10AX115U2F45E1SG vs 10AX090U2F45E1SG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10AX115U2F45E1SG sa pamamagitan ng Intel at 10AX090U2F45E1SG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10AX115U2F45E1SG | 10AX090U2F45E1SG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | 900,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | [DATA_NEEDED: ALM count] |
| Embedded Memory (bits) | 68,857,600 | — |
| Embedded Memory (Mbits) | 68.86 Mbit | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: DSP block count] |
| 18x18 Multipliers | 1,518 | — |
| User I/O Pins | 480 | 480 |
| Transceiver Channels | 24 | Up to 24 |
| Max Transceiver Data Rate | 17.4 Gbps (chip-to-chip/backplane) | 17.4 Gbps (chip-to-chip) |
| Hard Memory Controllers | 6 (DDR4/DDR3/QDRII+/RLDRAM3) | — |
| PCIe Hard IP | PCIe Gen3 x8 | — |
| Process Node | TSMC 20 nm | — |
| Core Voltage | 0.9 V | 0.9 V |
| Packhaging | 1932-ball FCBGA, 45 x 45 mm, 1.0 mm pitch | 1932-BBGA, FCBGA |
| Grade | E1 (extended industrial, -40C to +100C) | — |
| Tindminan RoHS | Compliant | — |
| Embedded Memory | — | 59,234,304 bits (~28.05 Mbit) |
| Process Technology | — | 20 nm |
| Package Code | — | F45 (45x45 mm) |
| Operating Temperature Grade | — | Industrial (E1) |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Hard IP | — | PCIe Gen3, memory controllers |