XC3S400-4PQG208I - 400K Spartan-3 FPGA | AMD Xilinx
Артикул: XC3S400-4PQG208I ✗ Снят с производстваXC3S400-4PQG208I Обзор
A field-programmable gate array is a semiconductor whose digital logic, interconnect, and I/O behavior are configured after manufacture. An FPGA sits above programmable logic devices in the hardware hierarchy: it combines configurable logic blocks, programmable routing, block RAM, and user I/O in one device. This makes it useful when fixed logic is inflexible but a conventional application-specific integrated circuit would be too costly or slow to develop.
The XC3S400 provides 8,064 logic cells and 141 user I/O pins, giving designers substantially more interface capacity than small programmable logic devices. Its 294,912 RAM bits support on-chip data storage, buffering, and stateful logic. The 400,000-system-gate position places it in the middle of the Spartan-3 family, which spans densities from 50,000 to 5,000,000 system gates and was designed for high-volume, cost-sensitive consumer electronics.
The -4 suffix identifies the device speed grade, while PQG208 identifies the lead-free 208-pin package used on this ordering variant. The I suffix denotes the industrial temperature option. The Microchip USA technical listing reports an operating range of -40°C to +100°C for junction temperature. These distinctions matter because a replacement must retain the same package, adequate speed grade, and temperature coverage for the target equipment.
Typical uses include industrial control and data-acquisition equipment, communications interfaces, embedded video systems, instrumentation, and cost-sensitive consumer electronics. Its 141 I/O pins can support external memory, control signals, communications transceivers, converters, and display or sensor interfaces, while the internal RAM resources reduce the need for external data storage in moderate designs.
PCB design should follow the AMD Xilinx package and pinout documentation, especially for power, configuration, clock, and I/O assignments. Confirm decoupling, configuration interface connections, thermal conditions, and unused-pin treatment before release. A 208-pin lead-free package also requires assembly capability capable of handling its fine-pitch lead geometry and inspecting the narrow leads for bridging or opens.
This page consolidates the available manufacturer and distributor references into a practical engineering view of the XC3S400-4PQG208I, including package characteristics, selection guidance, verified alternatives, and design considerations for maintaining or redesigning an existing Spartan-3 board.
Аналоги без доработки для XC3S400-4PQG208I — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с XC3S400-4PQG208I (тот же форм-фактор и посадочное место) — отличается по Device Type, Core Supply Voltage, Lead-Free Status, Logic Cells, Package.
XC3S400-4PQG208C
✅ Прямая замена ⚠️ Характеристики не провереныУточнить цену
Открыть даташит →XC3S400-5PQG208C
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
XC3S400-3PQG208C
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XC3S400-2PQG208C
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XC3S400-1PQG208C
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XC3S400-4PQG208I Максимальные параметры и электрические характеристики
| Device Type | Spartan-3 field-programmable gate array (FPGA) |
| System Gates | 400,000 gates |
| Logic Cells | 8,064 cells |
| Total RAM Bits | 294,912 bits |
| User I/O Pins | 141 pins |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -4 |
| Корпус | 208-BFQFP |
| Тип монтажа | Surface mount |
| Lead-Free Status | Lead free |
| Junction Temperature Range | -40°C to +100°C |
| Logic Array Blocks | 896 LABs/CLBs |
| Family Density Range | 50,000 to 5,000,000 system gates |
Руководство по цоколевке XC3S400-4PQG208I в корпусе 208-bfqfp
Цоколевка для XC3S400-4PQG208I (корпус 208-bfqfp). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для XC3S400-4PQG208I.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
XC3S400-4PQG208I подходит для 6 применениеs: Industrial Control and Automation, Data-Acquisition and Instrumentation, Communications Interface Equipment, Embedded Video and Display Control, Cost-Sensitive Consumer Electronics, Programmable Logic Test and Education.
Industrial Control and Automation
The XC3S400-4PQG208I fits industrial controllers that combine deterministic logic with numerous external interfaces. Its 141 user I/O pins can connect sensors, actuators, relay drivers, counters, and communications transceivers, while 8,064 logic cells and 294,912 RAM bits support state machines, protocol handling, and acquisition pipelines. The 1.2 V core and -4 speed grade provide a defined performance target for timing closure. For industrial deployment, the -40°C to +100°C junction-temperature option is important, but enclosure temperature and calculated self-heating must remain within that limit.
Рекомендуется
Data-Acquisition and Instrumentation
The XC3S400-4PQG208I is suitable for instrumentation that must combine parallel data capture, control logic, and local processing. The 141 user I/O pins support counters, digital sensors, converters, memory interfaces, and trigger signaling, while 294,912 RAM bits can implement sample buffers and intermediate data storage. Designers can partition the FPGA between acquisition control and protocol conversion without relying on a microcontroller for every real-time operation. Close attention should be given to clock jitter, input thresholds, and timing margins because the device supports digital rather than analog signal conditioning.
Рекомендуется
Communications Interface Equipment
The XC3S400-4PQG208I can implement protocol bridges, packet processors, and communications controllers where parallel interfaces require programmable logic. Its 141 I/O pins provide substantial connectivity to transceivers and memory, and the 294,912 RAM bits support packet buffering and FIFO structures. The Spartan-3 architecture allows parallel-to-serial conversion, framing, filtering, and error detection to be consolidated into one programmable device. Clocking and I/O standards must be checked against the target interface, and unused transceiver channels require termination and configuration review before release.
Рекомендуется
Embedded Video and Display Control
The XC3S400-4PQG208I can be used for embedded display timing, pixel-format conversion, character generation, and control logic in cost-sensitive video equipment. Its 141 user I/O pins allow parallel pixel buses, synchronization signals, and control interfaces to be handled in a single FPGA. The 8,064 logic cells and 294,912 RAM bits are sufficient for moderate line buffers, frame-control logic, and lookup structures. Board-level signal integrity remains important, so routing, grounding, and connector or cable behavior should be evaluated together rather than treated as purely digital concerns.
Рекомендуется
Cost-Sensitive Consumer Electronics
The XC3S400 was designed for high-volume, cost-sensitive consumer electronics, and the XC3S400-4PQG208I provides a concentrated combination of 400,000 system gates, 141 I/O pins, and 294,912 RAM bits in one configurable device. It can consolidate keypad scanning, display control, motor sequencing, audio control, and communications logic while retaining the flexibility of field programming. For new consumer designs, supply-chain longevity should be evaluated before committing the architecture because the Spartan-3 generation is an older FPGA family.
Рекомендуется
Programmable Logic Test and Education
The XC3S400-4PQG208I supports laboratory instruction in digital design, FPGA configuration, timing analysis, and mixed sequential-combinational logic. Students can implement processors, interfaces, counters, memories, and control systems while using 8,064 logic cells and 141 I/O pins for meaningful projects. Its 1.2 V core requirement and 208-BFQFP package require a compatible development board or careful laboratory adapter. Before handling the device, verify the correct programming cable, configuration method, I/O voltage environment, and power sequencing used by the selected board.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для XC3S400-4PQG208I — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | XC3S400-4PQG208C | XC3S400-5PQG208C | XC3S400-3PQG208C | XC3S400-2PQG208C | XC3S400-1PQG208C |
|---|---|---|---|---|---|---|
| Package | 208-BFQFP | 208-BFQFP | 208-BFQFP | 208-BFQFP | 208-BFQFP | 208-BFQFP |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Device Type | Spartan-3 FPGA | Spartan-3 FPGA | Spartan-3 FPGA | Spartan-3 FPGA | Spartan-3 FPGA | Spartan-3 FPGA |
| System Gates | 400,000 gates | 400,000 gates | 400,000 gates | 400,000 gates | 400,000 gates | 400,000 gates |
| Logic Cells | 8,064 cells | 8,064 cells | 8,064 cells | 8,064 cells | 8,064 cells | 8,064 cells |
| RAM Bits | 294,912 bits | 294,912 bits | 294,912 bits | 294,912 bits | 294,912 bits | 294,912 bits |
| User I/O Pins | 141 pins | 141 pins | 141 pins | 141 pins | 141 pins | 141 pins |
| Speed Grade | -4 | -4 | -5 | -3 | -2 | -1 |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Ключевые отличия
- Industrial temperature coverage within the Spartan-3 family (против XC3S400-4PQG208C)
- Direct -4 speed-grade fit for legacy timing constraints (против XC3S400-3PQG208C)
- Lower speed grade can reduce timing margin (против XC3S400-5PQG208C)
- Balanced logic, memory, and I/O integration (против XC3S400-1PQG208C)
Заметки по проектированию
Implement the 1.2 V core supply and the device’s required auxiliary rails as separate, well-decoupled networks. Place the required bypass capacitors immediately beside their associated power pins, with short, low-impedance return paths and a solid ground plane. Keep switching-regulator and high-current digital return paths from crossing sensitive configuration or clock areas. Verify the power-up and power-down sequence against the manufacturer’s Spartan-3 configuration guidance before enabling the FPGA.
Use the AMD Xilinx PQG208 land pattern and pin table as the controlling layout references. The 208-lead fine-pitch package requires uniform routing from the device to its bypass and decoupling components, and exposed or routed supply structures must follow the recommended assembly rules. Preserve access for assembly inspection, especially between closely spaced leads. Do not derive land coordinates solely from the ordering code because package drawings define the true footprint and lead geometry.
Calculate junction temperature from device dissipation, the selected speed grade, ambient temperature, airflow, and the board’s copper-spreading capability. The XC3S400-4PQG208I is rated for a -40°C to +100°C junction-temperature range, so industrial enclosure conditions cannot be evaluated from ambient temperature alone. Place the device away from concentrated heat sources, provide thermal relief around the package where appropriate, and avoid enclosing the board without an airflow and temperature-rise assessment.
Do not substitute an XC3S400 variant solely because it uses a PQG208 package. Verify speed grade, temperature suffix, configuration behavior, supply requirements, and the programmed bitstream compatibility before replacing the I-grade device. In particular, a commercial-temperature C suffix may be unacceptable for harsh environments, and a slower grade can violate timing even when the pinout matches. Confirm the exact operating conditions and rerun timing analysis for every substitution.
Информация о соответствии
The distributor listing identifies the package as lead-free. Other compliance attributes are not established by the cited product references.
