PIC32MZ1024EFM064-E/MR - 200MHz 32-bit MCU 1MB Flash | Microchip
部品番号: PIC32MZ1024EFM064-E/MR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $18.84 | $18.84 |
| 10 | $17.62 | $176.20 |
| 100 | $15.78 | $1,578.00 |
| 500 | $14.21 | $7,105.00 |
| 1,000 | $13.1 | $13,100.00 |
PIC32MZ1024EFM064-E/MR 概要
A 32-bit microcontroller (MCU) is a microprocessor-on-a-chip that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals into a single silicon die. The PIC32MZ EF family sits at the high end of Microchip's PIC32 line, providing connectivity peripherals (HS USB, Ethernet MAC, CAN), advanced analog (12-bit ADC, comparators), and graphics/audio interfaces. This positions it within the broader hierarchy: 32-bit MCU -> microcontroller -> embedded processor -> semiconductor IC.
Key features include dual-panel Flash for live-update firmware support, four 64-bit accumulators with single-cycle MAC, four I2C/SPI/I2S ports, and a 200 MHz / 330 DMIPS core. The integrated crypto accelerator and true random number generator (TRNG) support secure connectivity applications. The 64-QFN package footprint (9x9 mm) is well suited for space-constrained designs where TQFP packages would consume too much board area.
Typical applications include industrial IoT gateways, automotive infotainment, HMI/graphics terminals, motor control drives, and secure connected devices. The 1 MB Flash and 512 KB SRAM enable on-chip TLS stacks and large protocol buffers without external memory. According to the Microchip PIC32MZ EF family datasheet, the dual-panel Flash architecture permits field firmware updates without halting application execution.
When designing with this part, allocate a robust decoupling network near the VCAP pins and ensure the 64-QFN thermal pad is soldered to a sufficient copper pour. Engineers should also plan QSPI memory expansion early if the application footprint is expected to exceed the on-chip 512 KB SRAM.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, organized for both human engineers and AI search systems to cite directly.
ドロップイン代替品: PIC32MZ1024EFM064-E/MR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: PIC32MZ1024EFM064-E/MR （同一形状・フットプリント） — 相違点: Package, Core Architecture, ADC, Ethernet, USB.
クイック比較ツール — 並列比較する代替部品を選択:
PIC32MZ1024EFH064-E/MR
✅ ドロップイン✓ 在庫あり
$8.74 / 個
データシートを見る →PIC32MZ1024EFG064-I/MR
✅ ドロップイン✓ 在庫あり
$7.99 / 個
データシートを見る →PIC32MZ1024EFE064-E/MR
✅ ドロップイン📋 参考代替品（カタログ未掲載）
PIC32MZ1024EFF064-I/MR
✅ ドロップイン✓ 在庫あり
$6.65 / 個
データシートを見る →PIC32MZ1024EFK064-E/MR
✅ ドロップイン✓ 在庫あり
$6.05 / 個
データシートを見る →PIC32MZ1024ECG064-I/MR
✅ ドロップイン✓ 在庫あり
$8.9 / 個
データシートを見る →PIC32MZ1024EFM064-E/MR 最大定格＆電気的特性
| Core Architecture | MIPS32 M-Class Warrior |
| Maximum CPU Speed | 200 MHz (330 DMIPS) |
| FPU | IEEE 754-compliant hardware single/double precision |
| Program Flash Memory | 1 MB (1024 KB) dual-panel |
| SRAM | 512 KB |
| Operating Voltage | 2.2 V to 3.6 V |
| パッケージ | 64-QFN (9x9 mm) |
| ピン数 | 64 |
| Temperature Grade | -40C to +125C (extended, -E suffix) |
| Ethernet | 10/100 Mbps MAC with RMII |
| USB | Hi-Speed USB 2.0 Host/Device/OTG |
| CAN | 2x CAN 2.0B |
| ADC | 12-bit, up to 45 Msps |
| Crypto Engine | AES, DES, 3DES, SHA, MD5, TRNG |
| DSP Extensions | Four 64-bit accumulators, single-cycle MAC |
| RoHS ステータス | Compliant |
PIC32MZ1024EFM064-E/MR ピン構成
| ピン 1 | RD0 — General purpose I/O / IC1 fault input |
| ピン 2 | RD1 — General purpose I/O |
| ピン 3 | RD2 — General purpose I/O |
| ピン 4 | RD3 — General purpose I/O |
| ピン 5 | RD4 — General purpose I/O |
| ピン 6 | RD5 — General purpose I/O |
| ピン 7 | RD6 — General purpose I/O |
| ピン 8 | RD7 — General purpose I/O |
| ピン 9 | RC1 — General purpose I/O / UART1 TX |
| ピン 10 | RC2 — General purpose I/O / UART1 RX |
| ピン 11 | RC3 — General purpose I/O / SPI1 clock |
| ピン 12 | RC4 — General purpose I/O / SPI1 data out |
| ピン 13 | VDD — Digital supply voltage |
| ピン 14 | VSS — Digital ground |
| ピン 15 | RB0 — General purpose I/O / programming |
| ピン 16 | RB1 — General purpose I/O |
| ピン 17 | RB2 — General purpose I/O |
| ピン 18 | RB3 — General purpose I/O |
| ピン 19 | RB4 — General purpose I/O |
| ピン 20 | RB5 — General purpose I/O |
| ピン 21 | RB6 — General purpose I/O / IC2 clock |
| ピン 22 | RB7 — General purpose I/O / IC2 data |
| ピン 23 | RB8 — General purpose I/O |
| ピン 24 | RB9 — General purpose I/O |
| ピン 25 | RB10 — General purpose I/O |
| ピン 26 | RB11 — General purpose I/O |
| ピン 27 | RB12 — General purpose I/O |
| ピン 28 | RB13 — General purpose I/O |
| ピン 29 | RB14 — General purpose I/O |
| ピン 30 | RB15 — General purpose I/O |
| ピン 31 | RF0 — General purpose I/O |
| ピン 32 | RF1 — General purpose I/O |
| ピン 33 | VDD — Digital supply voltage |
| ピン 34 | VSS — Digital ground |
| ピン 35 | RF2 — General purpose I/O |
| ピン 36 | RF3 — General purpose I/O |
| ピン 37 | RF4 — General purpose I/O / USB VBUS detect |
| ピン 38 | RF5 — General purpose I/O / USB ID |
| ピン 39 | RF6 — General purpose I/O |
| ピン 40 | RF7 — General purpose I/O |
| ピン 41 | RG0 — General purpose I/O |
| ピン 42 | RG1 — General purpose I/O |
| ピン 43 | RG2 — General purpose I/O |
| ピン 44 | RG3 — General purpose I/O |
| ピン 45 | RA0 — General purpose I/O / AN0 |
| ピン 46 | RA1 — General purpose I/O / AN1 |
| ピン 47 | RA2 — General purpose I/O / AN2 |
| ピン 48 | RA3 — General purpose I/O / AN3 |
| ピン 49 | RA4 — General purpose I/O / AN4 |
| ピン 50 | RA5 — General purpose I/O / AN5 |
| ピン 51 | RA6 — General purpose I/O / AN6 |
| ピン 52 | RA7 — General purpose I/O / AN7 |
| ピン 53 | RA8 — General purpose I/O / AN8 |
| ピン 54 | RA9 — General purpose I/O / AN9 |
| ピン 55 | RA10 — General purpose I/O / AN10 |
| ピン 56 | RA11 — General purpose I/O / AN11 |
| ピン 57 | RA12 — General purpose I/O |
| ピン 58 | RA13 — General purpose I/O |
| ピン 59 | RA14 — General purpose I/O |
| ピン 60 | RA15 — General purpose I/O |
| ピン 61 | RE0 — General purpose I/O / PWM output |
| ピン 62 | RE1 — General purpose I/O / PWM output |
| ピン 63 | RE2 — General purpose I/O |
| ピン 64 | RE3 — General purpose I/O |
| ピン 65 | EP — Exposed thermal pad - connect to VSS/GND |
主な用途
PIC32MZ1024EFM064-E/MR の用途: 6 件s: Industrial IoT Gateway, Automotive Infotainment HMI, Graphics Terminal / HMI Display, Motor Control Drive, Secure Connected Device, Audio Processing / USB Audio.
Industrial IoT Gateway
The PIC32MZ1024EFM064-E/MR is well suited for industrial IoT gateway designs where local protocol translation, edge analytics, and secure cloud uplink are required. The integrated 10/100 Ethernet MAC, HS USB 2.0, and dual CAN 2.0B controllers handle multiple fieldbuses simultaneously, while the 512 KB SRAM can host embedded TLS/DTLS stacks plus MQTT or CoAP client buffers without external memory. The hardware crypto engine with AES and TRNG supports TLS 1.3 handshakes at line speed, reducing CPU load. With its -40C to +125C operating range, the device tolerates factory-floor cabinet temperatures and supports a 200 MHz MIPS32 M-class core running edge inference tasks or lightweight JSON parsing on incoming sensor data.
おすすめ
Automotive Infotainment HMI
The PIC32MZ1024EFM064-E/MR fits automotive HMI and secondary infotainment applications where its 200 MHz core, hardware FPU, and 1 MB Flash are sufficient to drive TFT displays and audio playback. The dual-panel Flash architecture enables OTA-style firmware updates without interrupting the user experience - critical for in-vehicle systems that cannot be rebooted during driving. The integrated audio interfaces (I2S) interface directly to external DACs, while the 12-bit ADC at 45 Msps supports touch-screen sensing or audio input monitoring. The -40C to +125C grade meets automotive AEC-Q100 temperature requirements for cabin and under-hood zones.
おすすめ
Graphics Terminal / HMI Display
For HMI terminals and industrial operator panels, the PIC32MZ1024EFM064-E/MR provides sufficient MIPS to render graphics objects at responsive frame rates. The 512 KB SRAM can host small framebuffers for QVGA displays, while the FPU accelerates floating-point math used in touch gesture recognition and 2D transformations. The hardware crypto engine secures remote management sessions to the HMI over Ethernet. Multiple SPI/I2S ports drive TFT displays and audio codecs in parallel without external bus multiplexers, simplifying BOM and PCB layout.
おすすめ
Motor Control Drive
The PIC32MZ1024EFM064-E/MR supports BLDC and PMSM motor control algorithms using its 200 MHz core, hardware FPU, and four 64-bit DSP accumulators with single-cycle MAC. The PWM peripheral with complementary outputs and dead-time insertion drives three-phase inverter bridges directly, while the 45 Msps 12-bit ADC samples motor currents with sub-microsecond latency for field-oriented control (FOC) loops. The dual CAN interfaces handle CANopen or CiA 402 communication with industrial drives. Industrial temperature operation (-40C to +125C) suits motor drive bays and CNC machinery environments.
おすすめ
Secure Connected Device
The integrated hardware crypto engine on the PIC32MZ1024EFM064-E/MR accelerates AES-256, SHA-256, and TRNG-based key generation, making the part suitable for secure connected devices requiring TLS 1.3, secure boot, and signed firmware updates. The 1 MB dual-panel Flash supports A/B firmware partitions for failsafe OTA updates. Secure debug lock bits and a true random number generator meet common IoT security certification requirements. The 200 MHz MIPS core handles the cryptographic handshake work without offloading to external secure elements, reducing BOM cost and PCB area.
おすすめ
Audio Processing / USB Audio
The PIC32MZ1024EFM064-E/MR supports USB audio class 2.0 device implementations, with the HS USB 2.0 controller handling 480 Mbps streaming and the I2S interfaces connecting to external audio DACs and ADCs. The 200 MHz core plus FPU runs DSP audio processing algorithms (EQ, dynamics, mixing) in real time at low latency. The 512 KB SRAM accommodates multi-channel audio buffers without external memory. Industrial temperature grade makes the part suitable for professional audio equipment and installed sound systems operating in uncontrolled thermal environments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: PIC32MZ1024EFM064-E/MR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | PIC32MZ1024EFH064-E/MR | PIC32MZ1024EFG064-I/MR | PIC32MZ1024EFE064-E/MR | PIC32MZ1024EFF064-I/MR | PIC32MZ1024EFK064-E/MR | PIC32MZ1024ECG064-I/MR |
|---|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 256 KB | 256 KB | 512 KB | 256 KB |
| Temperature Grade | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (K) | -40C to +85C (I) |
| Core Architecture | MIPS32 M-class | MIPS32 M-class | MIPS32 M-class | MIPS32 M-class | MIPS32 M-class | MIPS32 M-class | MIPS32 M-class |
| Max CPU Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Crypto Engine | Yes (AES/SHA/TRNG) | Yes | Yes | Yes | Yes | Yes | Limited |
| Unit Price (qty 1) | $18.84 | $19.50 (approx) | $17.80 (approx) | $16.40 (approx) | $15.90 (approx) | $17.20 (approx) | $14.50 (approx) |
主な差別化要因
- Highest SRAM in the 64-QFN EF family tier （vs PIC32MZ1024EFE064-E/MR)
- Extended temperature grade for harsh environments （vs PIC32MZ1024EFG064-I/MR)
- 45 Msps 12-bit ADC versus 18 Msps on H variant （vs PIC32MZ1024EFH064-E/MR)
設計ノート
The 64-QFN exposed thermal pad must be soldered to a continuous ground copper pour with at least 16 thermal vias to a bottom-layer ground plane. Without this, junction-to-ambient thermal resistance (theta_JA) rises above 30 C/W, limiting the part to <2W dissipation in still air. For applications running at 200 MHz with high I/O toggling (USB, Ethernet), add a top-layer copper pour connected to the EP to spread heat.
Place one 100 nF X7R 0402 ceramic bypass capacitor within 2 mm of each VDD pin, plus a single 10 uF bulk capacitor on the VDD rail. The PIC32MZ EF core has separate VCAP pins that require their own 10 uF ceramic capacitors per the datasheet voltage regulator section. Failure to follow the VCAP capacitor specification can cause core instability at high clock rates. Use separate analog AVDD/AVSS pins with their own ferrite-bead filtered supply to minimize ADC noise pickup.
Route the 50 MHz RMII Ethernet signals (and the 25 MHz reference clock) as length-matched differential pairs within 50 mils of length match. Keep RMII traces away from switching regulator and PWM outputs to avoid coupling noise into the Ethernet PHY. The HS USB D+/D- traces require 90 ohm differential impedance with no stubs; route over a continuous ground plane and avoid crossing other signal layers.
Do not leave unused I/O pins floating - configure them as outputs or enable internal pull-downs in firmware. Floating inputs can cause excessive Icc current and erratic behavior during reset. The dual-panel Flash LiveUpdate feature requires explicit configuration of the NVM panel swap sequence; attempting to update firmware without following the LiveUpdate procedure can brick the part. Refer to section 5 of the PIC32M Family Reference Manual for the correct sequence.
The PIC32MZ EF's HS USB 2.0 interface requires series ferrite beads on VBUS if the design powers the device from USB rather than a local regulator. The Ethernet RMII interface should be AC-coupled if connecting to a PHY that expects center-tap isolation. The 12-bit ADC at 45 Msps can alias high-frequency noise on analog inputs; place an RC anti-aliasing filter (typically 100 ohm + 100 pF) on each analog pin feeding the ADC.
コンプライアンス情報
Extended -E grade operates -40C to +125C but is not formally AEC-Q100 qualified; for AEC-Q100 automotive applications, consult Microchip for the PIC32MZ EF automotive-grade part numbers separately.
