10AX115R3F40E2SG vs 10AX115R4F40E3SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115R3F40E2SG sa pamamagitan ng Intel at 10AX115R4F40E3SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
10AX115R4F40E3SG - Arria 10 GX FPGA, 1.15M LE, F40, 1517-FCBGA | Intel
10AX115R4F40E3SG ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 10AX115R3F40E2SG | 10AX115R4F40E3SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory | 68,857,856 bits (8,557 Kbit) | 68,857,856 bits (66 Mbit) |
| M20K Memory Blocks | 2,738 | — |
| DSP Blocks | 1,518 (variable-precision, hard FP) | 342 |
| Maximum User I/O | 342 | — |
| Transceiver Channels | 24 (up to 14.1 Gbps) | — |
| Hard Memory Controllers | DDR4/DDR3/QDR IV | — |
| Hard PCIe Gen3 IP Cores | 2 | — |
| Process Technology | TSMC 20 nm | 20 nm |
| Speed Grade | -2 | -3 (fastest commercial) |
| Temperature Grade | E2 (0C to +100C) | Extended commercial (E3) |
| Packhaging | 1517-ball FCBGA (F40), 1.0 mm pitch | 1517-pin FC-FBGA (F40) |
| Uri ng Pagpapasok | Surface Mount (Flip-Chip BGA) | Surface Mount (BGA) |
| Configuration Memory | Embedded (no external flash required for typical use) | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements | — | 1,150,000 |
| User I/O Pins | — | 342 |
| Transceivers | — | 24 channels |
| Transceiver Data Rate | — | up to 14.1 Gbps |
| Core Voltage | — | 0.9 V |
| Temperature na Operasyon | — | [DATA_NEEDED: operating temperature range] |
| PCIe Hard IP | — | Gen3 x4/x8 hard IP block |
| Lead-Free | — | Yes |