10AX090R3F40I2LG vs 10AX090R2F40I2SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX090R3F40I2LG sa pamamagitan ng Intel at 10AX090R2F40I2SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX090R3F40I2LG | 10AX090R2F40I2SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 900,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | 342,000 |
| Embedded Block RAM (M20K) | 24.33 Mbit | — |
| MLAB Memory | [DATA_NEEDED: MLAB Kbit] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 1,518 |
| Transceivers | 24 channels | — |
| Max Transceiver Data Rate | 17.4 Gbps | — |
| Hard Processor System | Not integrated (FPGA only) | — |
| PCI Express Hard IP | Gen3 hard IP | — |
| External Memory Interface | DDR4 / DDR3 / QDRIV / RLDRAM3 | — |
| Process Technology | 20 nm | — |
| Packhaging | 1517-BBGA, FCBGA (F40) | 1517-BBGA, FCBGA (40x40 mm) |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40C to +100C (TJ) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LEs) | — | 900,000 |
| Embedded Memory (bits) | — | 59,234,304 |
| 18x19 Multipliers | — | 3,748 |
| Transceiver Count | — | 24 (28.05 Gbps) |
| Maximum User I/O | — | 342 |
| Core Voltage | — | 0.87 V to 0.98 V |
| Temperature Grade | — | Industrial |
| Process Node | — | TSMC 20 nm |