XC7A75T-2FGG484I - Artix-7 FPGA, 75K Logic Cells | AMD
MPN: XC7A75T-2FGG484I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $108.25 | $108.25 |
| 10 | $99.1 | $991.00 |
| 100 | $89.5 | $8,950.00 |
| 500 | $78.6 | $39,300.00 |
| 1,000 | $74.87 | $74,870.00 |
Drop-in alternatives for XC7A75T-2FGG484I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC7A75T-2FGG484C
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XC7A75T-1FGG484I
✅ Drop-In📋 Reference alternative (not in catalog)
XC7A75T-1FGG484C
✅ Drop-In📋 Reference alternative (not in catalog)
XC7A75T-3FGG484I
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XA7A75T-1FGG484Q
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XC7A75T-2FGG484I Maximum Ratings & Electrical Characteristics
| Manufacturer | AMD (Xilinx) |
| Product Family | Artix-7 |
| Number of Logic Cells | 75520 |
| Number of User I/O | 285 |
| Block RAM (bits) | 3870720 |
| Technology Node | 28nm (CMOS) |
| Core Supply Voltage | 1V |
| Operating Temperature | -40°C to +100°C |
| Package / Case | 484-BBGA (FGG484) |
| Mounting Style | Surface Mount |
| Speed Grade | -2 |
| Embedded MMCM | Yes |
| Embedded PLL | Yes |
| Packaging | Tray |
| Lead-Free | Yes (Pb-free) |
| RoHS Status | unknown |
| Number of DSP Slices | [DATA_NEEDED: Number of DSP slices] |
| Max Distributed RAM (Kb) | [DATA_NEEDED: Max Distributed RAM (Kb)] |
XC7A75T-2FGG484I 484-bbga (fgg484) Pin Configuration Guide
Complete pinout information for XC7A75T-2FGG484I (484-bbga (fgg484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC7A75T-2FGG484I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7A75T-2FGG484I is suitable for 6 applications: Industrial Motor Control and Factory Automation, Software-Defined Radio (SDR) Baseband Processing, Machine Vision and Video Processing, Medical Imaging and Ultrasound Front End, Test and Measurement Instrumentation, Aerospace, Defense, and Rugged Communications.
Industrial Motor Control and Factory Automation
The XC7A75T-2FGG484I fits industrial motor-control drives and PLC I/O because its 75,520 logic cells can implement dual FOC (field-oriented control) algorithms, encoder interfaces, and safety logic in parallel. The 285 user I/Os connect to gate drivers, Hall sensors, and Ethernet PHYs; 3,870,720 block-RAM bits buffer telemetry and control loops. Its -40°C to +100°C industrial rating suits cabinet and machine-mount environments. In a typical servo drive, the FPGA offloads PWM generation from the host MCU, reducing CPU load and achieving deterministic switching. The 28nm 1V core architecture keeps power manageable, but designers should add a thermal copper pour on the FGG484 BGA lands and pair it with a DC-DC for the 1.0V VCCINT rail.
Recommended
Software-Defined Radio (SDR) Baseband Processing
As an SDR baseband device, the XC7A75T-2FGG484I provides 75,520 logic cells for DDC/DUC chains, 3,870,720 bits of block RAM for FIFO buffering, and 285 I/Os to connect high-speed ADCs/DACs and control interfaces. The FPGA's parallel architecture enables per-channel filtering and resampling without the sequential bottleneck of a DSP. The industrial temperature range supports outdoor and vehicular radio installations. In an SDR transceiver, the Artix-7 can handle 16-bit I/Q samples at sample rates beyond 100 MSPS; for very wideband or multi-antenna systems, the designer may migrate to XC7A100T in the same FGG484 package family. Careful decoupling of the 1.0V core and 1.8V/3.3V banks is essential to meet in-band noise requirements.
Recommended
Machine Vision and Video Processing
In machine vision, the XC7A75T-2FGG484I can perform real-time image preprocessing — debayering, scaling, histogram equalization, and thresholding — without burdening the host CPU. Its 285 I/Os connect to CMOS image sensors, DDR3 frame buffers, and display or GigE Vision interfaces; 3,870,720 block RAM bits store line buffers for convolution kernels. The -40°C to +100°C rating allows deployment inside production equipment. A typical line-scan camera link interface uses LVDS inputs on HR/HP I/O banks, while the FPGA performs pixel alignment and defect detection at 60+ frames per second. Designers should assign clock resources to the MMCM/PLL tiles for pixel-clock generation and use SerDes-capable pins where available.
Recommended
Medical Imaging and Ultrasound Front End
The XC7A75T-2FGG484I is well suited to ultrasound beamforming and optical-coherence-tomography front ends where parallel DSP must operate in real time. Its 75,520 logic cells implement multichannel delay-and-sum, quadrature demodulation, and envelope detection; 3,870,720 bits of block RAM hold per-channel coefficient tables. The industrial temperature range covers benchtop and transportable medical instruments. In an ultrasound probe, the FPGA pre-processes 32–64 receive channels, compressing data before transfer to an embedded processor. Because the FGG484 BGA package has a 1.0mm ball pitch, PCB routing is manageable on standard 4–6 layer medical boards. Decoupling and power integrity must be designed carefully to keep analog noise low.
Recommended
Test and Measurement Instrumentation
For oscilloscopes, logic analyzers, and signal generators, the XC7A75T-2FGG484I provides the logic capacity to implement acquisition control, trigger logic, and instrument processing. The 285 user I/Os connect to ADC/DAC converters, front-panel controls, and data ports; 3,870,720 block RAM bits form deep acquisition buffers. The -2 speed grade helps meet tight timing for high-speed data capture, and MMCM/PLL tiles generate low-jitter sampling clocks. In a typical digitizer, the FPGA can sustain simultaneous multi-channel acquisition at 100 MSPS. The industrial temperature rating permits operation in benchtop units that may be left powered in a shop floor environment. Use the JTAG and configuration pins for field updates of instrument firmware.
Recommended
Aerospace, Defense, and Rugged Communications
In aerospace and rugged communications, the XC7A75T-2FGG484I's -40°C to +100°C industrial temperature range and mature Artix-7 architecture make it a dependable choice for sensor processing, protocol translation, and cryptographic or packet-processing logic. Its 75,520 logic cells allow redundant triple-mode redundancy at the netlist level for reliability. The 285 I/Os support LVTTL/LVCMOS/LVDS interfaces to MIL-STD-1553, CAN, and Ethernet PHYs. The FGG484 footprint is shared with automotive-grade XA7A75T variants, enabling qualification traceability. For radiation-tolerant implementations, users may instead target AMD's space-grade devices, but for COTS avionics the industrial Artix-7 offers a strong cost-performance balance. Power supplies must meet stringent transient and thermal requirements.
Recommended
Recommended Products Summary
Engineering reference data for XC7A75T-2FGG484I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7A75T-2FGG484C | XC7A75T-1FGG484I | XC7A75T-1FGG484C | XC7A75T-3FGG484I | XA7A75T-1FGG484Q |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 484-BBGA (FGG484) | 484-BBGA (FGG484) | 484-BBGA (FGG484) | 484-BBGA (FGG484) | 484-BBGA (FGG484) | 484-BBGA (FGG484) |
| Logic Cells | 75,520 | 75,520 | 75,520 | 75,520 | 75,520 | 75,520 |
| User I/O | 285 | 285 | 285 | 285 | 285 | 285 |
| Block RAM (bits) | 3,870,720 | 3,870,720 | 3,870,720 | 3,870,720 | 3,870,720 | 3,870,720 |
| Speed Grade | -2 | -2 | -1 | -1 | -3 | -1 |
| Temperature Range | -40°C to +100°C | 0°C to +85°C | -40°C to +100°C | 0°C to +85°C | -40°C to +100°C | [DATA_NEEDED: XA automotive temperature range] |
| Automotive Qualification | No | No | No | No | No | Yes (AEC-Q100) |
Key Differentiators
- Industrial -40°C to +100°C temperature grade enables harsh-environment deployment (vs XC7A75T-2FGG484C)
- -2 speed grade balances performance and power (vs XC7A75T-1FGG484I)
- Cost-optimized Artix-7 family with package migration (vs Xilinx Kintex-7 higher-density FPGAs)
- Automotive-qualified variant available for traceability (vs XA7A75T-1FGG484Q)
Design Notes
The Artix-7 XC7A75T-2FGG484I requires a regulated 1.0V VCCINT supply plus separate 1.5V/1.8V/2.5V/3.3V VCCO bank supplies. Use low-ESR ceramic capacitors close to the BGA balls and a DC-DC converter sized for the FPGA's estimated dynamic power. AMD recommends sharing the PCB power planes according to the 7-series PCB design guidelines in UG583.
The FGG484 package has a finite thermal resistance; for high utilization designs, add a thermal copper pour and consider a heat sink or forced airflow. At industrial temperatures up to +100°C, de-rate the device based on power consumption. Refer to the thermal management recommendations in the Artix-7 data sheet for junction temperature limits.
FGG484 is a 1.0mm-pitch BGA. Route signals using blind/buried vias or micro-vias if complexity requires it. Follow AMD's package pinout files (UG475 format) to guarantee correct ball assignments, especially for bank placement of I/O standards. Provide dedicated ground vias beneath the package for return current.
Do not assume all Artix-7 FGG484 devices have identical pinouts; migration between densities is usually possible but always validate against the package pinout files. Also ensure the configuration mode pins M[2:0] and PROGRAM_B are tied correctly for the selected boot source (SPI flash, JTAG, BPI, etc.).
For high-speed interfaces such as DDR3 or LVDS, match trace lengths and impedance per AMD board design rules. Use the MMCM/PLL tiles to generate clock trees, and avoid routing clocks adjacent to switching power traces. Keep I/O bank reference voltages (VREF) isolated to maintain signal integrity.
Compliance Information
Snippet from DigChip states all packages are available in Pb-free and selected packages in Pb option. No explicit RoHS/REACH certificates were in the verified data. Standard industrial FPGA is not AEC-Q100 qualified; XA variants are automotive qualified.
