XC7K70T-2FB484I - Kintex-7 65k LC FPGA, 484-FCBGA | AMD Xilinx
Артикул: XC7K70T-2FB484I ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $350 | $350,00 |
| 10 | $320 | $3.200,00 |
| 100 | $285 | $28.500,00 |
| 250 | $260 | $65.000,00 |
| 1.000 | $230 | $230.000,00 |
XC7K70T-2FB484I Обзор
An FPGA is a semiconductor device whose digital logic, interconnects, and I/O behavior are defined by the user's configuration bitstream rather than by the fab mask set. Within the broader silicon taxonomy, the XC7K70T sits in the Kintex-7 sub-family of Xilinx's 7-series programmable logic, between the lower-cost Artix-7 family and the higher-capacity Virtex-7 family. Kintex-7 specifically adds high-speed serial transceivers (GTX) and a generous DSP count that the cheaper Artix-7 lacks, while omitting the Virtex-7's ultra-high-speed GTZ transceivers.
Key features include 65,640 logic cells, ~4.9 Mb of block RAM, 240 DSP48E1 slices, four integrated GTX transceivers running up to 6.6 Gb/s, a PCIe Gen2 hard block, and 285 user I/Os. The -2 speed grade delivers roughly 30% higher internal performance than the -1 grade, while the 'I' suffix indicates the industrial temperature range (-40 C to +100 C ambient operating). Integrated on-die clock management (MMCM and PLL tiles) and the XADC analog-to-digital converter block eliminate external timing and monitoring ICs.
This device is well suited to wireless baseband and remote-radio-head processing, broadcast and pro-AV video over IP pipelines, high-speed serial backplane aggregation, and industrial imaging or radar pre-processing. The integrated PCIe Gen2 endpoint saves BOM cost in machine-vision and digitizer cards where host-side CPU communication matters.
When designing with the XC7K70T-2FB484I, treat the FCBGA substrate as a BGA with controlled-collapse reflow requirements (no-clean flux, X-ray inspection). Decouple every GTP/GTX power rail with the values listed in UG470/UG471, and provide a known-good 1.0 V core supply that respects the inrush profile during configuration. The Kintex-7 supports Vivado design flow with the Webpack toolchain.
Аналоги без доработки для XC7K70T-2FB484I — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
XC7K70T-2FBG484I
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
XC7K70T-2FBG484C
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XC7K70T-2FBG484E
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
XC7K70T-3FBG484E
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
XC7K70T-1FBG484I
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
XC7K70T-2FFG484I
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
XC7K70T-2FB484I Максимальные параметры и электрические характеристики
| Family | Kintex-7 |
| Logic Cells | 65640 |
| Slices | 10250 (per Kintex-7 family ratio; using ~6 LCs/slice) |
| DSP48E1 Slices | 240 |
| User I/Os | 285 |
| Number of Terminals | 484 |
| Package Type | FCBGA-484 (Flip-Chip BGA) |
| Package Dimensions | 23 x 23 mm |
| Supply Voltage (Vccint) | 0.97 V to 1.03 V |
| Process Node | 28 nm HPL |
| GTX Transceivers | 4 (up to 6.6 Gb/s) |
| Speed Grade | -2 |
| Рабочая температура | -40 C to +100 C (Industrial, 'I' suffix) |
| PCIe Hard Block | Gen2 x4 integrated |
| Тип монтажа | Surface Mount (BGA) |
| Статус RoHS | Compliant |
Руководство по цоколевке XC7K70T-2FB484I в корпусе 23 x 23 mm
Цоколевка для XC7K70T-2FB484I (корпус 23 x 23 mm). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для XC7K70T-2FB484I.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
XC7K70T-2FB484I подходит для 6 применениеs: 3G/4G Wireless Baseband Processing, Broadcast Video Over IP, Industrial Imaging & Machine Vision, High-Speed Serial Backplane Aggregation, DSP-Accelerated Test & Measurement, Radar & Lidar Pre-Processing.
3G/4G Wireless Baseband Processing
The XC7K70T-2FB484I's 240 DSP48E1 slices and ~4.9 Mb block RAM are engineered for finite-impulse-response and peak-to-average-power-correction filtering in 3G/4G macro-cell baseband. The 4 GTX transceivers at 6.6 Gb/s handle CPRI or OBSAI fronthaul links to remote radio heads without external phy PHYs, while the PCIe Gen2 hard block connects to a baseband host CPU with a small firmware footprint. Industrial temperature and 0.97-1.03 V core make it suitable for outdoor-macro cabinet mounting.
Рекомендуется
Broadcast Video Over IP
For uncompressed HDMI/SDI video over 10-GbE aggregation, the XC7K70T-2FB484I offers 4 GTX channels at 6.6 Gb/s (logical pair-bonded for 10 Gb/s multiples), 65,640 logic cells for line-pixel buffer management, and enough fabric to absorb jumbo-packet fragment-reassembly logic. Industrial temperature addresses in-rack broadcast gear where inlet temperatures can climb. The PCIe Gen2 block handles NMOS/SMPTE-2022 control-plane traffic to a host CPU, freeing the fabric from housekeeping duties.
Рекомендуется
Industrial Imaging & Machine Vision
The XC7K70T-2FB484I implements pre-processing kernels for linescan and area-scan cameras - color interpolation, Bayer pattern extraction, lens-correction tables - at PC-class frame rates. The 4.9 Mb block RAM caches line buffers without external SRAM, the PCIe Gen2 x4 endpoint pipes frames straight to the host at over 1 GB/s without CPU copies, and 285 user I/Os accommodate multi-channel camera-Link or MIPI-CSI-2 sensor fanout. Industrial temperature suits factory-floor enclosures.
Рекомендуется
High-Speed Serial Backplane Aggregation
In a chassis-to-chassis router card the XC7K70T-2FB484I packs 4 GTX transceivers at 6.6 Gb/s each, useful for SATA, SRIO, or Aurora backplane aggregation. Integrated MMCMs and PLLs deskew between channels, while 240 DSP48E1 slices provide PCS/SERDES symbol encoding. The 65,640 logic cells implement layer-2 forwarding tables up to several thousand entries, and 285 user I/Os fan out to multiple pluggable SFP+ cages through external redriver equalizers.
Рекомендуется
DSP-Accelerated Test & Measurement
Digital oscilloscope, signal/function generator, and spectrum-analyzer boards routinely use the XC7K70T-2FB484I as the real-time waveform engine. The 240 DSP48E1 slices execute CORDIC and FFT kernels at gigasample-per-second rates, 4.9 Mb block RAM holds samples, and the PCIe Gen2 x4 endpoint streams waveforms to host memory continuously. Industrial -40 C to +100 C rating tolerates test-equipment chassis edges. Combined with fast ADCs, the FPGA builds GHz-band real-time spectrum analyzers.
Рекомендуется
Radar & Lidar Pre-Processing
Real-time signal pre-processing for automotive or industrial radar and Lidar front-ends uses the XC7K70T-2FB484I's DSP-rich slice count: 240 DSP48E1 slices running CFAR-detection, FFT-peak-search, and noise-floor accumulation, while the 4 GTX transceivers receive raw sample bursts from multi-channel converters at gigabit rates. The integrated PCIe Gen2 endpoint hands processed object lists to the host at low latency. Industrial temperature is critical for vehicle environmental compliance.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для XC7K70T-2FB484I — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | XC7K70T-2FBG484I | XC7K70T-2FBG484C | XC7K70T-2FBG484E | XC7K70T-3FBG484E | XC7K70T-1FBG484I | XC7K70T-2FFG484I |
|---|---|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | FCBGA-484 (23x23 mm) | FCBGA-484 - same | FCBGA-484 - same | FCBGA-484 - same | FCBGA-484 - same | FCBGA-484 - same | FCBGA-484 - same |
| Logic Cells | 65640 | 65640 | 65640 | 65640 | 65640 | 65640 | 65640 |
| DSP48E1 Slices | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
| GTX Transceivers (count, max Gb/s) | 4 transceivers / 6.6 Gb/s | 4 transceivers / 6.6 Gb/s | 4 transceivers / 6.6 Gb/s | 4 transceivers / 6.6 Gb/s | 4 transceivers / 6.6 Gb/s | 4 transceivers / 6.6 Gb/s | 4 transceivers / 6.6 Gb/s |
| Speed Grade | -2 | -2 | -2 | -2 | -3 (faster) | -1 (slower) | -2 |
| User I/Os | 285 | 285 | 285 | 285 | 285 | 285 | 285 |
| Operating Temperature | -40 C to +100 C (Industrial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +100 C (Extended) | 0 C to +100 C (Extended) | -40 C to +100 C (Industrial) | -40 C to +100 C (Industrial) |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Ключевые отличия
- Genuine -2 industrial temperature in the FCBGA-484 footprint (против XC7K70T-2FBG484C)
- Faster -2 speed grade vs -1 (против XC7K70T-1FBG484I)
- Identical footprint to higher and lower speed grades (против XC7K70T-3FBG484E)
Заметки по проектированию
The XC7K70T-2FB484I requires five independent supplies: Vccint (1.0 V core), Vccaux (1.8 V auxiliary), Vcco_HP for HR/IO banks (1.2-3.3 V), Vcco_MGT (1.0-1.2 V) for the four GTX transceivers, and Vccbatt (optional 1.5 V backup for the encryption key). Estimated: at the published worst-case thermal-design power (~5 W typical, ~7 W heavy GTP traffic), a 1 oz copper 4-layer inner plane providing >80 mm^2 of contiguous copper on the core rail keeps the FCBGA within thermal headroom. Each rail must ramp monotonically; reference UG470/UG471 sequencing carefully.
Estimated: at full GTP + DSP activity (~7 W dissipation), the FCBGA-484's theta_JA of about 13 C/W (with 16 thermal vias on a JEDEC EIA/JESD51 test board) yields a die temperature rise of ~91 C. With a -40 C to +100 C ambient rating, this leaves only 9 C margin in a worst-case sealed enclosure. Use thermal vias under the central BGA pad and a 30+ vias under the periphery, plus airflow of 1 m/s, to keep Tj under 100 C in passive-cooled chassis.
The FCBGA-484 ball pitch is 1.0 mm with 0.45 mm solder-ball land-pad design rules; escape routing in an ultra-low-loss stackup (e.g. Panasonic Megtron 6) requires buried-via or staggered-via breakouts. GTX transmit lanes require matched 85 ohm differential traces less than 25 mm long, with no right-angle bends. Reference MGT/GTX channel-bonding rules in UG471 specifically for SATA and PCIe modes - this part is PCIe Gen2 x4 capable.
Do not skip the 1.8 V Vccaux auxiliary rail, even when the PCIe hard block is unused - the MMCM logic depends on it. Do not power up before Prog-B or Done are wired correctly; failing to do so causes the part to enter warm-boot state. Beware of counterfeit / re-marked Kintex-7 dies: AMD's seven-series supply chain integrity is critical for defense/aerospace use, and unauthorized brokers (notably low-cost LCSC and Element Hong Kong listings) sometimes carry pull/re-marked stock.
Информация о соответствии
Lead-free FCBGA-484 packaging, RoHS and REACH compliant per AMD/Xilinx product environmental reporting. AEC-Q100 not applicable for FPGA logic; not a safety-critical automotive IC under AEC-Q100; for functional-safety ASIL-rated work, migrate to Zynq-7045 or Kintex UltraScale class.
