10AX115H2F34E2SG vs 10AX115H2F34E2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115H2F34E2SG sa pamamagitan ng Intel at 10AX115H2F34E2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AX115H2F34E2LG - Arria 10 GX FPGA 1.15M LE 1152-FCBGA | Intel / Altera
10AX115H2F34E2LG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AX115H2F34E2SG | 10AX115H2F34E2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory (M20K blocks) | 2,713 blocks / 68,857,600 bits | — |
| User I/O Pins | 504 | — |
| Transceivers | 24 channels up to 14.1 Gbps | — |
| PCIe Hard IP | Gen3 x4 / Gen2 x8 | — |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore | — |
| DSP Blocks | Hardened IEEE 754 single/double-precision floating-point | — |
| 18x19 Multipliers | 2,150 | — |
| PLLs | Fractional, up to 24 | — |
| Memory Interfaces | DDR4 up to 1,600 Mbps, DDR3, QDRII+, RLDRAM3 | — |
| Packhaging | 1152-ball FCBGA (F34) 35x35 mm | 1152-BBGA, FCBGA |
| Speed/Operating Temperature Grade | -2 / 0 C to 100 C (E2 = industrial, enhanced) | — |
| Process Node | 20 nm Tri-Gate (Intel) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Family | — | Arria 10 |
| Embedded Memory | — | 68,857,856 bits |
| User I/O Count | — | 504 |
| Core Voltage | — | 0.9 V |
| Process Technology | — | 20 nm |
| Number of Terminals | — | 1152 |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Operating Temperature Grade | — | Industrial (E2 = -40C to +100C) |