XC7A75T-1FGG484I - 75,520-Cell Artix-7 FPGA | AMD
Артикул: XC7A75T-1FGG484I ✓ АктивенXC7A75T-1FGG484I Обзор
An FPGA is a reconfigurable semiconductor used to implement digital logic, signal processing, control, and communication functions after a design is loaded into programmable configuration memory. In the product hierarchy, the XC7A75T belongs to the Artix-7 FPGA family, combining programmable logic, fixed resources, high-speed I/O, block RAM, and clock-management circuitry in one surface-mount device.
The XC7A75T provides 75,520 configurable logic cells and 285 I/O in the 484-ball FCBGA package. Its stated 464 MHz performance is useful for control logic, embedded processing, sensor aggregation, industrial communication, and general-purpose digital prototyping. Integrated MMCM and PLL resources support clock generation and phase-related functions required by high-speed interfaces and time-sensitive designs.
The -1 ordering designation identifies the performance grade, while FGG484 identifies the 484-ball fine-pitch BGA package and I identifies the associated temperature-grade option. Because the verified results do not provide the complete device pin table, detailed electrical tables, power coefficients, or package dimensions, designers should confirm those values against the AMD Artix-7 documentation before release, safety qualification, or production control.
Typical applications include industrial automation, embedded control, test and measurement, communications equipment, low-cost prototyping, and data-acquisition systems. The large I/O count allows multiple external interfaces to be connected, while MMCM and PLL resources help establish internal clock domains. The FCBGA-484 package requires careful PCB layout, thermal analysis, and assembly process control.
A key design consideration is that its 484-ball BGA footprint provides extensive connectivity but demands advanced board-level design. Use manufacturer-provided package files, keep high-speed routes controlled, provide robust power and ground distribution, and verify BGA assembly capability with the selected PCB supplier. The -1 speed grade should be selected against the complete timing, power, and temperature requirements of the target design.
This page consolidates the verified distributor specifications, package identity, source links, replacement considerations, and practical implementation guidance. It also distinguishes true package-compatible FPGA alternatives from parts with different ball counts or device resources, helping engineers narrow a replacement without overlooking bitstream, timing, and qualification constraints.
Аналоги без доработки для XC7A75T-1FGG484I — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с XC7A75T-1FGG484I (тот же форм-фактор и посадочное место) — отличается по Logic Cells, Package, Block RAM, Mounting Type, Speed Grade.
XC7A75T-1FGG484C
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
XC7A75T-2FGG484C
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
XC7A75T-2FGG484I
✅ Прямая замена ⚠️ Характеристики не провереныУточнить цену
Открыть даташит →XC7A75T-1FGG484E
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
XA7A75T-1FGG484Q
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
XC7A75T-1FGG484I Максимальные параметры и электрические характеристики
| Device Type | Artix-7 Field Programmable Gate Array (FPGA) |
| Logic Cells | 75,520 cells |
| I/O Count | 285 I/O |
| Maximum Performance Frequency | 464 MHz |
| Core Supply Voltage | 950 mV to 1.05 V |
| Package Type | FCBGA-484 |
| Ball Count | 484 balls |
| Clock Management Resources | MMCM and PLL |
| Series | Artix-7 |
| Тип монтажа | Surface Mount |
| Programmable Logic | Reconfigurable FPGA architecture |
Руководство по цоколевке XC7A75T-1FGG484I в корпусе fcbga-484
Цоколевка для XC7A75T-1FGG484I (корпус fcbga-484). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для XC7A75T-1FGG484I.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
XC7A75T-1FGG484I подходит для 6 применениеs: Industrial Automation Control, Data Acquisition and Test Equipment, Communications Equipment, Embedded Control Platform, Audio and Signal Processing, Reconfigurable Instrumentation Prototype.
Industrial Automation Control
The AMD XC7A75T-1FGG484I fits industrial automation controllers that combine sequential control, parallel data handling, and multiple external interfaces. Its 75,520 logic cells provide substantial room for state machines, protocol engines, and safety-independent supervisory logic, while 285 I/O support sensors, actuators, counters, and communication transceivers. The stated 464 MHz performance level is useful for time-critical control paths, although actual closure must be checked against routing and I/O timing. MMCM and PLL resources help organize internal clock domains, and the 950 mV to 1.05 V core range requires a suitably designed low-voltage supply network.
Рекомендуется
Data Acquisition and Test Equipment
The XC7A75T-1FGG484I is suitable for data-acquisition and test systems that must coordinate sampling, trigger logic, digital pattern generation, and data processing. The 75,520-cell architecture can host parallel acquisition pipelines and protocol controllers, while 285 I/O offer connections to converters, memory, instruments, and fixture controls. Its MMCM and PLL resources support deterministic clock distribution, although every input and output standard must be matched to the relevant voltage bank. The 484-ball FCBGA also gives access to many signal pins but requires a high-density PCB, careful return paths, and assembly inspection.
Рекомендуется
Communications Equipment
The AMD XC7A75T-1FGG484I can implement programmable protocol handling, packet processing, and interface bridging in communications equipment. Its 75,520 logic cells provide enough parallel capacity for multiple lanes or control paths, while 285 I/O can support high-speed serial transceivers, parallel buses, status signals, and management interfaces. The MMCM and PLL resources are valuable for clock recovery, data strobing, and multiple related domains. The verified material does not state lane-specific transceiver rates, so engineers must select I/O-compatible companion devices and validate timing against the complete AMD Artix-7 constraints.
Рекомендуется
Embedded Control Platform
The XC7A75T-1FGG484I suits embedded control platforms that combine programmable logic with external processors, memory, and real-world interfaces. Its 75,520 logic cells can implement hardware acceleration, deterministic state machines, custom peripherals, or sensor fusion pipelines, and its 285 I/O simplifies connection to external processors and sensors. Clock-management resources allow the FPGA to create ordered internal clocks from a common reference. Because the device is supplied in FCBGA-484, the system should budget for advanced PCB manufacturing, thermal paths, and assembly yield rather than treating it like a leaded package.
Рекомендуется
Audio and Signal Processing
The XC7A75T-1FGG484I can serve as a configurable signal-processing and audio-control engine when parallel arithmetic, digital filtering, or interface conversion is required. Its programmable logic allows filtering, sample-rate handling, routing, and control functions to be adapted without changing the PCB, while MMCM and PLL resources support the clocking required by converters and digital audio interfaces. The 285 I/O count provides connectivity for multi-channel data and control signals. Exact converter rates and I/O timing are not included in the verified excerpts, so the FPGA constraints and selected audio components must be validated together.
Рекомендуется
Reconfigurable Instrumentation Prototype
The XC7A75T-1FGG484I is appropriate for laboratory and prototype platforms that require changing logic or interface behavior between projects. The 75,520 logic cells support substantially more implementation capacity than a small CPLD, while the 484-ball package exposes 285 I/O for converters, displays, memory, and communication interfaces. Reconfiguration also allows one board platform to support multiple experiments or firmware personalities. The main engineering constraints are the FCBGA assembly process, signal-integrity layout, and verification of every pin and voltage bank against the selected package file.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для XC7A75T-1FGG484I — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | XC7A75T-1FGG484C | XC7A75T-2FGG484C | XC7A75T-2FGG484I | XC7A75T-1FGG484E | XA7A75T-1FGG484Q |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | FCBGA-484 | FCBGA-484 | FCBGA-484 | FCBGA-484 | FCBGA-484 | FCBGA-484 |
| Device Family | Artix-7 XC7A75T | Artix-7 XC7A75T | Artix-7 XC7A75T | Artix-7 XC7A75T | Artix-7 XC7A75T | Artix-7 75T |
| Logic Cells | 75,520 cells | 75,520 cells | 75,520 cells | 75,520 cells | 75,520 cells | 75,520 cells |
| I/O Count | 285 I/O | 285 I/O | 285 I/O | 285 I/O | 285 I/O | 285 I/O |
| Stated Performance Frequency | 464 MHz | 464 MHz | Not provided in verified data | Not provided in verified data | 464 MHz | Not provided in verified data |
| Core Supply Voltage | 950 mV to 1.05 V | 950 mV to 1.05 V | 950 mV to 1.05 V | 950 mV to 1.05 V | 950 mV to 1.05 V | 950 mV to 1.05 V |
| Ordering Grade | -1 speed grade, I suffix | -1 speed grade, C suffix | -2 speed grade, C suffix | -2 speed grade, I suffix | -1 speed grade, E suffix | -1 speed grade, Q suffix |
| Clock Management | MMCM and PLL | MMCM and PLL | MMCM and PLL | MMCM and PLL | MMCM and PLL | Not provided in verified data |
| Unit Price at Quantity 1 | Quote required as of 2026-10-29 | Quote required as of 2026-10-29 | Quote required as of 2026-10-29 | Quote required as of 2026-10-29 | Quote required as of 2026-10-29 | Quote required as of 2026-10-29 |
Ключевые отличия
- Matches the specified -1 performance grade while retaining the exact XC7A75T resource configuration (против XC7A75T-2FGG484C)
- Retains the same package and major device resources in the C suffix ordering option (против XC7A75T-1FGG484C)
- Uses the XA7A75T-1FGG484Q footprint and resource level without relying on a different ball-count package (против XA7A75T-1FGG484Q)
Заметки по проектированию
Treat the FCBGA-484 footprint as a high-density PCB-design problem. Use the manufacturer package file rather than reconstructing the land pattern from a generic BGA drawing, and verify ball-pad dimensions, solder-mask definition, paste stencil, and assembly requirements with the fabricator. Confirm the exact FGG484 pinout for the selected ordering option before routing because package suffixes can encode different qualification details.
The verified core supply range is 950 mV to 1.05 V, so the power design must account for the exact device voltage, tolerance, sequencing, and rail requirements listed in the AMD documentation. Keep the low-voltage core path short and provide local bulk and high-frequency decoupling near the device. Estimated: power loss equals the core current multiplied by the actual core-to-supply voltage difference; obtain the required current from the design's utilization and timing results before sizing regulators or copper.
Preserve signal integrity by assigning pins and planning layers from the AMD package and device constraints rather than from package pitch alone. Provide continuous return paths for high-speed interfaces, avoid routing sensitive signals across split power or ground planes, and observe manufacturer guidance for simultaneous-switching-noise-sensitive pins. The 285 available I/O do not all share the same voltage standard or timing characteristics, so complete bank planning before schematic capture.
FCBGA-484 performance can make the package, PCB copper, and associated power circuitry important thermal paths. Use the manufacturer's power coefficients and the design's actual activity factor to estimate junction temperature rather than relying only on nominal device frequency. Estimated: junction rise equals device dissipation multiplied by the effective thermal resistance; derive dissipation from the selected core, I/O, auxiliary, and static power estimates before setting the thermal budget.
Информация о соответствии
The supplied verified search results do not provide authoritative compliance statements for this exact ordering option. Compliance must be confirmed from current AMD product documentation or declarations.
