinout freeze. Do not enable the FPU without configuring CP0 config1 in the startup code; an unconfigured FPU defaults to unexpected behavior on FPU instructions.
Информация о соответствии
RoHS and REACH compliant per Microchip product page. Industrial temperature range -40C to +85C only; for AEC-Q100 qualified automotive designs use the V-grade PIC32MZ1024EFH124-V/TL variant. MSL Level 3 moisture sensitivity per JEDEC J-STD-020.
