10AX090R2F40I2SG vs 10AX090R1F40E1SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX090R2F40I2SG sa pamamagitan ng Intel at 10AX090R1F40E1SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX090R2F40I2SG | 10AX090R1F40E1SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LEs) | 900,000 | — |
| Embedded Memory (bits) | 59,234,304 | — |
| Adaptive Logic Modules (ALMs) | 342,000 | — |
| DSP Blocks | 1,518 | — |
| 18x19 Multipliers | 3,748 | — |
| Transceiver Count | 24 (28.05 Gbps) | — |
| Maximum User I/O | 342 | — |
| Packhaging | 1517-BBGA, FCBGA (40x40 mm) | 1517-BBGA, FCBGA (FineLine BGA) |
| Core Voltage | 0.87 V to 0.98 V | 0.9 V |
| Temperature na Operasyon | -40C to +100C (TJ) | — |
| Temperature Grade | Industrial | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Process Node | TSMC 20 nm | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements | — | 900000 |
| Embedded Memory Bits | — | 59234304 |
| User I/O Count | — | 342 |
| Process Technology | — | 20 nm (TSMC) |
| Number of Pins/Terminals | — | 1517 |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | — | 3 (168 Hours) |
| Packaging | — | Tray |