10AS032H4F35I3SG vs 10AS048E2F29E2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AS032H4F35I3SG sa pamamagitan ng Altera at 10AS048E2F29E2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AS048E2F29E2LG - Arria 10 SX SoC FPGA 480K LE | Intel | 780-FBGA
10AS048E2F29E2LG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AS032H4F35I3SG | 10AS048E2F29E2LG |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 SX SoC FPGA | — |
| Logic Elements | 320,000 | 480,000 |
| Adaptive Logic Modules (ALM) | 118,730 | — |
| Embedded Memory (Mbits) | 21.6 | — |
| DSP Blocks | 1,568 | — |
| DSP Format | Variable-precision with hard IEEE 754 single-precision FP | — |
| Transceivers | 24 (up to 17.4 Gbps) | — |
| HPS Processor | Dual ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Speed | 1.5 GHz | — |
| Hard Memory Controller | Yes (DDR3/DDR4, LPDDR2/3) | — |
| PCIe Hard IP | PCIe Gen3 x8 | — |
| Process Node | 20 nm | — |
| Packhaging | 1152-ball Flip-Chip BGA (35x35 mm) | 780-FBGA, FC (29x29 mm) |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Tindminan RoHS | Compliant | Compliant (per manufacturer product page) |
| Device Family | — | Arria 10 SX |
| Process Technology | — | 20 nm |
| Core Voltage | — | 0.9 V |
| HPS Max Clock | — | 1.5 GHz |
| Uri ng Pagpapasok | — | Surface Mount (flip-chip BGA) |
| Bilang ng Pin | — | 780 |
| Package Code | — | BGA, SQUARE |
| Terminal Form | — | BALL |
| Device Type | — | System On Chip (SoC) FPGA |
| Lead-Free | — | Yes |
| Application Grade | — | Medical (per distributor description) |