10AS032E3F29I2LG vs 10AS032E4F27E3LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AS032E3F29I2LG sa pamamagitan ng Intel at 10AS032E4F27E3LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AS032E3F29I2LG | 10AS032E4F27E3LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Family | Arria 10 SX SoC FPGA | — |
| Logic Elements (LE) | 320,000 | — |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | 20 nm | 20 nm |
| Core Voltage | 0.9 V | — |
| Hard Processor Core Frequency | 1.5 GHz | — |
| Packhaging | 780-pin FCBGA (29x29 mm) | — |
| Package Code | F29 (FBGA, FC) | — |
| Transceiver Data Rate | Up to 17.4 Gbps | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | Industrial / Extended |
| DSP Blocks | Yes (variable-precision, floating-point) | — |
| Memory Interfaces | DDR4, DDR3, QDRIV SRAM | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Pitch | [DATA_NEEDED: ball pitch] | — |
| Total I/O Pins | [DATA_NEEDED: I/O count] | — |
| Family | — | Arria 10 SX |
| Logic Elements | — | 320,000 |
| Core Frequency | — | 1.5 GHz |
| Supply Voltage (Core) | — | 0.9 V |
| Package Type | — | 672-FBGA, FC (flip-chip) |
| Package Dimensions | — | 27 x 27 mm |
| Number of Terminals | — | 672 (BGA) |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Configuration Memory | — | SRAM-based (volatile) |