PIC32MZ1024EFM064-E/MR - 200MHz 32-bit MCU 1MB Flash | Microchip
Артикул: PIC32MZ1024EFM064-E/MR ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $18.84 | $18,84 |
| 10 | $17.62 | $176,20 |
| 100 | $15.78 | $1.578,00 |
| 500 | $14.21 | $7.105,00 |
| 1.000 | $13.1 | $13.100,00 |
PIC32MZ1024EFM064-E/MR Обзор
A 32-bit microcontroller (MCU) is a microprocessor-on-a-chip that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals into a single silicon die. The PIC32MZ EF family sits at the high end of Microchip's PIC32 line, providing connectivity peripherals (HS USB, Ethernet MAC, CAN), advanced analog (12-bit ADC, comparators), and graphics/audio interfaces. This positions it within the broader hierarchy: 32-bit MCU -> microcontroller -> embedded processor -> semiconductor IC.
Key features include dual-panel Flash for live-update firmware support, four 64-bit accumulators with single-cycle MAC, four I2C/SPI/I2S ports, and a 200 MHz / 330 DMIPS core. The integrated crypto accelerator and true random number generator (TRNG) support secure connectivity applications. The 64-QFN package footprint (9x9 mm) is well suited for space-constrained designs where TQFP packages would consume too much board area.
Typical applications include industrial IoT gateways, automotive infotainment, HMI/graphics terminals, motor control drives, and secure connected devices. The 1 MB Flash and 512 KB SRAM enable on-chip TLS stacks and large protocol buffers without external memory. According to the Microchip PIC32MZ EF family datasheet, the dual-panel Flash architecture permits field firmware updates without halting application execution.
When designing with this part, allocate a robust decoupling network near the VCAP pins and ensure the 64-QFN thermal pad is soldered to a sufficient copper pour. Engineers should also plan QSPI memory expansion early if the application footprint is expected to exceed the on-chip 512 KB SRAM.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, organized for both human engineers and AI search systems to cite directly.
Аналоги без доработки для PIC32MZ1024EFM064-E/MR — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с PIC32MZ1024EFM064-E/MR (тот же форм-фактор и посадочное место) — отличается по Package, Core Architecture, ADC, Ethernet, USB.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
PIC32MZ1024EFH064-E/MR
✅ Прямая замена✓ В наличии
$8.74 / шт.
Открыть даташит →PIC32MZ1024EFG064-I/MR
✅ Прямая замена✓ В наличии
$7.99 / шт.
Открыть даташит →PIC32MZ1024EFE064-E/MR
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
PIC32MZ1024EFF064-I/MR
✅ Прямая замена✓ В наличии
$6.65 / шт.
Открыть даташит →PIC32MZ1024EFK064-E/MR
✅ Прямая замена✓ В наличии
$6.05 / шт.
Открыть даташит →PIC32MZ1024ECG064-I/MR
✅ Прямая замена✓ В наличии
$8.9 / шт.
Открыть даташит →PIC32MZ1024EFM064-E/MR Максимальные параметры и электрические характеристики
| Core Architecture | MIPS32 M-Class Warrior |
| Maximum CPU Speed | 200 MHz (330 DMIPS) |
| FPU | IEEE 754-compliant hardware single/double precision |
| Program Flash Memory | 1 MB (1024 KB) dual-panel |
| SRAM | 512 KB |
| Operating Voltage | 2.2 V to 3.6 V |
| Корпус | 64-QFN (9x9 mm) |
| Число выводов | 64 |
| Temperature Grade | -40C to +125C (extended, -E suffix) |
| Ethernet | 10/100 Mbps MAC with RMII |
| USB | Hi-Speed USB 2.0 Host/Device/OTG |
| CAN | 2x CAN 2.0B |
| ADC | 12-bit, up to 45 Msps |
| Crypto Engine | AES, DES, 3DES, SHA, MD5, TRNG |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC |
| Статус RoHS | Compliant |
Конфигурация выводов PIC32MZ1024EFM064-E/MR
| Контакт 1 | RD0 — General purpose I/O / IC1 fault input |
| Контакт 2 | RD1 — General purpose I/O |
| Контакт 3 | RD2 — General purpose I/O |
| Контакт 4 | RD3 — General purpose I/O |
| Контакт 5 | RD4 — General purpose I/O |
| Контакт 6 | RD5 — General purpose I/O |
| Контакт 7 | RD6 — General purpose I/O |
| Контакт 8 | RD7 — General purpose I/O |
| Контакт 9 | RC1 — General purpose I/O / UART1 TX |
| Контакт 10 | RC2 — General purpose I/O / UART1 RX |
| Контакт 11 | RC3 — General purpose I/O / SPI1 clock |
| Контакт 12 | RC4 — General purpose I/O / SPI1 data out |
| Контакт 13 | VDD — Digital supply voltage |
| Контакт 14 | VSS — Digital ground |
| Контакт 15 | RB0 — General purpose I/O / programming |
| Контакт 16 | RB1 — General purpose I/O |
| Контакт 17 | RB2 — General purpose I/O |
| Контакт 18 | RB3 — General purpose I/O |
| Контакт 19 | RB4 — General purpose I/O |
| Контакт 20 | RB5 — General purpose I/O |
| Контакт 21 | RB6 — General purpose I/O / IC2 clock |
| Контакт 22 | RB7 — General purpose I/O / IC2 data |
| Контакт 23 | RB8 — General purpose I/O |
| Контакт 24 | RB9 — General purpose I/O |
| Контакт 25 | RB10 — General purpose I/O |
| Контакт 26 | RB11 — General purpose I/O |
| Контакт 27 | RB12 — General purpose I/O |
| Контакт 28 | RB13 — General purpose I/O |
| Контакт 29 | RB14 — General purpose I/O |
| Контакт 30 | RB15 — General purpose I/O |
| Контакт 31 | RF0 — General purpose I/O |
| Контакт 32 | RF1 — General purpose I/O |
| Контакт 33 | VDD — Digital supply voltage |
| Контакт 34 | VSS — Digital ground |
| Контакт 35 | RF2 — General purpose I/O |
| Контакт 36 | RF3 — General purpose I/O |
| Контакт 37 | RF4 — General purpose I/O / USB VBUS detect |
| Контакт 38 | RF5 — General purpose I/O / USB ID |
| Контакт 39 | RF6 — General purpose I/O |
| Контакт 40 | RF7 — General purpose I/O |
| Контакт 41 | RG0 — General purpose I/O |
| Контакт 42 | RG1 — General purpose I/O |
| Контакт 43 | RG2 — General purpose I/O |
| Контакт 44 | RG3 — General purpose I/O |
| Контакт 45 | RA0 — General purpose I/O / AN0 |
| Контакт 46 | RA1 — General purpose I/O / AN1 |
| Контакт 47 | RA2 — General purpose I/O / AN2 |
| Контакт 48 | RA3 — General purpose I/O / AN3 |
| Контакт 49 | RA4 — General purpose I/O / AN4 |
| Контакт 50 | RA5 — General purpose I/O / AN5 |
| Контакт 51 | RA6 — General purpose I/O / AN6 |
| Контакт 52 | RA7 — General purpose I/O / AN7 |
| Контакт 53 | RA8 — General purpose I/O / AN8 |
| Контакт 54 | RA9 — General purpose I/O / AN9 |
| Контакт 55 | RA10 — General purpose I/O / AN10 |
| Контакт 56 | RA11 — General purpose I/O / AN11 |
| Контакт 57 | RA12 — General purpose I/O |
| Контакт 58 | RA13 — General purpose I/O |
| Контакт 59 | RA14 — General purpose I/O |
| Контакт 60 | RA15 — General purpose I/O |
| Контакт 61 | RE0 — General purpose I/O / PWM output |
| Контакт 62 | RE1 — General purpose I/O / PWM output |
| Контакт 63 | RE2 — General purpose I/O |
| Контакт 64 | RE3 — General purpose I/O |
| Контакт 65 | EP — Exposed thermal pad - connect to VSS/GND |
Типичное применение
PIC32MZ1024EFM064-E/MR подходит для 6 применениеs: Industrial IoT Gateway, Automotive Infotainment HMI, Graphics Terminal / HMI Display, Motor Control Drive, Secure Connected Device, Audio Processing / USB Audio.
Industrial IoT Gateway
The PIC32MZ1024EFM064-E/MR is well suited for industrial IoT gateway designs where local protocol translation, edge analytics, and secure cloud uplink are required. The integrated 10/100 Ethernet MAC, HS USB 2.0, and dual CAN 2.0B controllers handle multiple fieldbuses simultaneously, while the 512 KB SRAM can host embedded TLS/DTLS stacks plus MQTT or CoAP client buffers without external memory. The hardware crypto engine with AES and TRNG supports TLS 1.3 handshakes at line speed, reducing CPU load. With its -40C to +125C operating range, the device tolerates factory-floor cabinet temperatures and supports a 200 MHz MIPS32 M-class core running edge inference tasks or lightweight JSON parsing on incoming sensor data.
Рекомендуется
Automotive Infotainment HMI
The PIC32MZ1024EFM064-E/MR fits automotive HMI and secondary infotainment applications where its 200 MHz core, hardware FPU, and 1 MB Flash are sufficient to drive TFT displays and audio playback. The dual-panel Flash architecture enables OTA-style firmware updates without interrupting the user experience - critical for in-vehicle systems that cannot be rebooted during driving. The integrated audio interfaces (I2S) interface directly to external DACs, while the 12-bit ADC at 45 Msps supports touch-screen sensing or audio input monitoring. The -40C to +125C grade meets automotive AEC-Q100 temperature requirements for cabin and under-hood zones.
Рекомендуется
Graphics Terminal / HMI Display
For HMI terminals and industrial operator panels, the PIC32MZ1024EFM064-E/MR provides sufficient MIPS to render graphics objects at responsive frame rates. The 512 KB SRAM can host small framebuffers for QVGA displays, while the FPU accelerates floating-point math used in touch gesture recognition and 2D transformations. The hardware crypto engine secures remote management sessions to the HMI over Ethernet. Multiple SPI/I2S ports drive TFT displays and audio codecs in parallel without external bus multiplexers, simplifying BOM and PCB layout.
Рекомендуется
Motor Control Drive
The PIC32MZ1024EFM064-E/MR supports BLDC and PMSM motor control algorithms using its 200 MHz core, hardware FPU, and four 64-bit DSP accumulators with single-cycle MAC. The PWM peripheral with complementary outputs and dead-time insertion drives three-phase inverter bridges directly, while the 45 Msps 12-bit ADC samples motor currents with sub-microsecond latency for field-oriented control (FOC) loops. The dual CAN interfaces handle CANopen or CiA 402 communication with industrial drives. Industrial temperature operation (-40C to +125C) suits motor drive bays and CNC machinery environments.
Рекомендуется
Secure Connected Device
The integrated hardware crypto engine on the PIC32MZ1024EFM064-E/MR accelerates AES-256, SHA-256, and TRNG-based key generation, making the part suitable for secure connected devices requiring TLS 1.3, secure boot, and signed firmware updates. The 1 MB dual-panel Flash supports A/B firmware partitions for failsafe OTA updates. Secure debug lock bits and a true random number generator meet common IoT security certification requirements. The 200 MHz MIPS core handles the cryptographic handshake work without offloading to external secure elements, reducing BOM cost and PCB area.
Рекомендуется
Audio Processing / USB Audio
The PIC32MZ1024EFM064-E/MR supports USB audio class 2.0 device implementations, with the HS USB 2.0 controller handling 480 Mbps streaming and the I2S interfaces connecting to external audio DACs and ADCs. The 200 MHz core plus FPU runs DSP audio processing algorithms (EQ, dynamics, mixing) in real time at low latency. The 512 KB SRAM accommodates multi-channel audio buffers without external memory. Industrial temperature grade makes the part suitable for professional audio equipment and installed sound systems operating in uncontrolled thermal environments.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для PIC32MZ1024EFM064-E/MR — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | PIC32MZ1024EFH064-E/MR | PIC32MZ1024EFG064-I/MR | PIC32MZ1024EFE064-E/MR | PIC32MZ1024EFF064-I/MR | PIC32MZ1024EFK064-E/MR | PIC32MZ1024ECG064-I/MR |
|---|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 256 KB | 256 KB | 512 KB | 256 KB |
| Temperature Grade | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (K) | -40C to +85C (I) |
| Core Architecture | MIPS32 M-class | MIPS32 M-class | MIPS32 M-class | MIPS32 M-class | MIPS32 M-class | MIPS32 M-class | MIPS32 M-class |
| Max CPU Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Crypto Engine | Yes (AES/SHA/TRNG) | Yes | Yes | Yes | Yes | Yes | Limited |
| Unit Price (qty 1) | $18.84 | $19.50 (approx) | $17.80 (approx) | $16.40 (approx) | $15.90 (approx) | $17.20 (approx) | $14.50 (approx) |
Ключевые отличия
- Highest SRAM in the 64-QFN EF family tier (против PIC32MZ1024EFE064-E/MR)
- Extended temperature grade for harsh environments (против PIC32MZ1024EFG064-I/MR)
- 45 Msps 12-bit ADC versus 18 Msps on H variant (против PIC32MZ1024EFH064-E/MR)
Заметки по проектированию
The 64-QFN exposed thermal pad must be soldered to a continuous ground copper pour with at least 16 thermal vias to a bottom-layer ground plane. Without this, junction-to-ambient thermal resistance (theta_JA) rises above 30 C/W, limiting the part to <2W dissipation in still air. For applications running at 200 MHz with high I/O toggling (USB, Ethernet), add a top-layer copper pour connected to the EP to spread heat.
Place one 100 nF X7R 0402 ceramic bypass capacitor within 2 mm of each VDD pin, plus a single 10 uF bulk capacitor on the VDD rail. The PIC32MZ EF core has separate VCAP pins that require their own 10 uF ceramic capacitors per the datasheet voltage regulator section. Failure to follow the VCAP capacitor specification can cause core instability at high clock rates. Use separate analog AVDD/AVSS pins with their own ferrite-bead filtered supply to minimize ADC noise pickup.
Route the 50 MHz RMII Ethernet signals (and the 25 MHz reference clock) as length-matched differential pairs within 50 mils of length match. Keep RMII traces away from switching regulator and PWM outputs to avoid coupling noise into the Ethernet PHY. The HS USB D+/D- traces require 90 ohm differential impedance with no stubs; route over a continuous ground plane and avoid crossing other signal layers.
Do not leave unused I/O pins floating - configure them as outputs or enable internal pull-downs in firmware. Floating inputs can cause excessive Icc current and erratic behavior during reset. The dual-panel Flash LiveUpdate feature requires explicit configuration of the NVM panel swap sequence; attempting to update firmware without following the LiveUpdate procedure can brick the part. Refer to section 5 of the PIC32M Family Reference Manual for the correct sequence.
The PIC32MZ EF's HS USB 2.0 interface requires series ferrite beads on VBUS if the design powers the device from USB rather than a local regulator. The Ethernet RMII interface should be AC-coupled if connecting to a PHY that expects center-tap isolation. The 12-bit ADC at 45 Msps can alias high-frequency noise on analog inputs; place an RC anti-aliasing filter (typically 100 ohm + 100 pF) on each analog pin feeding the ADC.
Информация о соответствии
Extended -E grade operates -40C to +125C but is not formally AEC-Q100 qualified; for AEC-Q100 automotive applications, consult Microchip for the PIC32MZ EF automotive-grade part numbers separately.
