XCZU5CG-1SFVC784E - Zynq UltraScale+ MPSoC, 256K Logic Cells | AMD
Référence : XCZU5CG-1SFVC784E ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1514.13 | $1 514,13 |
| 10 | $1450 | $14 500,00 |
| 100 | $1340 | $134 000,00 |
| 500 | $1220 | $610 000,00 |
| 1 000 | $1100 | $1 100 000,00 |
XCZU5CG-1SFVC784E Présentation
A Multi-Processor System-on-Chip (MPSoC) merges hardened ARM cores with programmable FPGA logic, enabling designers to partition deterministic control tasks to the Cortex-R5, high-level application code to the Cortex-A53 running Linux, and custom accelerators into the FPGA fabric. Within the broader taxonomy, the Zynq UltraScale+ MPSoC sits above single-core Cortex-M microcontrollers and below discrete CPU+FPGA board-level designs, providing hardware/software co-design in one silicon device.
Architecturally the CG family omits the video codec unit (VCU) and the high-end Programmable Logic density of the EG/EV variants, but retains the same Memory Protection Unit (XMPU) and DDR4 controller infrastructure. Designers benefit from the integrated GTH/GTY transceivers, AXI4 high-performance interconnects, and tight PS-PL coupling without external bridges.
Typical applications include industrial machine vision, motor control drives, edge AI inference gateways, software-defined radio front-ends, and automotive driver-assistance ECUs where deterministic response and Linux-class processing coexist on one die. Designers should validate DDR4 routing against the Zynq UltraScale+ PCB guidelines (UG1075) and ensure the heat spreader/FCLGA lid is properly attached with a thermal interface material, since the 784-FCBGA package relies on top-side cooling for sustained workloads.
Alternatives de remplacement direct pour XCZU5CG-1SFVC784E — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XCZU5CG-2SFVC784E
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XCZU5CG-1SFVC784I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XCZU4CG-1SFVC784E
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XCZU5EG-1SFVC784E
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XCZU5CG-1FFVC900E
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XCZU5CG-1SFVC784E Valeurs maximales et caractéristiques électriques
| Family | Zynq UltraScale+ MPSoC CG |
| Series | XCZU5CG |
| Speed Grade | -1 |
| Logic Cells | 256K+ |
| Application Processor Unit | Dual-core ARM Cortex-A53 MPCore with CoreSight |
| Real-Time Processor Unit | Dual-core ARM Cortex-R5 with CoreSight |
| Graphics Processor | ARM Mali-400 MP2 |
| Maximum PS Clock Frequency | 1.2 GHz |
| Maximum PL Clock Frequency | 500 MHz |
| Process Technology | 20 nm |
| Core Supply Voltage | 0.85 V |
| Boîtier | 784-FCBGA (SFVC784), 23x23 mm |
| Type de montage | Surface Mount (flip-chip BGA) |
| Statut RoHS | Compliant |
| Temperature Grade | Extended (E) |
Guide de configuration des broches du XCZU5CG-1SFVC784E 784-fcbga (sfvc784), 23x23 mm
Configuration des broches du XCZU5CG-1SFVC784E (boîtier 784-fcbga (sfvc784), 23x23 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XCZU5CG-1SFVC784E.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XCZU5CG-1SFVC784E convient pour 6 applications: Industrial Machine Vision, Motor Control Drives, Edge AI Inference Gateway, Software Defined Radio (SDR) Front-End, Automotive Driver-Assistance ECU, Industrial IoT Gateway.
Industrial Machine Vision
The XCZU5CG-1SFVC784E with 256K logic cells and Mali-400 MP2 GPU enables real-time image processing pipelines for industrial cameras. The Cortex-A53 dual-core runs Linux stacks (OpenCV, ROS2), while the Cortex-R5 dual-core handles deterministic camera-trigger and lighting-sync logic with sub-microsecond latency, making it ideal for assembly-line defect detection and inspection.
Recommandé
Motor Control Drives
The Zynq UltraScale+ MPSoC integrates FPGA fabric for high-rate PWM generation and field-oriented control (FOC) math, while the dual Cortex-R5 cores handle safety-critical encoder feedback loops with deterministic response. The Cortex-A53 runs motion orchestration software, ideal for industrial servo drives and multi-axis robotics controllers requiring low-latency real-time plus Linux-class user interfaces.
Recommandé
Edge AI Inference Gateway
The 256K+ logic cells of the XCZU5CG-1SFVC784E host quantized neural-network inference engines (DPU IP) on the PL fabric, while the Cortex-A53 runs TensorFlow Lite / ONNX runtimes for pre/post-processing. The Mali-400 MP2 GPU accelerates visualization layers, enabling smart-camera and IoT-gateway AI inference designs with a single SoC. EG/EV variants would add H.264/H.265 streaming if remote viewing is required.
Recommandé
Software Defined Radio (SDR) Front-End
The Zynq UltraScale+ MPSoC's PL fabric delivers high-rate DSP for digital down-conversion and channelization, while the dual ARM Cortex-A53 runs SDR frameworks (GNU Radio, RFNoC). XCZU5CG-1SFVC784E is well suited for small-form-factor SDR front-ends where deterministic performance plus Linux deployment coexist. The 0.85 V core supply and 20 nm CMOS process allow dense signal-processing blocks with reasonable power budgets.
Recommandé
Automotive Driver-Assistance ECU
The dual ARM Cortex-R5 cores support ASIL-aware functional safety tasks (ISO 26262) such as sensor fusion and lateral control, while the Cortex-A53 runs vision/object-recognition stacks. The extended-temperature grade (E suffix) and tight PS-PL coupling make XCZU5CG-1SFVC784E attractive for ADAS ECU and surround-view prototypes. Note: for production AEC-Q100 compliance, the automotive XA family (e.g., XAZU5EG) is the preferred choice.
Recommandé
Industrial IoT Gateway
The XCZU5CG-1SFVC784E's heterogeneous processing system (Cortex-A53 + Cortex-R5 + PL) is well matched to protocol-conversion gateways: the PL fabric implements real-time industrial bus protocols (PROFINET, EtherCAT), Cortex-R5 handles deterministic buffering, and Cortex-A53 runs the OS/container stack for cloud telemetry. The 0.85 V core supply helps fit dense gateway designs in DIN-rail enclosures; extended-temperature operation supports factory-floor deployment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XCZU5CG-1SFVC784E — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XCZU5CG-2SFVC784E | XCZU5CG-1SFVC784I | XCZU4CG-1SFVC784E | XCZU5EG-1SFVC784E |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | 784-FCBGA (SFVC784) 23x23 mm | 784-FCBGA (SFVC784) - same | 784-FCBGA (SFVC784) - same | 784-FCBGA (SFVC784) - same | 784-FCBGA (SFVC784) - same |
| Speed Grade | -1 | -2 (faster) | -1 | -1 | -1 |
| Temperature Grade | Extended (E) | Extended (E) | Industrial (I) | Extended (E) | Extended (E) |
| Logic Cells | 256K+ | 256K+ | 256K+ | Lower density (ZU4) | 256K+ |
| Video Codec Unit (VCU) | No (CG = cost-grade) | No | No | No | Yes (EG adds H.264/H.265) |
| Application Processor | Dual Cortex-A53 | Dual Cortex-A53 | Dual Cortex-A53 | Dual Cortex-A53 | Dual Cortex-A53 |
| Real-Time Processor | Dual Cortex-R5 | Dual Cortex-R5 | Dual Cortex-R5 | Dual Cortex-R5 | Dual Cortex-R5 |
| Process / Core Voltage | 20 nm / 0.85 V | 20 nm / 0.85 V | 20 nm / 0.85 V | 20 nm / 0.85 V | 20 nm / 0.85 V |
Principaux différenciateurs
- Cost-optimized CG variant without video codec unit (VCU) (vs XCZU5EG-1SFVC784E)
- Pin-compatible with ZU4 family at lower logic density (vs XCZU4CG-1SFVC784E)
- -2 speed grade upgrade path with same package (vs XCZU5CG-2SFVC784E)
Notes de conception
The 784-FCBGA (SFVC784) relies on a flip-chip heat-spreader lid for thermal dissipation; the package does NOT have an exposed bottom thermal pad. Designers MUST attach a heat-sink or cold-plate via thermal interface material (TIM) to the lid to sustain heavy PL workloads. Estimated: thermal resistance theta_J-topside is approximately 0.4 C/W with a 1 C/W TIM and 30x30 mm aluminum heat-sink in still air, allowing continuous PL utilization at 500 MHz when ambient is kept below 70 C; verify with device IBIS thermal models for production designs.
The 23x23 mm FCBGA has 1.0 mm ball pitch; PCB breakout requires microvia (laser-drilled) stack-ups with 0.1 mm finished hole pitch. Use HDI (high-density interconnect) 2+N+2 stack-up at minimum, follow AMD Zynq UltraScale+ PCB Designer's Guide UG1075 reference stack-up, and match transmission line impedance (100 ohm differential for transceivers, 50 ohm SE for general I/O). Decoupling requires 10+ 0402/0201 caps per voltage rail within 1 mm of the balls.
Do not confuse the CG (no VCU) with the EG/EV parts when designing video pipelines; the CG variant lacks the H.264/H.265 video codec unit (VCU) required for hardware encode/decode. Also, the -1 vs -2 speed grades are NOT interchangeable at the bitstream level — bitstream generation must target the deployed speed grade or timing failure is likely. Finally, ensure the boot-mode pins correctly select QSPI/SD/eMMC before JTAG-less production releases.
Informations de conformité
RoHS compliant per AMD product page. AEC-Q100 qualification not applicable (consumer/industrial XCK/CG). For AEC-Q100 automotive, choose XAZU family instead.
