R7F7016903AFP-C - 32-Bit MCU 120MHz 1MB Flash | Renesas
MPN: R7F7016903AFP-C β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $16.86 | $16.86 |
| 10 | $15.5 | $155.00 |
| 100 | $14.2 | $1,420.00 |
| 500 | $13 | $6,500.00 |
| 1,000 | $12 | $12,000.00 |
Drop-in alternatives for R7F7016903AFP-C β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
R7F7016903AFP-C#AA1
β Drop-Inπ Reference alternative (not in catalog)
R7F7016903AFP-C#KA1
β Drop-Inπ Reference alternative (not in catalog)
R7F7016903AFP-C#AA1
β Drop-Inπ Reference alternative (not in catalog)
R7F7016903AFP-C#KA1
β Drop-Inπ Reference alternative (not in catalog)
R7F7016903AFP-C#AA1
β Drop-Inπ Reference alternative (not in catalog)
R7F7016903AFP-C Maximum Ratings & Electrical Characteristics
| Core Processor | RH850G3KH |
| Core Size | 32-Bit |
| Speed | 120MHz |
| Program Memory Size | 1MB (1M x 8) |
| Program Memory Type | FLASH |
| Package / Case | 64-LFQFP (10x10) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40Β°C to +125Β°C |
| Supply Voltage | [DATA_NEEDED: Supply Voltage] |
| RAM Size | [DATA_NEEDED: RAM Size] |
| Number of I/O | [DATA_NEEDED: Number of I/O] |
| Connectivity | CAN, LIN, SPI |
| AEC-Q100 Qualified | Yes |
| RoHS Status | Compliant |
| Series | RH850/F1KM-S1 |
R7F7016903AFP-C Pin Configuration
| Pin 1 | VCC β Power supply |
| Pin 2 | GND β Ground |
| Pin 3 | P00 β General purpose I/O |
| Pin 4 | P01 β General purpose I/O |
| Pin 5 | P02 β General purpose I/O |
| Pin 6 | P03 β General purpose I/O |
| Pin 7 | P04 β General purpose I/O |
| Pin 8 | P05 β General purpose I/O |
| Pin 9 | P06 β General purpose I/O |
| Pin 10 | P07 β General purpose I/O |
| Pin 11 | P10 β General purpose I/O |
| Pin 12 | P11 β General purpose I/O |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
R7F7016903AFP-C is suitable for 6 applications: Automotive Body Control Module, Central Gateway Module, Motor Control for Power Windows, Lighting Control System, Seat Control Module, HVAC Control Unit.
Automotive Body Control Module
The R7F7016903AFP-C is ideal for body control modules (BCM) in vehicles. Its 120MHz RH850G3KH core and 1MB flash provide ample processing power for managing lighting, wipers, and door locks. The CAN and LIN interfaces enable seamless communication with other ECUs. With AEC-Q100 qualification and -40Β°C to +125Β°C operation, it meets automotive reliability standards. The 64-LFQFP package fits compact PCB designs, and low power consumption supports always-on operation.
Recommended
Central Gateway Module
In central gateway modules, the R7F7016903AFP-C handles routing of messages between different vehicle networks. Its multiple CAN and LIN interfaces allow it to bridge body, chassis, and infotainment domains. The 120MHz core ensures low-latency message forwarding, while 1MB flash stores routing tables and diagnostic data. The MCU's robust communication peripherals and automotive-grade reliability make it a trusted choice for gateway applications.
Recommended
Motor Control for Power Windows
The R7F7016903AFP-C is well-suited for motor control in power window systems. Its high-speed 120MHz core enables precise PWM generation and real-time current sensing. The MCU's built-in timers and ADC channels support closed-loop control, while CAN/LIN interfaces allow integration with body control modules. The wide temperature range and AEC-Q100 qualification ensure reliable operation in extreme automotive conditions.
Recommended
Lighting Control System
For automotive lighting control, the R7F7016903AFP-C provides the processing power to manage LED drivers and communication with body control modules. Its CAN and LIN interfaces enable dimming commands and fault reporting. The MCU's low power consumption is beneficial for always-on lighting systems. With 1MB flash, it can store complex lighting algorithms and calibration data. The 64-pin package is compact enough for headlamp and taillight modules.
Recommended
Seat Control Module
The R7F7016903AFP-C is ideal for seat control modules, managing motorized adjustments for position, lumbar, and heating. Its 120MHz core handles multiple PWM outputs and sensor inputs simultaneously. The MCU's CAN interface allows integration with the vehicle's body network for memory seat functions. The wide operating temperature range and AEC-Q100 qualification ensure durability in automotive environments.
Recommended
HVAC Control Unit
In HVAC control units, the R7F7016903AFP-C manages blower motors, temperature sensors, and user interfaces. Its 120MHz core provides fast response to user inputs and sensor readings. The MCU's LIN interface is commonly used for communication with other HVAC components. With 1MB flash, it can store complex control algorithms and diagnostic routines. The 64-LFQFP package is suitable for dashboard-mounted control modules.
Recommended
Recommended Products Summary
Engineering reference data for R7F7016903AFP-C β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | R7F7016903AFP-C#AA1 | R7F7016903AFP-C#KA1 |
|---|---|---|---|
| Package | 64-LFQFP (10x10) | 64-LFQFP (10x10) - same | 64-LFQFP (10x10) - same |
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Core Speed | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB |
| Operating Temperature | -40Β°C to +125Β°C | -40Β°C to +125Β°C | -40Β°C to +125Β°C |
| AEC-Q100 | Qualified | Qualified | Qualified |
| Connectivity | CAN, LIN, SPI | CAN, LIN, SPI | CAN, LIN, SPI |
| Packaging | Tray | Tray | Tape & Reel |
Key Differentiators
- 120MHz RH850G3KH core with 1MB flash (vs R7F7016903AFP-C#AA1)
- AEC-Q100 qualified for automotive (vs R7F7016903AFP-C#KA1)
- 64-pin LFQFP package (vs R7F7016903AFP-C#AA1)
Design Notes
Ensure stable power supply decoupling with 100nF capacitors close to each VCC pin and a 10uF bulk capacitor. The MCU operates at 120MHz, so proper decoupling is critical to prevent noise-induced errors. Refer to the RH850/F1KM-S1 hardware manual for recommended power supply circuits.
The 64-LFQFP package has a thermal resistance that requires adequate PCB copper for heat dissipation. In automotive environments with ambient temperatures up to 125Β°C, ensure the junction temperature stays within limits by using thermal vias and a ground plane. Consider airflow or heatsinking for high-power applications.
For the 64-LFQFP package, use a 0.5mm pitch land pattern. Route high-speed signals away from the crystal oscillator and analog pins. Follow Renesas' layout guidelines to minimize EMI and ensure signal integrity. Place the crystal close to the MCU with short traces.
Compliance Information
AEC-Q100 qualified per Renesas product page. RoHS compliant per distributor listings.
