10AS057K2F35E2LG vs 10AS057K2F35E1HG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AS057K2F35E2LG sa pamamagitan ng Intel at 10AS057K2F35E1HG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AS057K2F35E1HG - Arria 10 SX SoC FPGA, 570K LE, 1152-FBGA | Intel
10AS057K2F35E1HG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AS057K2F35E2LG | 10AS057K2F35E1HG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX |
| Logic Elements | 570,000 | 570,000 |
| Process Node | TSMC 20 nm | — |
| HPS Cores | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Max Frequency | 1.5 GHz | — |
| DSP Blocks | [DATA_NEEDED: 18x19 multiplier count] | — |
| Embedded Memory (M20K) | [DATA_NEEDED: M20K block count and total bits] | — |
| Transceivers | Up to 24 channels, up to 17.4 Gbps | 24 (up to 17.4 Gbps) |
| PCIe Hard IP | Gen3 x4 (rootport/endpoint) | Gen2/Gen3 x8 |
| User I/Os | 396 | — |
| Packhaging | 1152-ball FCBGA, 35 mm x 35 mm, 1.0 mm pitch | 1152-ball FC-BGA (F35), 35x35 mm |
| Speed Grade | E2 (commercial/extended) | — |
| Temperature na Operasyon | -40C to +100C (extended-industrial screening) | — |
| Configuration | SRAM-based, partial reconfiguration, SEU mitigation, ECC | — |
| Memory Interfaces | DDR3/DDR4 with hard PHY (HPS + FPGA) | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory | — | 29.4 Mbits (M20K + MLAB) |
| DSP Blocks (18x19 Multipliers) | — | 1,566 |
| Maximum User I/O Pins | — | [DATA_NEEDED: max user I/O] |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | — | 1.5 GHz |
| Memory Interfaces (FPGA side) | — | DDR4, DDR3, LPDDR3, QDR IV, RLDRAM 3 |
| Memory Interfaces (HPS side) | — | DDR4, DDR3, LPDDR3 |
| Process Technology | — | 20 nm TSMC |
| Operating Temperature Grade | — | Industrial |
| Supply Voltage (Core) | — | [DATA_NEEDED: Vcore] |