XC7K70T-2FB484I - Kintex-7 65k LC FPGA, 484-FCBGA | AMD Xilinx
부품 번호: XC7K70T-2FB484I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $350 | $350.00 |
| 10 | $320 | $3,200.00 |
| 100 | $285 | $28,500.00 |
| 250 | $260 | $65,000.00 |
| 1,000 | $230 | $230,000.00 |
XC7K70T-2FB484I 개요
An FPGA is a semiconductor device whose digital logic, interconnects, and I/O behavior are defined by the user's configuration bitstream rather than by the fab mask set. Within the broader silicon taxonomy, the XC7K70T sits in the Kintex-7 sub-family of Xilinx's 7-series programmable logic, between the lower-cost Artix-7 family and the higher-capacity Virtex-7 family. Kintex-7 specifically adds high-speed serial transceivers (GTX) and a generous DSP count that the cheaper Artix-7 lacks, while omitting the Virtex-7's ultra-high-speed GTZ transceivers.
Key features include 65,640 logic cells, ~4.9 Mb of block RAM, 240 DSP48E1 slices, four integrated GTX transceivers running up to 6.6 Gb/s, a PCIe Gen2 hard block, and 285 user I/Os. The -2 speed grade delivers roughly 30% higher internal performance than the -1 grade, while the 'I' suffix indicates the industrial temperature range (-40 C to +100 C ambient operating). Integrated on-die clock management (MMCM and PLL tiles) and the XADC analog-to-digital converter block eliminate external timing and monitoring ICs.
This device is well suited to wireless baseband and remote-radio-head processing, broadcast and pro-AV video over IP pipelines, high-speed serial backplane aggregation, and industrial imaging or radar pre-processing. The integrated PCIe Gen2 endpoint saves BOM cost in machine-vision and digitizer cards where host-side CPU communication matters.
When designing with the XC7K70T-2FB484I, treat the FCBGA substrate as a BGA with controlled-collapse reflow requirements (no-clean flux, X-ray inspection). Decouple every GTP/GTX power rail with the values listed in UG470/UG471, and provide a known-good 1.0 V core supply that respects the inrush profile during configuration. The Kintex-7 supports Vivado design flow with the Webpack toolchain.
드롭인 대체품: XC7K70T-2FB484I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
XC7K70T-2FBG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7K70T-2FBG484C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7K70T-2FBG484E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7K70T-3FBG484E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7K70T-1FBG484I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
XC7K70T-2FFG484I
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
XC7K70T-2FB484I 최대 정격 & 전기적 특성
| Family | Kintex-7 |
| Logic Cells | 65640 |
| Slices | 10250 (per Kintex-7 family ratio; using ~6 LCs/slice) |
| DSP48E1 Slices | 240 |
| User I/Os | 285 |
| Number of Terminals | 484 |
| Package Type | FCBGA-484 (Flip-Chip BGA) |
| Package Dimensions | 23 x 23 mm |
| Supply Voltage (Vccint) | 0.97 V to 1.03 V |
| Process Node | 28 nm HPL |
| GTX Transceivers | 4 (up to 6.6 Gb/s) |
| Speed Grade | -2 |
| 동작 온도 | -40 C to +100 C (Industrial, 'I' suffix) |
| PCIe Hard Block | Gen2 x4 integrated |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
XC7K70T-2FB484I 23 x 23 mm 핀 구성 가이드
XC7K70T-2FB484I(23 x 23 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: XC7K70T-2FB484I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
XC7K70T-2FB484I 적합 용도: 6 애플리케이션s: 3G/4G Wireless Baseband Processing, Broadcast Video Over IP, Industrial Imaging & Machine Vision, High-Speed Serial Backplane Aggregation, DSP-Accelerated Test & Measurement, Radar & Lidar Pre-Processing.
3G/4G Wireless Baseband Processing
The XC7K70T-2FB484I's 240 DSP48E1 slices and ~4.9 Mb block RAM are engineered for finite-impulse-response and peak-to-average-power-correction filtering in 3G/4G macro-cell baseband. The 4 GTX transceivers at 6.6 Gb/s handle CPRI or OBSAI fronthaul links to remote radio heads without external phy PHYs, while the PCIe Gen2 hard block connects to a baseband host CPU with a small firmware footprint. Industrial temperature and 0.97-1.03 V core make it suitable for outdoor-macro cabinet mounting.
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Broadcast Video Over IP
For uncompressed HDMI/SDI video over 10-GbE aggregation, the XC7K70T-2FB484I offers 4 GTX channels at 6.6 Gb/s (logical pair-bonded for 10 Gb/s multiples), 65,640 logic cells for line-pixel buffer management, and enough fabric to absorb jumbo-packet fragment-reassembly logic. Industrial temperature addresses in-rack broadcast gear where inlet temperatures can climb. The PCIe Gen2 block handles NMOS/SMPTE-2022 control-plane traffic to a host CPU, freeing the fabric from housekeeping duties.
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Industrial Imaging & Machine Vision
The XC7K70T-2FB484I implements pre-processing kernels for linescan and area-scan cameras - color interpolation, Bayer pattern extraction, lens-correction tables - at PC-class frame rates. The 4.9 Mb block RAM caches line buffers without external SRAM, the PCIe Gen2 x4 endpoint pipes frames straight to the host at over 1 GB/s without CPU copies, and 285 user I/Os accommodate multi-channel camera-Link or MIPI-CSI-2 sensor fanout. Industrial temperature suits factory-floor enclosures.
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High-Speed Serial Backplane Aggregation
In a chassis-to-chassis router card the XC7K70T-2FB484I packs 4 GTX transceivers at 6.6 Gb/s each, useful for SATA, SRIO, or Aurora backplane aggregation. Integrated MMCMs and PLLs deskew between channels, while 240 DSP48E1 slices provide PCS/SERDES symbol encoding. The 65,640 logic cells implement layer-2 forwarding tables up to several thousand entries, and 285 user I/Os fan out to multiple pluggable SFP+ cages through external redriver equalizers.
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DSP-Accelerated Test & Measurement
Digital oscilloscope, signal/function generator, and spectrum-analyzer boards routinely use the XC7K70T-2FB484I as the real-time waveform engine. The 240 DSP48E1 slices execute CORDIC and FFT kernels at gigasample-per-second rates, 4.9 Mb block RAM holds samples, and the PCIe Gen2 x4 endpoint streams waveforms to host memory continuously. Industrial -40 C to +100 C rating tolerates test-equipment chassis edges. Combined with fast ADCs, the FPGA builds GHz-band real-time spectrum analyzers.
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Radar & Lidar Pre-Processing
Real-time signal pre-processing for automotive or industrial radar and Lidar front-ends uses the XC7K70T-2FB484I's DSP-rich slice count: 240 DSP48E1 slices running CFAR-detection, FFT-peak-search, and noise-floor accumulation, while the 4 GTX transceivers receive raw sample bursts from multi-channel converters at gigabit rates. The integrated PCIe Gen2 endpoint hands processed object lists to the host at low latency. Industrial temperature is critical for vehicle environmental compliance.
추천
추천 제품 요약
엔지니어링 참조 데이터: XC7K70T-2FB484I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | XC7K70T-2FBG484I | XC7K70T-2FBG484C | XC7K70T-2FBG484E | XC7K70T-3FBG484E | XC7K70T-1FBG484I | XC7K70T-2FFG484I |
|---|---|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | FCBGA-484 (23x23 mm) | FCBGA-484 - same | FCBGA-484 - same | FCBGA-484 - same | FCBGA-484 - same | FCBGA-484 - same | FCBGA-484 - same |
| Logic Cells | 65640 | 65640 | 65640 | 65640 | 65640 | 65640 | 65640 |
| DSP48E1 Slices | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
| GTX Transceivers (count, max Gb/s) | 4 transceivers / 6.6 Gb/s | 4 transceivers / 6.6 Gb/s | 4 transceivers / 6.6 Gb/s | 4 transceivers / 6.6 Gb/s | 4 transceivers / 6.6 Gb/s | 4 transceivers / 6.6 Gb/s | 4 transceivers / 6.6 Gb/s |
| Speed Grade | -2 | -2 | -2 | -2 | -3 (faster) | -1 (slower) | -2 |
| User I/Os | 285 | 285 | 285 | 285 | 285 | 285 | 285 |
| Operating Temperature | -40 C to +100 C (Industrial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +100 C (Extended) | 0 C to +100 C (Extended) | -40 C to +100 C (Industrial) | -40 C to +100 C (Industrial) |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
주요 차별점
- Genuine -2 industrial temperature in the FCBGA-484 footprint (vs XC7K70T-2FBG484C)
- Faster -2 speed grade vs -1 (vs XC7K70T-1FBG484I)
- Identical footprint to higher and lower speed grades (vs XC7K70T-3FBG484E)
설계 노트
The XC7K70T-2FB484I requires five independent supplies: Vccint (1.0 V core), Vccaux (1.8 V auxiliary), Vcco_HP for HR/IO banks (1.2-3.3 V), Vcco_MGT (1.0-1.2 V) for the four GTX transceivers, and Vccbatt (optional 1.5 V backup for the encryption key). Estimated: at the published worst-case thermal-design power (~5 W typical, ~7 W heavy GTP traffic), a 1 oz copper 4-layer inner plane providing >80 mm^2 of contiguous copper on the core rail keeps the FCBGA within thermal headroom. Each rail must ramp monotonically; reference UG470/UG471 sequencing carefully.
Estimated: at full GTP + DSP activity (~7 W dissipation), the FCBGA-484's theta_JA of about 13 C/W (with 16 thermal vias on a JEDEC EIA/JESD51 test board) yields a die temperature rise of ~91 C. With a -40 C to +100 C ambient rating, this leaves only 9 C margin in a worst-case sealed enclosure. Use thermal vias under the central BGA pad and a 30+ vias under the periphery, plus airflow of 1 m/s, to keep Tj under 100 C in passive-cooled chassis.
The FCBGA-484 ball pitch is 1.0 mm with 0.45 mm solder-ball land-pad design rules; escape routing in an ultra-low-loss stackup (e.g. Panasonic Megtron 6) requires buried-via or staggered-via breakouts. GTX transmit lanes require matched 85 ohm differential traces less than 25 mm long, with no right-angle bends. Reference MGT/GTX channel-bonding rules in UG471 specifically for SATA and PCIe modes - this part is PCIe Gen2 x4 capable.
Do not skip the 1.8 V Vccaux auxiliary rail, even when the PCIe hard block is unused - the MMCM logic depends on it. Do not power up before Prog-B or Done are wired correctly; failing to do so causes the part to enter warm-boot state. Beware of counterfeit / re-marked Kintex-7 dies: AMD's seven-series supply chain integrity is critical for defense/aerospace use, and unauthorized brokers (notably low-cost LCSC and Element Hong Kong listings) sometimes carry pull/re-marked stock.
규정 준수 정보
Lead-free FCBGA-484 packaging, RoHS and REACH compliant per AMD/Xilinx product environmental reporting. AEC-Q100 not applicable for FPGA logic; not a safety-critical automotive IC under AEC-Q100; for functional-safety ASIL-rated work, migrate to Zynq-7045 or Kintex UltraScale class.
