XCZU5CG-1SFVC784E - Zynq UltraScale+ MPSoC, 256K Logic Cells | AMD
Артикул: XCZU5CG-1SFVC784E ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $1514.13 | $1.514,13 |
| 10 | $1450 | $14.500,00 |
| 100 | $1340 | $134.000,00 |
| 500 | $1220 | $610.000,00 |
| 1.000 | $1100 | $1.100.000,00 |
XCZU5CG-1SFVC784E Обзор
A Multi-Processor System-on-Chip (MPSoC) merges hardened ARM cores with programmable FPGA logic, enabling designers to partition deterministic control tasks to the Cortex-R5, high-level application code to the Cortex-A53 running Linux, and custom accelerators into the FPGA fabric. Within the broader taxonomy, the Zynq UltraScale+ MPSoC sits above single-core Cortex-M microcontrollers and below discrete CPU+FPGA board-level designs, providing hardware/software co-design in one silicon device.
Architecturally the CG family omits the video codec unit (VCU) and the high-end Programmable Logic density of the EG/EV variants, but retains the same Memory Protection Unit (XMPU) and DDR4 controller infrastructure. Designers benefit from the integrated GTH/GTY transceivers, AXI4 high-performance interconnects, and tight PS-PL coupling without external bridges.
Typical applications include industrial machine vision, motor control drives, edge AI inference gateways, software-defined radio front-ends, and automotive driver-assistance ECUs where deterministic response and Linux-class processing coexist on one die. Designers should validate DDR4 routing against the Zynq UltraScale+ PCB guidelines (UG1075) and ensure the heat spreader/FCLGA lid is properly attached with a thermal interface material, since the 784-FCBGA package relies on top-side cooling for sustained workloads.
Аналоги без доработки для XCZU5CG-1SFVC784E — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
XCZU5CG-2SFVC784E
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
XCZU5CG-1SFVC784I
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
XCZU4CG-1SFVC784E
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
XCZU5EG-1SFVC784E
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
XCZU5CG-1FFVC900E
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
XCZU5CG-1SFVC784E Максимальные параметры и электрические характеристики
| Family | Zynq UltraScale+ MPSoC CG |
| Series | XCZU5CG |
| Speed Grade | -1 |
| Logic Cells | 256K+ |
| Application Processor Unit | Dual-core ARM Cortex-A53 MPCore with CoreSight |
| Real-Time Processor Unit | Dual-core ARM Cortex-R5 with CoreSight |
| Graphics Processor | ARM Mali-400 MP2 |
| Maximum PS Clock Frequency | 1.2 GHz |
| Maximum PL Clock Frequency | 500 MHz |
| Process Technology | 20 nm |
| Core Supply Voltage | 0.85 V |
| Корпус | 784-FCBGA (SFVC784), 23x23 mm |
| Тип монтажа | Surface Mount (flip-chip BGA) |
| Статус RoHS | Compliant |
| Temperature Grade | Extended (E) |
Руководство по цоколевке XCZU5CG-1SFVC784E в корпусе 784-fcbga (sfvc784), 23x23 mm
Цоколевка для XCZU5CG-1SFVC784E (корпус 784-fcbga (sfvc784), 23x23 mm). Эта цифровая ИС включает выводы GPIO, интерфейсы связи (UART, SPI, I2C) и выводы питания. Обратитесь к техническому описанию производителя для альтернативных функций выводов и вариантов конфигурации. Необходимо для проектирования встраиваемых систем и трассировки печатных плат.
Нет подробных данных о распиновке для XCZU5CG-1SFVC784E.
Обратитесь к даташиту для полной конфигурации выводов.
Типичное применение
XCZU5CG-1SFVC784E подходит для 6 применениеs: Industrial Machine Vision, Motor Control Drives, Edge AI Inference Gateway, Software Defined Radio (SDR) Front-End, Automotive Driver-Assistance ECU, Industrial IoT Gateway.
Industrial Machine Vision
The XCZU5CG-1SFVC784E with 256K logic cells and Mali-400 MP2 GPU enables real-time image processing pipelines for industrial cameras. The Cortex-A53 dual-core runs Linux stacks (OpenCV, ROS2), while the Cortex-R5 dual-core handles deterministic camera-trigger and lighting-sync logic with sub-microsecond latency, making it ideal for assembly-line defect detection and inspection.
Рекомендуется
Motor Control Drives
The Zynq UltraScale+ MPSoC integrates FPGA fabric for high-rate PWM generation and field-oriented control (FOC) math, while the dual Cortex-R5 cores handle safety-critical encoder feedback loops with deterministic response. The Cortex-A53 runs motion orchestration software, ideal for industrial servo drives and multi-axis robotics controllers requiring low-latency real-time plus Linux-class user interfaces.
Рекомендуется
Edge AI Inference Gateway
The 256K+ logic cells of the XCZU5CG-1SFVC784E host quantized neural-network inference engines (DPU IP) on the PL fabric, while the Cortex-A53 runs TensorFlow Lite / ONNX runtimes for pre/post-processing. The Mali-400 MP2 GPU accelerates visualization layers, enabling smart-camera and IoT-gateway AI inference designs with a single SoC. EG/EV variants would add H.264/H.265 streaming if remote viewing is required.
Рекомендуется
Software Defined Radio (SDR) Front-End
The Zynq UltraScale+ MPSoC's PL fabric delivers high-rate DSP for digital down-conversion and channelization, while the dual ARM Cortex-A53 runs SDR frameworks (GNU Radio, RFNoC). XCZU5CG-1SFVC784E is well suited for small-form-factor SDR front-ends where deterministic performance plus Linux deployment coexist. The 0.85 V core supply and 20 nm CMOS process allow dense signal-processing blocks with reasonable power budgets.
Рекомендуется
Automotive Driver-Assistance ECU
The dual ARM Cortex-R5 cores support ASIL-aware functional safety tasks (ISO 26262) such as sensor fusion and lateral control, while the Cortex-A53 runs vision/object-recognition stacks. The extended-temperature grade (E suffix) and tight PS-PL coupling make XCZU5CG-1SFVC784E attractive for ADAS ECU and surround-view prototypes. Note: for production AEC-Q100 compliance, the automotive XA family (e.g., XAZU5EG) is the preferred choice.
Рекомендуется
Industrial IoT Gateway
The XCZU5CG-1SFVC784E's heterogeneous processing system (Cortex-A53 + Cortex-R5 + PL) is well matched to protocol-conversion gateways: the PL fabric implements real-time industrial bus protocols (PROFINET, EtherCAT), Cortex-R5 handles deterministic buffering, and Cortex-A53 runs the OS/container stack for cloud telemetry. The 0.85 V core supply helps fit dense gateway designs in DIN-rail enclosures; extended-temperature operation supports factory-floor deployment.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для XCZU5CG-1SFVC784E — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | XCZU5CG-2SFVC784E | XCZU5CG-1SFVC784I | XCZU4CG-1SFVC784E | XCZU5EG-1SFVC784E |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | 784-FCBGA (SFVC784) 23x23 mm | 784-FCBGA (SFVC784) - same | 784-FCBGA (SFVC784) - same | 784-FCBGA (SFVC784) - same | 784-FCBGA (SFVC784) - same |
| Speed Grade | -1 | -2 (faster) | -1 | -1 | -1 |
| Temperature Grade | Extended (E) | Extended (E) | Industrial (I) | Extended (E) | Extended (E) |
| Logic Cells | 256K+ | 256K+ | 256K+ | Lower density (ZU4) | 256K+ |
| Video Codec Unit (VCU) | No (CG = cost-grade) | No | No | No | Yes (EG adds H.264/H.265) |
| Application Processor | Dual Cortex-A53 | Dual Cortex-A53 | Dual Cortex-A53 | Dual Cortex-A53 | Dual Cortex-A53 |
| Real-Time Processor | Dual Cortex-R5 | Dual Cortex-R5 | Dual Cortex-R5 | Dual Cortex-R5 | Dual Cortex-R5 |
| Process / Core Voltage | 20 nm / 0.85 V | 20 nm / 0.85 V | 20 nm / 0.85 V | 20 nm / 0.85 V | 20 nm / 0.85 V |
Ключевые отличия
- Cost-optimized CG variant without video codec unit (VCU) (против XCZU5EG-1SFVC784E)
- Pin-compatible with ZU4 family at lower logic density (против XCZU4CG-1SFVC784E)
- -2 speed grade upgrade path with same package (против XCZU5CG-2SFVC784E)
Заметки по проектированию
The 784-FCBGA (SFVC784) relies on a flip-chip heat-spreader lid for thermal dissipation; the package does NOT have an exposed bottom thermal pad. Designers MUST attach a heat-sink or cold-plate via thermal interface material (TIM) to the lid to sustain heavy PL workloads. Estimated: thermal resistance theta_J-topside is approximately 0.4 C/W with a 1 C/W TIM and 30x30 mm aluminum heat-sink in still air, allowing continuous PL utilization at 500 MHz when ambient is kept below 70 C; verify with device IBIS thermal models for production designs.
The 23x23 mm FCBGA has 1.0 mm ball pitch; PCB breakout requires microvia (laser-drilled) stack-ups with 0.1 mm finished hole pitch. Use HDI (high-density interconnect) 2+N+2 stack-up at minimum, follow AMD Zynq UltraScale+ PCB Designer's Guide UG1075 reference stack-up, and match transmission line impedance (100 ohm differential for transceivers, 50 ohm SE for general I/O). Decoupling requires 10+ 0402/0201 caps per voltage rail within 1 mm of the balls.
Do not confuse the CG (no VCU) with the EG/EV parts when designing video pipelines; the CG variant lacks the H.264/H.265 video codec unit (VCU) required for hardware encode/decode. Also, the -1 vs -2 speed grades are NOT interchangeable at the bitstream level — bitstream generation must target the deployed speed grade or timing failure is likely. Finally, ensure the boot-mode pins correctly select QSPI/SD/eMMC before JTAG-less production releases.
Информация о соответствии
RoHS compliant per AMD product page. AEC-Q100 qualification not applicable (consumer/industrial XCK/CG). For AEC-Q100 automotive, choose XAZU family instead.
