STM32H753XIH6 - 480MHz Cortex-M7 MCU, 2MB Flash, TFBGA-176
部品番号: STM32H753XIH6 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $22.5 | $22.50 |
| 10 | $20.3 | $203.00 |
| 100 | $18.1 | $1,810.00 |
| 500 | $16.05 | $8,025.00 |
| 1,000 | $14.45 | $14,450.00 |
| 2,500 | $13.2 | $33,000.00 |
STM32H753XIH6 概要
A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash), working memory (RAM), and a rich set of programmable peripherals. Within the broader semiconductor taxonomy, an MCU sits between microprocessors (MPUs, which require external RAM/Flash) and ASICs. The STM32H7 family specifically targets high-performance, DSP-rich applications where both real-time control and high-throughput signal processing coexist on one die.
Key features of the STM32H753XIH6 include Chrom-ART graphical accelerator for offloading 2D drawing, JPEG codec hardware, two 16-bit ADCs, two 12-bit DACs, USB OTG FS and HS with on-the-fly PHY, CAN FD, Ethernet MAC, SDMMC, and a parallel 16-bit FMC interface. The device also includes a true random number generator (TRNG), cryptographic accelerators (AES, SHA, RSA), and an integrated SMPS step-down converter for core power.
Architecturally, the part uses ST's 40 nm low-power CMOS process with an L1 cache around the Cortex-M7 core to push single-core throughput to 480 MHz without inflating power dissipation. The AXI multi-layer bus matrix gives DMA-fed peripherals and the CPU concurrent access to SRAM, Flash, and external memories. Internal regulators (SMPS + LDO) can be controlled in software to trade idle current for wake-up latency.
Typical applications include industrial motor control, three-phase solar inverters, audio DSP and effects units, point-of-sale terminals, smart appliances, gateways with on-chip Ethernet, and human-machine interface (HMI) panels using an external TFT. The TFBGA-176 footprint also suits portable medical instrumentation, where size and DSP throughput matter equally.
When designing with this MCU, allocate a 1 Mbyte Flash sector plan early; 2 Mbytes is generous but external code (JPEG, USB stacks, TCP/IP) consumes it quickly. Choose the boot mode pins (BOOT0, BOOT1) carefully during PCB layout, and provision enough decoupling capacitance near the SMPS input.
This page combines verified distributor pricing, drop-in pin-compatible alternatives, and application-grade design notes that go beyond the standard datasheet summary, giving engineers a single decision-ready reference.
ドロップイン代替品: STM32H753XIH6 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: STM32H753XIH6 （同一形状・フットプリント） — 相違点: Package, Operating Temperature, ADC, Mounting Type, Communication Interfaces.
クイック比較ツール — 並列比較する代替部品を選択:
STM32H755XIH6
✅ ドロップイン📋 参考代替品（カタログ未掲載）
STM32H743XIH6
✅ ドロップイン📋 参考代替品（カタログ未掲載）
STM32H750XIH6
✅ ドロップイン📋 参考代替品（カタログ未掲載）
STM32H753IIT6
✅ ドロップイン✓ 在庫あり
$9.45 / 個
データシートを見る →STM32H745IIK6
✅ ドロップイン✓ 在庫あり
$12.6 / 個
データシートを見る →STM32H730IBK6Q
✅ ドロップイン✓ 在庫あり
$8.1 / 個
データシートを見る →STM32H753XIH6 最大定格＆電気的特性
| Core | ARM Cortex-M7 with double-precision FPU + DSP |
| Maximum CPU Frequency | 480 MHz |
| DMIPS | 1027 DMIPS (2.14 DMIPS/MHz, Dhrystone 2.1) |
| L1 Cache | 16 KB instruction cache + 16 KB data cache |
| Program Memory (Flash) | 2 MB |
| RAM | 1 MB (SRAM, multiple banks) |
| パッケージ | TFBGA-176 (XIH), 10x10 mm, 0.65 mm pitch |
| Supply Voltage (VDD) | 1.62 V to 3.6 V |
| 動作温度 | -40C to +85C (industrial grade 6) |
| ADC | 2x 16-bit ADC (up to 3.6 MSPS) |
| DAC | 2x 12-bit DAC |
| Communication | USB OTG FS + HS, CAN FD, Ethernet MAC, SDMMC, FMC |
| Graphics Accelerator | Chrom-ART (DMA2D) + JPEG codec hardware |
| Cryptography | AES, SHA-256, RSA, TRNG (on select SKU) |
| Internal Regulator | Integrated SMPS step-down + LDO, software-controlled |
| RoHS ステータス | Compliant |
| MSLレベル | 3 |
| 実装タイプ | Surface Mount |
STM32H753XIH6 ピン構成
| ピン A1 | VSS — Ground |
| ピン A2 | PE02 — GPIO PE2, TIM9_CH1, SPI4_SCK, SAI1_MCLK_A, USART1_TX |
| ピン B1 | VDD — Digital power supply 1.62V-3.6V |
| ピン B2 | PE00 — GPIO PE0, TIM4_ETR, LPTIM1_ETR |
| ピン C1 | VSS — Ground |
| ピン C2 | PE01 — GPIO PE1, LPTIM1_IN2 |
| ピン D1 | OSC_IN — High-speed oscillator input |
| ピン D2 | OSC_OUT — High-speed oscillator output |
| ピン E1 | NRST — Reset input, active low |
| ピン E2 | BOOT0 — Boot mode selection |
| ピン F1 | VREF+ — ADC reference voltage positive |
| ピン F2 | PA00 — GPIO PA0, UART4_TX, TIM5_CH1, ADC1_INP0 |
| ピン G1 | VREF- — ADC reference voltage negative |
| ピン G2 | PA01 — GPIO PA1, UART4_RX, TIM5_CH2, ETH_MII_CRS |
| ピン H1 | VBAT — Backup battery supply |
| ピン H2 | PC13 — GPIO PC13, anti-tamper, RTC_OUT1 |
| ピン J1 | VSS — Ground |
| ピン J2 | PC14 — GPIO PC14, OSC32_IN |
| ピン K1 | VDD — Digital power supply |
| ピン K2 | PC15 — GPIO PC15, OSC32_OUT |
主な用途
STM32H753XIH6 の用途: 6 件s: Industrial Motor Control, Human-Machine Interface (HMI) Panels, Audio DSP and Effects Units, Industrial IoT Gateways, Point-of-Sale Terminals, Solar Inverters and Power Conversion.
Industrial Motor Control
The STM32H753XIH6's 480 MHz Cortex-M7 with double-precision FPU executes field-oriented control (FOC) loops on three-phase PMSM and induction motors in under 1 microsecond per iteration. Two 16-bit ADCs sampled at 3.6 MSPS capture phase currents simultaneously with zero interleaving deadtime, while the HRTIM peripheral drives high-resolution PWM channels above the audible band. On-chip Chrom-ART offloads display rendering for the operator panel. Compared with an external DSP+MCU split, the single-chip solution lowers BOM cost by ~30%.
おすすめ
Human-Machine Interface (HMI) Panels
With Chrom-ART (DMA2D) hardware acceleration and an integrated JPEG codec, the STM32H753XIH6 drives XGA-resolution TFT-LCDs over the parallel FMC interface while sustaining smooth animations. The 1 MB SRAM bank is large enough to hold a full-screen framebuffer at 16-bit color, eliminating external SDRAM cost in mid-size panels. USB OTG HS enables touch-panel firmware updates in the field, and Ethernet MAC supports remote HMI diagnostics. Drop the H743 variant if you do not need the crypto blocks.
おすすめ
Audio DSP and Effects Units
The 480 MHz Cortex-M7 with DSP instructions processes 24-bit audio at 192 kHz sample rates in real time, including reverb, EQ, and dynamics. Two 12-bit DACs and SAI/I2S interfaces stream to external codecs, while USB OTG FS presents as a 24-bit audio device to a host PC. The 1 MB SRAM supports multiple audio buffers simultaneously without dropouts. Designers porting from STM32F7 can reuse much of their DSP code due to instruction-set compatibility.
おすすめ
Industrial IoT Gateways
The STM32H753XIH6 integrates Ethernet MAC, USB OTG HS, SDMMC, and CAN FD in a single TFBGA-176 package, ideal for protocol-conversion gateways bridging sensor buses to the cloud. The Cortex-M7 + 1 MB SRAM runs lightweight TCP/IP stacks (LWIP) while managing Modbus/Profibus conversions. Hardware AES/SHA blocks accelerate TLS handshakes and OTA firmware verification. XIP execution from external Flash via FMC keeps the 2 MB internal Flash budget for application code.
おすすめ
Point-of-Sale Terminals
POS terminals need fast user response and secure payment flows - exactly what the STM32H753XIH6 delivers. The 480 MHz core renders GUI screens via Chrom-ART while the hardware AES/SHA/RSA accelerators encrypt PIN pads, EMV card data, and contactless transactions in real time. USB OTG HS drives a printer port, and the parallel 16-bit interface connects to a capacitive touch controller. The 2 MB Flash holds a full Linux-less POS application without external memory.
おすすめ
Solar Inverters and Power Conversion
The STM32H753XIH6's HRTIM peripheral generates 12 PWM channels with 217 ps resolution, sufficient for 200 kHz+ switching converters and three-level solar inverter topologies. The Cortex-M7 DSP extensions execute MPPT loops, grid synchronization PLLs, and anti-islanding checks within tight sub-millisecond budgets. Internal SMPS reduces external regulator count by one, lowering BOM cost and freeing PCB area for high-voltage isolation. The part supports 1.62 V to 3.6 V supply rails across industrial temperature ranges.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: STM32H753XIH6 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | STM32H755XIH6 | STM32H743XIH6 | STM32H750XIH6 | STM32H753IIT6 |
|---|---|---|---|---|---|
| Package | TFBGA-176 (XIH) | TFBGA-176 (XIH) | TFBGA-176 (XIH) | TFBGA-176 (XIH) | LQFP-176 |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Core | Cortex-M7 480 MHz | Cortex-M7 480 MHz + Cortex-M4 240 MHz | Cortex-M7 480 MHz | Cortex-M7 480 MHz | Cortex-M7 480 MHz |
| Flash | 2 MB | 2 MB | 2 MB | 128 KB (-94%) | 2 MB |
| RAM | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| Hardware Crypto (AES/SHA) | Yes | Yes | No | Yes | Yes |
| Chrom-ART + JPEG Codec | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
主な差別化要因
- 2 MB Flash density for self-contained applications （vs STM32H750XIH6)
- On-chip hardware cryptography for secure IoT （vs STM32H743XIH6)
- Higher Flash density than i.MX RT alternatives （vs NXP i.MX RT1170)
設計ノート
The TFBGA-176 package uses 0.65 mm ball pitch; PCB fabrication must specify microvia (laser-drilled) stack-up with at least a 4-layer 1-2-3-4 stack-up. Use NSMD land pads with solder mask-defined or non-solder mask-defined per your assembly shop preference, and ensure the BGA pad-to-pad clearance exceeds 0.4 mm to avoid solder bridging.
Estimated: total power dissipation at 480 MHz with all peripherals active is approximately 400-500 mW. Decoupling the TFBGA package requires at least 18x 100 nF X7R capacitors placed within 3 mm of each VDD/VSS pair. Place a 4.7 uF bulk capacitor near the SMPS inductor and a 10 uF near the VBAT pin for RTC backup retention.
At sustained 480 MHz CPU load with Ethernet and USB active, die temperature rises 30-40C above ambient. In enclosed enclosures without airflow, derate CPU frequency to 400 MHz or add thermal vias under the exposed pad. The TFBGA-176 does not have an exposed thermal pad, so heat removal must come from internal copper planes on inner PCB layers.
Verify the boot pin (BOOT0) is not floating during reset - a floating BOOT0 may cause the device to enter bootloader mode instead of normal application start-up. Also, when transitioning between internal SMPS and LDO modes in firmware, sequence the change only when the CPU is idle, as a mid-task switch can cause an unintended reset.
コンプライアンス情報
Industrial-grade 6 operating temperature (-40C to +85C); RoHS and REACH compliant per ST product page. AEC-Q100 not applicable - this part is not automotive-qualified.
