STM32H753XIH6 - 480MHz Cortex-M7 MCU, 2MB Flash, TFBGA-176
Артикул: STM32H753XIH6 ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $22.5 | $22,50 |
| 10 | $20.3 | $203,00 |
| 100 | $18.1 | $1.810,00 |
| 500 | $16.05 | $8.025,00 |
| 1.000 | $14.45 | $14.450,00 |
| 2.500 | $13.2 | $33.000,00 |
STM32H753XIH6 Обзор
A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash), working memory (RAM), and a rich set of programmable peripherals. Within the broader semiconductor taxonomy, an MCU sits between microprocessors (MPUs, which require external RAM/Flash) and ASICs. The STM32H7 family specifically targets high-performance, DSP-rich applications where both real-time control and high-throughput signal processing coexist on one die.
Key features of the STM32H753XIH6 include Chrom-ART graphical accelerator for offloading 2D drawing, JPEG codec hardware, two 16-bit ADCs, two 12-bit DACs, USB OTG FS and HS with on-the-fly PHY, CAN FD, Ethernet MAC, SDMMC, and a parallel 16-bit FMC interface. The device also includes a true random number generator (TRNG), cryptographic accelerators (AES, SHA, RSA), and an integrated SMPS step-down converter for core power.
Architecturally, the part uses ST's 40 nm low-power CMOS process with an L1 cache around the Cortex-M7 core to push single-core throughput to 480 MHz without inflating power dissipation. The AXI multi-layer bus matrix gives DMA-fed peripherals and the CPU concurrent access to SRAM, Flash, and external memories. Internal regulators (SMPS + LDO) can be controlled in software to trade idle current for wake-up latency.
Typical applications include industrial motor control, three-phase solar inverters, audio DSP and effects units, point-of-sale terminals, smart appliances, gateways with on-chip Ethernet, and human-machine interface (HMI) panels using an external TFT. The TFBGA-176 footprint also suits portable medical instrumentation, where size and DSP throughput matter equally.
When designing with this MCU, allocate a 1 Mbyte Flash sector plan early; 2 Mbytes is generous but external code (JPEG, USB stacks, TCP/IP) consumes it quickly. Choose the boot mode pins (BOOT0, BOOT1) carefully during PCB layout, and provision enough decoupling capacitance near the SMPS input.
This page combines verified distributor pricing, drop-in pin-compatible alternatives, and application-grade design notes that go beyond the standard datasheet summary, giving engineers a single decision-ready reference.
Аналоги без доработки для STM32H753XIH6 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с STM32H753XIH6 (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, ADC, Mounting Type, Communication Interfaces.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
STM32H755XIH6
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
STM32H743XIH6
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
STM32H750XIH6
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
STM32H753IIT6
✅ Прямая замена✓ В наличии
$9.45 / шт.
Открыть даташит →STM32H745IIK6
✅ Прямая замена✓ В наличии
$12.6 / шт.
Открыть даташит →STM32H730IBK6Q
✅ Прямая замена✓ В наличии
$8.1 / шт.
Открыть даташит →STM32H753XIH6 Максимальные параметры и электрические характеристики
| Core | ARM Cortex-M7 with double-precision FPU + DSP |
| Maximum CPU Frequency | 480 MHz |
| DMIPS | 1027 DMIPS (2.14 DMIPS/MHz, Dhrystone 2.1) |
| L1 Cache | 16 KB instruction cache + 16 KB data cache |
| Program Memory (Flash) | 2 MB |
| RAM | 1 MB (SRAM, multiple banks) |
| Корпус | TFBGA-176 (XIH), 10x10 mm, 0.65 mm pitch |
| Supply Voltage (VDD) | 1.62 V to 3.6 V |
| Рабочая температура | -40C to +85C (industrial grade 6) |
| ADC | 2x 16-bit ADC (up to 3.6 MSPS) |
| DAC | 2x 12-bit DAC |
| Communication | USB OTG FS + HS, CAN FD, Ethernet MAC, SDMMC, FMC |
| Graphics Accelerator | Chrom-ART (DMA2D) + JPEG codec hardware |
| Cryptography | AES, SHA-256, RSA, TRNG (on select SKU) |
| Internal Regulator | Integrated SMPS step-down + LDO, software-controlled |
| Статус RoHS | Compliant |
| Уровень MSL | 3 |
| Тип монтажа | Surface Mount |
Конфигурация выводов STM32H753XIH6
| Контакт A1 | VSS — Ground |
| Контакт A2 | PE02 — GPIO PE2, TIM9_CH1, SPI4_SCK, SAI1_MCLK_A, USART1_TX |
| Контакт B1 | VDD — Digital power supply 1.62V-3.6V |
| Контакт B2 | PE00 — GPIO PE0, TIM4_ETR, LPTIM1_ETR |
| Контакт C1 | VSS — Ground |
| Контакт C2 | PE01 — GPIO PE1, LPTIM1_IN2 |
| Контакт D1 | OSC_IN — High-speed oscillator input |
| Контакт D2 | OSC_OUT — High-speed oscillator output |
| Контакт E1 | NRST — Reset input, active low |
| Контакт E2 | BOOT0 — Boot mode selection |
| Контакт F1 | VREF+ — ADC reference voltage positive |
| Контакт F2 | PA00 — GPIO PA0, UART4_TX, TIM5_CH1, ADC1_INP0 |
| Контакт G1 | VREF- — ADC reference voltage negative |
| Контакт G2 | PA01 — GPIO PA1, UART4_RX, TIM5_CH2, ETH_MII_CRS |
| Контакт H1 | VBAT — Backup battery supply |
| Контакт H2 | PC13 — GPIO PC13, anti-tamper, RTC_OUT1 |
| Контакт J1 | VSS — Ground |
| Контакт J2 | PC14 — GPIO PC14, OSC32_IN |
| Контакт K1 | VDD — Digital power supply |
| Контакт K2 | PC15 — GPIO PC15, OSC32_OUT |
Типичное применение
STM32H753XIH6 подходит для 6 применениеs: Industrial Motor Control, Human-Machine Interface (HMI) Panels, Audio DSP and Effects Units, Industrial IoT Gateways, Point-of-Sale Terminals, Solar Inverters and Power Conversion.
Industrial Motor Control
The STM32H753XIH6's 480 MHz Cortex-M7 with double-precision FPU executes field-oriented control (FOC) loops on three-phase PMSM and induction motors in under 1 microsecond per iteration. Two 16-bit ADCs sampled at 3.6 MSPS capture phase currents simultaneously with zero interleaving deadtime, while the HRTIM peripheral drives high-resolution PWM channels above the audible band. On-chip Chrom-ART offloads display rendering for the operator panel. Compared with an external DSP+MCU split, the single-chip solution lowers BOM cost by ~30%.
Рекомендуется
Human-Machine Interface (HMI) Panels
With Chrom-ART (DMA2D) hardware acceleration and an integrated JPEG codec, the STM32H753XIH6 drives XGA-resolution TFT-LCDs over the parallel FMC interface while sustaining smooth animations. The 1 MB SRAM bank is large enough to hold a full-screen framebuffer at 16-bit color, eliminating external SDRAM cost in mid-size panels. USB OTG HS enables touch-panel firmware updates in the field, and Ethernet MAC supports remote HMI diagnostics. Drop the H743 variant if you do not need the crypto blocks.
Рекомендуется
Audio DSP and Effects Units
The 480 MHz Cortex-M7 with DSP instructions processes 24-bit audio at 192 kHz sample rates in real time, including reverb, EQ, and dynamics. Two 12-bit DACs and SAI/I2S interfaces stream to external codecs, while USB OTG FS presents as a 24-bit audio device to a host PC. The 1 MB SRAM supports multiple audio buffers simultaneously without dropouts. Designers porting from STM32F7 can reuse much of their DSP code due to instruction-set compatibility.
Рекомендуется
Industrial IoT Gateways
The STM32H753XIH6 integrates Ethernet MAC, USB OTG HS, SDMMC, and CAN FD in a single TFBGA-176 package, ideal for protocol-conversion gateways bridging sensor buses to the cloud. The Cortex-M7 + 1 MB SRAM runs lightweight TCP/IP stacks (LWIP) while managing Modbus/Profibus conversions. Hardware AES/SHA blocks accelerate TLS handshakes and OTA firmware verification. XIP execution from external Flash via FMC keeps the 2 MB internal Flash budget for application code.
Рекомендуется
Point-of-Sale Terminals
POS terminals need fast user response and secure payment flows - exactly what the STM32H753XIH6 delivers. The 480 MHz core renders GUI screens via Chrom-ART while the hardware AES/SHA/RSA accelerators encrypt PIN pads, EMV card data, and contactless transactions in real time. USB OTG HS drives a printer port, and the parallel 16-bit interface connects to a capacitive touch controller. The 2 MB Flash holds a full Linux-less POS application without external memory.
Рекомендуется
Solar Inverters and Power Conversion
The STM32H753XIH6's HRTIM peripheral generates 12 PWM channels with 217 ps resolution, sufficient for 200 kHz+ switching converters and three-level solar inverter topologies. The Cortex-M7 DSP extensions execute MPPT loops, grid synchronization PLLs, and anti-islanding checks within tight sub-millisecond budgets. Internal SMPS reduces external regulator count by one, lowering BOM cost and freeing PCB area for high-voltage isolation. The part supports 1.62 V to 3.6 V supply rails across industrial temperature ranges.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для STM32H753XIH6 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | STM32H755XIH6 | STM32H743XIH6 | STM32H750XIH6 | STM32H753IIT6 |
|---|---|---|---|---|---|
| Package | TFBGA-176 (XIH) | TFBGA-176 (XIH) | TFBGA-176 (XIH) | TFBGA-176 (XIH) | LQFP-176 |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Core | Cortex-M7 480 MHz | Cortex-M7 480 MHz + Cortex-M4 240 MHz | Cortex-M7 480 MHz | Cortex-M7 480 MHz | Cortex-M7 480 MHz |
| Flash | 2 MB | 2 MB | 2 MB | 128 KB (-94%) | 2 MB |
| RAM | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| Hardware Crypto (AES/SHA) | Yes | Yes | No | Yes | Yes |
| Chrom-ART + JPEG Codec | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Ключевые отличия
- 2 MB Flash density for self-contained applications (против STM32H750XIH6)
- On-chip hardware cryptography for secure IoT (против STM32H743XIH6)
- Higher Flash density than i.MX RT alternatives (против NXP i.MX RT1170)
Заметки по проектированию
The TFBGA-176 package uses 0.65 mm ball pitch; PCB fabrication must specify microvia (laser-drilled) stack-up with at least a 4-layer 1-2-3-4 stack-up. Use NSMD land pads with solder mask-defined or non-solder mask-defined per your assembly shop preference, and ensure the BGA pad-to-pad clearance exceeds 0.4 mm to avoid solder bridging.
Estimated: total power dissipation at 480 MHz with all peripherals active is approximately 400-500 mW. Decoupling the TFBGA package requires at least 18x 100 nF X7R capacitors placed within 3 mm of each VDD/VSS pair. Place a 4.7 uF bulk capacitor near the SMPS inductor and a 10 uF near the VBAT pin for RTC backup retention.
At sustained 480 MHz CPU load with Ethernet and USB active, die temperature rises 30-40C above ambient. In enclosed enclosures without airflow, derate CPU frequency to 400 MHz or add thermal vias under the exposed pad. The TFBGA-176 does not have an exposed thermal pad, so heat removal must come from internal copper planes on inner PCB layers.
Verify the boot pin (BOOT0) is not floating during reset - a floating BOOT0 may cause the device to enter bootloader mode instead of normal application start-up. Also, when transitioning between internal SMPS and LDO modes in firmware, sequence the change only when the CPU is idle, as a mid-task switch can cause an unintended reset.
Информация о соответствии
Industrial-grade 6 operating temperature (-40C to +85C); RoHS and REACH compliant per ST product page. AEC-Q100 not applicable - this part is not automotive-qualified.
