R7F7016903AFP-C - 32-Bit MCU 120MHz 1MB Flash | Renesas
Артикул: R7F7016903AFP-C ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $16.86 | $16,86 |
| 10 | $15.5 | $155,00 |
| 100 | $14.2 | $1.420,00 |
| 500 | $13 | $6.500,00 |
| 1.000 | $12 | $12.000,00 |
R7F7016903AFP-C Обзор
A microcontroller (MCU) is a compact integrated circuit designed to govern a specific operation in an embedded system. It contains a processor core, memory (flash and RAM), and programmable input/output peripherals. In the automotive domain, MCUs like the RH850/F1KM-S1 series are essential for body control modules, gateway modules, and motor control, providing real-time control and communication capabilities. The RH850/F1x series is a family of 32-bit automotive microcontrollers from Renesas, known for their high reliability and functional safety features.
Key features of the R7F7016903AFP-C include a 120 MHz RH850G3KH core, 1MB flash memory, and a 64-pin LFQFP package. It supports a wide operating temperature range of -40°C to +125°C, making it suitable for harsh automotive environments. The device is AEC-Q100 qualified, ensuring compliance with automotive quality standards. It also includes a variety of communication interfaces such as CAN, LIN, and SPI, enabling seamless integration into vehicle networks.
Technically, the RH850/F1KM-S1 series is built on Renesas' advanced 40nm process technology, offering a balance of performance and power efficiency. The MCU features a floating-point unit (FPU) for enhanced mathematical processing, and a memory protection unit (MPU) for safety-critical applications. It also supports on-chip debugging and flash programming, facilitating development and field updates.
Typical applications include automotive body control modules (BCM), central gateway modules, and motor control for power windows, seats, and mirrors. The MCU's robust communication interfaces and low power consumption make it ideal for always-on systems in vehicles.
When designing with this MCU, ensure proper decoupling of power supply pins and consider thermal management for high-temperature environments. The 64-LFQFP package requires careful PCB layout to minimize noise and ensure reliable operation.
Аналоги без доработки для R7F7016903AFP-C — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
R7F7016903AFP-C#AA1
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
R7F7016903AFP-C#KA1
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
R7F7016903AFP-C#AA1
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
R7F7016903AFP-C#KA1
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
R7F7016903AFP-C#AA1
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
R7F7016903AFP-C Максимальные параметры и электрические характеристики
| Core Processor | RH850G3KH |
| Core Size | 32-Bit |
| Speed | 120MHz |
| Program Memory Size | 1MB (1M x 8) |
| Program Memory Type | FLASH |
| Корпус / Типоразмер | 64-LFQFP (10x10) |
| Тип монтажа | Surface Mount |
| Рабочая температура | -40°C to +125°C |
| Connectivity | CAN, LIN, SPI |
| AEC-Q100 Qualified | Yes |
| Статус RoHS | Compliant |
| Series | RH850/F1KM-S1 |
Конфигурация выводов R7F7016903AFP-C
| Контакт 1 | VCC — Power supply |
| Контакт 2 | GND — Ground |
| Контакт 3 | P00 — General purpose I/O |
| Контакт 4 | P01 — General purpose I/O |
| Контакт 5 | P02 — General purpose I/O |
| Контакт 6 | P03 — General purpose I/O |
| Контакт 7 | P04 — General purpose I/O |
| Контакт 8 | P05 — General purpose I/O |
| Контакт 9 | P06 — General purpose I/O |
| Контакт 10 | P07 — General purpose I/O |
| Контакт 11 | P10 — General purpose I/O |
| Контакт 12 | P11 — General purpose I/O |
Типичное применение
R7F7016903AFP-C подходит для 6 применениеs: Automotive Body Control Module, Central Gateway Module, Motor Control for Power Windows, Lighting Control System, Seat Control Module, HVAC Control Unit.
Automotive Body Control Module
The R7F7016903AFP-C is ideal for body control modules (BCM) in vehicles. Its 120MHz RH850G3KH core and 1MB flash provide ample processing power for managing lighting, wipers, and door locks. The CAN and LIN interfaces enable seamless communication with other ECUs. With AEC-Q100 qualification and -40°C to +125°C operation, it meets automotive reliability standards. The 64-LFQFP package fits compact PCB designs, and low power consumption supports always-on operation.
Рекомендуется
Central Gateway Module
In central gateway modules, the R7F7016903AFP-C handles routing of messages between different vehicle networks. Its multiple CAN and LIN interfaces allow it to bridge body, chassis, and infotainment domains. The 120MHz core ensures low-latency message forwarding, while 1MB flash stores routing tables and diagnostic data. The MCU's robust communication peripherals and automotive-grade reliability make it a trusted choice for gateway applications.
Рекомендуется
Motor Control for Power Windows
The R7F7016903AFP-C is well-suited for motor control in power window systems. Its high-speed 120MHz core enables precise PWM generation and real-time current sensing. The MCU's built-in timers and ADC channels support closed-loop control, while CAN/LIN interfaces allow integration with body control modules. The wide temperature range and AEC-Q100 qualification ensure reliable operation in extreme automotive conditions.
Рекомендуется
Lighting Control System
For automotive lighting control, the R7F7016903AFP-C provides the processing power to manage LED drivers and communication with body control modules. Its CAN and LIN interfaces enable dimming commands and fault reporting. The MCU's low power consumption is beneficial for always-on lighting systems. With 1MB flash, it can store complex lighting algorithms and calibration data. The 64-pin package is compact enough for headlamp and taillight modules.
Рекомендуется
Seat Control Module
The R7F7016903AFP-C is ideal for seat control modules, managing motorized adjustments for position, lumbar, and heating. Its 120MHz core handles multiple PWM outputs and sensor inputs simultaneously. The MCU's CAN interface allows integration with the vehicle's body network for memory seat functions. The wide operating temperature range and AEC-Q100 qualification ensure durability in automotive environments.
Рекомендуется
HVAC Control Unit
In HVAC control units, the R7F7016903AFP-C manages blower motors, temperature sensors, and user interfaces. Its 120MHz core provides fast response to user inputs and sensor readings. The MCU's LIN interface is commonly used for communication with other HVAC components. With 1MB flash, it can store complex control algorithms and diagnostic routines. The 64-LFQFP package is suitable for dashboard-mounted control modules.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для R7F7016903AFP-C — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | R7F7016903AFP-C#AA1 | R7F7016903AFP-C#KA1 |
|---|---|---|---|
| Package | 64-LFQFP (10x10) | 64-LFQFP (10x10) - same | 64-LFQFP (10x10) - same |
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Core Speed | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB |
| Operating Temperature | -40°C to +125°C | -40°C to +125°C | -40°C to +125°C |
| AEC-Q100 | Qualified | Qualified | Qualified |
| Connectivity | CAN, LIN, SPI | CAN, LIN, SPI | CAN, LIN, SPI |
| Packaging | Tray | Tray | Tape & Reel |
Ключевые отличия
- 120MHz RH850G3KH core with 1MB flash (против R7F7016903AFP-C#AA1)
- AEC-Q100 qualified for automotive (против R7F7016903AFP-C#KA1)
- 64-pin LFQFP package (против R7F7016903AFP-C#AA1)
Заметки по проектированию
Ensure stable power supply decoupling with 100nF capacitors close to each VCC pin and a 10uF bulk capacitor. The MCU operates at 120MHz, so proper decoupling is critical to prevent noise-induced errors. Refer to the RH850/F1KM-S1 hardware manual for recommended power supply circuits.
The 64-LFQFP package has a thermal resistance that requires adequate PCB copper for heat dissipation. In automotive environments with ambient temperatures up to 125°C, ensure the junction temperature stays within limits by using thermal vias and a ground plane. Consider airflow or heatsinking for high-power applications.
For the 64-LFQFP package, use a 0.5mm pitch land pattern. Route high-speed signals away from the crystal oscillator and analog pins. Follow Renesas' layout guidelines to minimize EMI and ensure signal integrity. Place the crystal close to the MCU with short traces.
Информация о соответствии
AEC-Q100 qualified per Renesas product page. RoHS compliant per distributor listings.
