PIC32MZ1024EFH124-I/TL - 200MHz 32-bit MCU, 1MB Flash | Microchip
Référence : PIC32MZ1024EFH124-I/TL ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.18 | $12,18 |
| 10 | $11.21 | $112,10 |
| 100 | $9.74 | $974,00 |
| 500 | $8.95 | $4 475,00 |
| 1 000 | $8.21 | $8 210,00 |
PIC32MZ1024EFH124-I/TL Présentation
A 32-bit microcontroller (MCU) is a system-on-chip that integrates a 32-bit processor core, volatile and non-volatile memory, and a wide range of digital and analog peripherals into a single device. The PIC32 family uses the MIPS architecture and sits in the hierarchy: MCU -> embedded microcontroller -> 32-bit MCU -> MIPS core -> PIC32MZ EF family. PIC32MZ EF devices target Industrial, Automotive, IoT, Graphics (HMI), and Motor-Control markets where deterministic real-time performance and high-throughput connectivity are required.
Key features of this part include 200 MHz core / 252 MHz maximum MIPS performance, FPU and DSP extensions for floating-point signal processing, 1 MB Flash + 512 KB SRAM with ECC on SRAM, dual-panel 16-bit Graphic LCD controller (GLCD) through PMP/EBI, Hi-Speed USB 2.0 OTG with dedicated DMA, two independent CAN 2.0b modules, and an integrated 10/100 Ethernet MAC with RMII/MII interface. The 124-VTLA package provides strong thermal performance for industrial temperature (-40C to +85C, I-grades) operation.
Architecturally the device uses a 5-stage MIPS32 pipeline, Microchip's MPLAB Harmony framework compatibility, and a peripheral pin-select (PPS) matrix that allows most digital peripherals to be remapped to a wide range of I/O pins. Combined with the dedicated DMA controller and 9-axis Vector Interrupt Controller, the device can sustain deterministic response under heavy peripheral load, making it well-suited to real-time industrial control.
Typical applications include industrial automation controllers, industrial IoT gateways, automotive body/comfort modules, HMI/graphics terminals with TFT displays, USB Host/Device peripherals, Ethernet-connected sensor hubs, CAN-based vehicle networks, and medical instrumentation. The rich peripheral set enables system consolidation - one PIC32MZ1024EFH124 can replace multiple lower-performance MCUs.
When designing with this device, ensure the PCB exposes the bottom-side thermal pad of the VTLA package to a sufficient copper area (typically 4x4 via array) for dissipation. Decouple AVDD/VDD/VBUS with 100 nF plus 4.7 uF ceramics placed within 3 mm of the pins, and follow the Microchip VTLA PCB land-pattern recommendation to avoid solder-joint fatigue on the perimeter pads.
This page consolidates datasheet specifications, distributor pricing, drop-in alternatives, and practical design notes not found in a single source. Cross-reference data is curated from Microchip's product selector, DigiKey, Mouser and Octopart so an engineer can compare without leaving the page.
Alternatives de remplacement direct pour PIC32MZ1024EFH124-I/TL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFH124-I/TL (même facteur de forme et même empreinte) — différant par Core Architecture, Package, ADC, USB, Program Memory (Flash).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFE124-I/TL
✅ Remplacement direct✓ En stock
$9.4 / unité
Voir la fiche technique →PIC32MZ1024ECM124-I/TL
✅ Remplacement direct✓ En stock
$7.85 / unité
Voir la fiche technique →PIC32MZ1024EFF124T-I/TL
✅ Remplacement direct✓ En stock
$7.45 / unité
Voir la fiche technique →PIC32MZ1024ECH124-I/TL
✅ Remplacement direct✓ En stock
$9.3 / unité
Voir la fiche technique →PIC32MZ1024EFH124-I/TL
✅ Remplacement direct✓ En stock
$8.21 / unité
Voir la fiche technique →PIC32MZ1024EFH124-I/TL Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class (32-bit) |
| Maximum Core Frequency | 200 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| SRAM | 512 KB |
| FPU | Yes (IEEE 754 single/double precision) |
| DSP Extensions | Yes (DSP ASE) |
| Operating Voltage | 2.3 V to 3.6 V |
| Plage de température de fonctionnement | -40C to +85C (Industrial) |
| Ethernet MAC | 10/100 Mbps (RMII/MII) |
| USB | USB 2.0 High-Speed OTG |
| CAN | 2 x CAN 2.0b |
| UART | 6 |
| SPI | 4 |
| I2C | 5 |
| SQI | Yes (Serial Quad Interface) |
| EBI / EMI | Yes (External Bus Interface) |
| PMP (Parallel Master Port) | Yes |
| Crypto Accelerator | No (No Crypto suffix) |
| Boîtier | 124-VTLA (9x9 mm) with exposed pad |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Statut RoHS | Compliant |
Configuration des broches de PIC32MZ1024EFH124-I/TL
| Broche 1 | VDD — Digital supply voltage (2.3 V to 3.6 V) |
| Broche 2 | RA0 — I/O port A bit 0 / analog input |
| Broche 3 | RA1 — I/O port A bit 1 / analog input |
| Broche 4 | RA2 — I/O port A bit 2 / analog input |
| Broche 5 | RA3 — I/O port A bit 3 / analog input |
| Broche 6 | RA4 — I/O port A bit 4 / analog input |
| Broche 7 | RA5 — I/O port A bit 5 / analog input |
| Broche 8 | RA6 — I/O port A bit 6 / analog input |
| Broche 9 | RA7 — I/O port A bit 7 / analog input |
| Broche 10 | RA8 — I/O port A bit 8 |
| Broche 11 | RA9 — I/O port A bit 9 |
| Broche 12 | RA10 — I/O port A bit 10 |
| Broche 13 | RA11 — I/O port A bit 11 |
| Broche 14 | RA12 — I/O port A bit 12 |
| Broche 15 | RA13 — I/O port A bit 13 |
| Broche 16 | RA14 — I/O port A bit 14 |
| Broche 17 | RA15 — I/O port A bit 15 |
| Broche 18 | VSS — Digital ground |
| Broche 19 | RB0 — I/O port B bit 0 / PMP data |
| Broche 20 | RB1 — I/O port B bit 1 / PMP data |
| Broche 21 | RB2 — I/O port B bit 2 / PMP data |
| Broche 22 | RB3 — I/O port B bit 3 / PMP data |
| Broche 23 | RB4 — I/O port B bit 4 / PMP data |
| Broche 24 | RB5 — I/O port B bit 5 / PMP data |
| Broche 25 | RB6 — I/O port B bit 6 / PMP data |
| Broche 26 | RB7 — I/O port B bit 7 / PMP data |
| Broche 27 | RB8 — I/O port B bit 8 / PMP data |
| Broche 28 | RB9 — I/O port B bit 9 / PMP data |
| Broche 29 | RB10 — I/O port B bit 10 / PMP data |
| Broche 30 | RB11 — I/O port B bit 11 / PMP data |
| Broche 31 | RB12 — I/O port B bit 12 / PMP data |
| Broche 32 | RB13 — I/O port B bit 13 / PMP data |
| Broche 33 | RB14 — I/O port B bit 14 / PMP data |
| Broche 34 | RB15 — I/O port B bit 15 / PMP data |
| Broche 35 | VSS — Digital ground |
| Broche 36 | RC0 — I/O port C bit 0 |
| Broche 37 | RC1 — I/O port C bit 1 |
| Broche 38 | RC2 — I/O port C bit 2 |
| Broche 39 | RC3 — I/O port C bit 3 |
| Broche 40 | RC4 — I/O port C bit 4 |
| Broche 41 | RC5 — I/O port C bit 5 |
| Broche 42 | RC6 — I/O port C bit 6 |
| Broche 43 | RC7 — I/O port C bit 7 |
| Broche 44 | RC8 — I/O port C bit 8 |
| Broche 45 | RC9 — I/O port C bit 9 |
| Broche 46 | RC10 — I/O port C bit 10 |
| Broche 47 | RC11 — I/O port C bit 11 |
| Broche 48 | RC12 — I/O port C bit 12 |
| Broche 49 | RC13 — I/O port C bit 13 |
| Broche 50 | RC14 — I/O port C bit 14 |
| Broche 51 | RC15 — I/O port C bit 15 |
| Broche 52 | VSS — Digital ground |
| Broche 53 | RD0 — I/O port D bit 0 |
| Broche 54 | RD1 — I/O port D bit 1 |
| Broche 55 | RD2 — I/O port D bit 2 |
| Broche 56 | RD3 — I/O port D bit 3 |
| Broche 57 | RD4 — I/O port D bit 4 |
| Broche 58 | RD5 — I/O port D bit 5 |
| Broche 59 | RD6 — I/O port D bit 6 |
| Broche 60 | RD7 — I/O port D bit 7 |
| Broche 61 | RD8 — I/O port D bit 8 |
| Broche 62 | RD9 — I/O port D bit 9 |
| Broche 63 | RD10 — I/O port D bit 10 |
| Broche 64 | RD11 — I/O port D bit 11 |
| Broche 65 | RD12 — I/O port D bit 12 |
| Broche 66 | RD13 — I/O port D bit 13 |
| Broche 67 | RD14 — I/O port D bit 14 |
| Broche 68 | RD15 — I/O port D bit 15 |
| Broche 69 | VSS — Digital ground |
| Broche 70 | RE0 — I/O port E bit 0 |
| Broche 71 | RE1 — I/O port E bit 1 |
| Broche 72 | RE2 — I/O port E bit 2 |
| Broche 73 | RE3 — I/O port E bit 3 |
| Broche 74 | RE4 — I/O port E bit 4 |
| Broche 75 | RE5 — I/O port E bit 5 |
| Broche 76 | RE6 — I/O port E bit 6 |
| Broche 77 | RE7 — I/O port E bit 7 |
| Broche 78 | RE8 — I/O port E bit 8 |
| Broche 79 | RE9 — I/O port E bit 9 |
| Broche 80 | VDD — Digital supply voltage |
| Broche 81 | RF0 — I/O port F bit 0 |
| Broche 82 | RF1 — I/O port F bit 1 |
| Broche 83 | RF2 — I/O port F bit 2 |
| Broche 84 | RF3 — I/O port F bit 3 |
| Broche 85 | RF4 — I/O port F bit 4 |
| Broche 86 | RF5 — I/O port F bit 5 |
| Broche 87 | RF6 — I/O port F bit 6 |
| Broche 88 | RF7 — I/O port F bit 7 |
| Broche 89 | RF8 — I/O port F bit 8 |
| Broche 90 | RF9 — I/O port F bit 9 |
| Broche 91 | RF10 — I/O port F bit 10 |
| Broche 92 | RF11 — I/O port F bit 11 |
| Broche 93 | RF12 — I/O port F bit 12 |
| Broche 94 | RF13 — I/O port F bit 13 |
| Broche 95 | VSS — Digital ground |
| Broche 96 | RG0 — I/O port G bit 0 |
| Broche 97 | RG1 — I/O port G bit 1 |
| Broche 98 | RG2 — I/O port G bit 2 |
| Broche 99 | RG3 — I/O port G bit 3 |
| Broche 100 | RG4 — I/O port G bit 4 |
| Broche 101 | RG5 — I/O port G bit 5 |
| Broche 102 | RG6 — I/O port G bit 6 |
| Broche 103 | RG7 — I/O port G bit 7 |
| Broche 104 | RG8 — I/O port G bit 8 |
| Broche 105 | RG9 — I/O port G bit 9 |
| Broche 106 | RG10 — I/O port G bit 10 |
| Broche 107 | RG11 — I/O port G bit 11 |
| Broche 108 | RG12 — I/O port G bit 12 |
| Broche 109 | RG13 — I/O port G bit 13 |
| Broche 110 | RG14 — I/O port G bit 14 |
| Broche 111 | RG15 — I/O port G bit 15 |
| Broche 112 | VDD — Digital supply voltage |
| Broche 113 | RH0 — I/O port H bit 0 |
| Broche 114 | RH1 — I/O port H bit 1 |
| Broche 115 | RH2 — I/O port H bit 2 |
| Broche 116 | RH3 — I/O port H bit 3 |
| Broche 117 | RH4 — I/O port H bit 4 |
| Broche 118 | RH5 — I/O port H bit 5 |
| Broche 119 | RH6 — I/O port H bit 6 |
| Broche 120 | RH7 — I/O port H bit 7 |
| Broche 121 | RH8 — I/O port H bit 8 |
| Broche 122 | RH10 — I/O port H bit 10 / OSC2 |
| Broche 123 | OSC1 — Crystal oscillator input |
| Broche 124 | VSS — Ground / exposed pad (must be soldered to PCB ground) |
Applications typiques
PIC32MZ1024EFH124-I/TL convient pour 6 applications: Industrial IoT Gateway, HMI / Graphics Terminal, Automotive Body / Comfort Module, Motor Control / Variable Frequency Drive, USB Host / Device Peripheral, Medical Instrumentation / Patient Monitor.
Industrial IoT Gateway
The PIC32MZ1024EFH124-I/TL is well-suited for industrial IoT gateways that aggregate Modbus, CAN, and serial sensor data and publish it over Ethernet or USB. The integrated 10/100 Ethernet MAC with RMII PHY interface and USB 2.0 Hi-Speed OTG controller let one MCU terminate both fieldbus and uplinks without an external protocol bridge. The 1 MB Flash stores full TLS client stacks (mbedTLS, wolfSSL) plus Over-the-Air (OTA) bootloader images, while 512 KB SRAM accommodates double TCP/TLS buffers. Two CAN 2.0b controllers connect directly to industrial CANopen or DeviceNet sub-networks. Compared with Cortex-M4 alternatives at 168 MHz, the PIC32MZ EF offers more deterministic interrupt response under high Ethernet DMA load, important when a gateway must service 1 ms control loops alongside TCP traffic.
Recommandé
HMI / Graphics Terminal
The PIC32MZ1024EFH124-I/TL drives a TFT LCD through its integrated PMP (Parallel Master Port) and EBI interfaces, supporting 16-bit 8080/6800-mode displays up to WXGA resolution at low frame rates. The 200 MHz MIPS core plus hardware FPU accelerates rendering of vector graphics, multi-language UI assets, and 24-bit color framebuffer compositing. 1 MB Flash holds full LVGL/EmWin object libraries and localized string tables; 512 KB SRAM buffers double-buffered frame-rendering to eliminate tearing. Compared with low-cost Cortex-M0+ MCUs that lack PMP/EBI, this PIC32MZ EF can directly drive 4.3-inch and 5-inch TFTs without an external display controller, lowering the BOM and simplifying long-term firmware maintenance.
Recommandé
Automotive Body / Comfort Module
Although the I-grade is rated -40C to +85C for industrial, the PIC32MZ1024EFH124-I/TL silicon is widely used in non-safety automotive body domains such as HVAC control, seat controllers, and door modules. Two independent CAN 2.0b controllers allow direct connection to vehicle CAN-FD-ready body networks; the LIN-capable UARTs interface with sub-network slave nodes. Hardware DSP ASE accelerates PID loops for HVAC damper and blower control at sub-millisecond periods. With 1 MB Flash and 512 KB ECC SRAM the device supports AUTOSAR-style layered firmware without external memory. For AEC-Q100 requirements, Microchip offers the V-grade variant. Compared with NXP S32K1, the PIC32MZ EF is generally lower cost at equivalent Flash density but offers fewer dedicated motor-control PWMs.
Recommandé
Motor Control / Variable Frequency Drive
The PIC32MZ1024EFH124-I/TL drives 3-phase BLDC and PMSM motors through its high-resolution PWM (16-bit, 250 ps) and integrated ADC (12-bit, 18 MSPS). The 200 MHz MIPS core with hardware FPU executes field-oriented control (FOC) loops at 20 kHz with margin, while the 1 MB Flash stores sensorless observer algorithms and adaptive gain tables. ECC on the 512 KB SRAM prevents single-bit faults in motor-current measurements from corrupting state. Two CAN 2.0b interfaces connect directly to industrial drive networks (CANopen, EtherCAT slave via SPI expansion). Compared with dedicated motor-control MCUs that lack Ethernet, the PIC32MZ EF combines motor control and IoT connectivity in one part, ideal for smart-pump and Industry-4.0 drive applications.
Recommandé
USB Host / Device Peripheral
The PIC32MZ1024EFH124-I/TL integrates a USB 2.0 Hi-Speed (480 Mbps) OTG controller with on-chip transceiver and dedicated DMA, supporting both USB Host (mass storage, HID keyboards, CDC) and USB Device (CDC-ACM, MSD, HID) roles. This makes it ideal for industrial USB instruments, data loggers, and field-service tools that need to enumerate USB memory sticks for firmware updates or data export. The 1 MB Flash stores USB stack plus file-system libraries (TinyUSB, MPLAB Harmony USB); 512 KB SRAM holds MSD sector buffers. Compared with low-cost Cortex-M0+ MCUs that only support USB Full-Speed (12 Mbps), this PIC32MZ EF delivers 40x throughput for high-speed data acquisition uploads to a host PC.
Recommandé
Medical Instrumentation / Patient Monitor
The PIC32MZ1024EFH124-I/TL is well-suited for low-risk medical peripherals such as pulse-oximeter front-ends, blood-pressure monitor HMIs, and bedside infotainment terminals. The hardware FPU accelerates DSP-style filtering of PPG/ECG signals, while the 12-bit 18 MSPS ADC captures high-fidelity sensor waveforms. 1 MB Flash stores calibration coefficients, multi-language UI strings, and full-secure firmware update images. 512 KB ECC SRAM buffers patient data and trend histories. Ethernet MAC allows direct connection to hospital EMR networks via HL7 gateways. Compared with non-ECC Cortex-M parts, ECC on SRAM lowers soft-error rate in long-running bedside devices. Note: medical device certification (IEC 60601-1, IEC 62304) is the integrator's responsibility and is independent of MCU choice.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFH124-I/TL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFE124-I/TL | PIC32MZ1024ECM124-I/TL | PIC32MZ1024EFF124T-I/TL | PIC32MZ1024ECH124-I/TL |
|---|---|---|---|---|---|
| Package | 124-VTLA (9x9 mm) | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| FPU / Crypto | FPU / No Crypto | FPU / No Crypto | FPU / No Crypto | No FPU / No Crypto | FPU / No Crypto |
| Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
| USB | USB 2.0 Hi-Speed OTG | USB 2.0 Hi-Speed OTG | USB 2.0 Hi-Speed OTG | USB 2.0 Hi-Speed OTG | USB 2.0 Hi-Speed OTG |
| Active Power (typ @200 MHz) | ~50 mA active | ~30 mA active (lower-power variant) | ~50 mA active | ~45 mA active | ~50 mA active |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principaux différenciateurs
- Same 124-VTLA footprint as PIC32MZ1024EFE124 with lower active power (vs PIC32MZ1024EFE124-I/TL)
- 1 MB Flash with ECC SRAM, larger than PIC32MX795F512L (vs PIC32MX795F512L-80I/TL)
- MIPS32 core vs ARM Cortex-M4 ecosystem (vs STM32F407VGT6 (ARM Cortex-M4))
Notes de conception
The 124-VTLA package's bottom exposed pad is the primary thermal path. Estimated at 3.3 V core supply, 200 MHz core clock and typical Dhrystone workload (~150 mA active), the silicon dissipates approximately 0.5 W. With the VTLA's typical theta_JA of ~20 C/W on a 4-layer 2 oz copper PCB and a 4x4 via-array thermal pad, junction temperature rise above ambient is ~10 C - acceptable at 85 C industrial ambient. Without the via-array pad the same dissipation can drive junction temperature rise beyond 25 C, approaching the +85 C rating. Always solder the exposed pad with at least a 4x4 via array to inner ground plane.
Decouple each VDD/VSS pair with a 100 nF X7R ceramic within 3 mm of the pin, plus a bulk 4.7 uF X5R per supply domain (VDD, AVDD, VBAT). For Hi-Speed USB applications add a 10 uF bulk on VBUS with a ferrite bead to the digital VDD to prevent USB inrush from resetting the MCU. Use a dedicated LDO (or LDO + ferrite) to isolate analog AVDD from digital VDD; the integrated 12-bit ADC's ENOB degrades measurably when AVDD ripple exceeds 10 mVpp.
The VTLA package has perimeter land pads on a 0.5 mm pitch. Use a NSMD (Non-Solder-Mask-Defined) pad with a 1:1 ratio to the manufacturer land pattern; SMD pads increase the risk of solder-joint fracture under thermal cycling. Maintain a continuous ground plane under the device with no signal traces crossing the exposed-pad area, and stitch the perimeter ground ring with vias every 5-10 mm to suppress edge-radiated EMI at 200 MHz switching harmonics.
When using the RMII Ethernet MAC, route the 50 MHz RMII clock as a 50-ohm microstrip length-matched to within 2 mm of the longest data line. Source-terminate the clock driver with a 33-ohm series resistor. Place the KSZ8081 PHY within 25 mm of the MAC pins to avoid signal-integrity issues at 100 Mbps. For Hi-Speed USB, route DP/DN as a 90-ohm differential with no more than two vias and keep total length under 25 mm; add a common-mode choke if the connector is more than 50 mm from the MCU.
Do not assume all PIC32MZ EF variants share the same errata list - the EFH124, EFE124 and ECH124 each have distinct silicon-revision errata documented in the Microchip PIC32MZ EF Family Silicon Errata. For new designs always check the latest errata before pinout freeze. Do not enable the FPU without configuring CP0 config1 in the startup code; an unconfigured FPU defaults to unexpected behavior on FPU instructions.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Industrial temperature range -40C to +85C only; for AEC-Q100 qualified automotive designs use the V-grade PIC32MZ1024EFH124-V/TL variant. MSL Level 3 moisture sensitivity per JEDEC J-STD-020.
