10AX115N2F45I2LG vs 10AX115N3F40I2LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115N2F45I2LG sa pamamagitan ng Intel at 10AX115N3F40I2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AX115N2F45I2LG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
10AX115N2F45I2LG ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | 10AX115N2F45I2LG | 10AX115N3F40I2LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 LE | 1,150,000 |
| Adaptive Logic Modules (ALMs) | 427,200 | — |
| Embedded Memory (Bits) | 68,857,856 bits | — |
| Embedded Memory (Mbit) | 52.99 Mbit | — |
| Maximum User I/O | 768 | — |
| Packhaging | 1932-ball FCBGA (N2F45) | 1517-ball FCBGA (F40) |
| Process Technology | 20 nm | 20nm TSMC |
| Core Voltage | 0.9 V | — |
| Temperature Grade | Industrial (-40C to +100C case) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Number of Terminals | 1932 | — |
| Terminal Form | Ball | — |
| Package Shape | Square | — |
| Tindminan RoHS | Compliant | Compliant |
| Embedded Memory Bits | — | 68,857,856 |
| User I/O Count | — | 600 |
| Temperature na Operasyon | — | -40C to +100C (industrial) |
| Transceiver Data Rate | — | Up to 17.4 Gbps |
| Transceiver Tile Count | — | [DATA_NEEDED: exact GX tile count] |
| DSP Blocks | — | [DATA_NEEDED: variable-precision DSP count] |
| On-chip Memory | — | 28.05 Mbit |
| Hard Memory Controller | — | Yes (DDR3/DDR4/QDRII+/RLDRAM3) |
| Hard PCIe Gen3 | — | Yes (x1/x2/x4/x8) |
| Hard Processor System | — | Optional dual ARM Cortex-A9 |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | Yes |
| Shipping Media | — | Tray (LG suffix) |