10AX115N2F45E2SG vs 10AX115N2F40I2SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115N2F45E2SG sa pamamagitan ng Intel at 10AX115N2F40I2SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AX115N2F40I2SG - Arria 10 GX FPGA, 1.15M LEs, 1517-FCBGA | Intel
10AX115N2F40I2SG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AX115N2F45E2SG | 10AX115N2F40I2SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Arria 10 GX | — |
| Logic Elements | 1,150,000 | 1,150,000 |
| Embedded Memory Bits | 68,857,856 | 68,857,856 |
| Embedded Memory Type | M20K SRAM blocks | — |
| DSP Blocks (18x19 Multipliers) | 1,518 | — |
| Maximum User I/Os | 768 | — |
| Transceiver Count | [DATA_NEEDED: transceiver count for -2 speed grade] | [DATA_NEEDED: transceiver count exact value] |
| Maximum Transceiver Data Rate | 17.4 Gbps | — |
| Hard Processor Subsystem | Dual-core ARM Cortex-A9 (optional HPS configuration) | — |
| PCI Express Hard IP | Gen3 x8 (hardened) | — |
| Process Technology | Intel 20nm Tri-Gate (FinFET) | TSMC 20 nm |
| Packhaging | 1932-ball FCBGA, 45mm body (F45) | 1517-ball FCBGA, 40 x 40 mm, 1.0 mm pitch |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (flip-chip BGA) |
| Temperature ng Junction na Operasyon | 0C to +100C (commercial grade) | — |
| Speed Grade | 2 | 2 |
| Tindminan RoHS | Compliant | Compliant |
| Configuration Memory | Internal, supports serial and parallel configuration | — |
| Family | — | Arria 10 GX |
| Adaptive Logic Modules (ALMs) | — | 427,200 |
| Registers | — | 1,708,800 |
| User I/O | — | 600 |
| Transceiver Protocol | — | GX (up to 14.1 Gbps) |
| DSP Blocks | — | Variable-precision, hard floating-point |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |